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Infineon Technologies CY8C4147LDSS583XQLA1

Part No.:
CY8C4147LDSS583XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LDSS583XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,536

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Product details

Overview

CY8C4147LDSS583XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It supports CAPSENSE™, LCD segment drive, and five reconfigurable Serial Communication Blocks (SCB) for I²C/SPI/UART/LIN in body control modules.

For engineers reviewing the CY8C4147LDSS583XQLA1 datasheet, CY8C4147LDSS583XQLA1 pinout, CY8C4147LDSS583XQLA1 application, or CY8C4147LDSS583XQLA1 equivalent, key selection considerations include CAN FD timing compliance, Deep Sleep current (2.5 µA), MSC water-tolerance capability, programmable analog opamp modes, and GPIO flexibility across 84 pins in 100-pin TQFP packaging.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core with dedicated peripherals including eight 16-bit TCPWM blocks supporting quadrature decoding and comparator-triggered kill signals, and two continuous-time opamps operable in Deep Sleep mode with ADC input buffering. Its clock system combines ECO (4–33 MHz), PLL (48 MHz), WCO (32 kHz), IMO (±2%), and ILO (40 kHz) sources for deterministic timing across power modes.

The analog subsystem includes a 12-bit 1-Msps SAR ADC with differential/single-ended inputs, channel sequencer, signal averaging, and on-die temperature sensor; the digital subsystem features Smart I/O logic, programmable GPIO drive modes, and hardware-accelerated cryptography (AES, SHA, TRNG, CRC).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - sufficient for AUTOSAR-compliant firmware and sensor fusion stacks
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth vehicle network requirements for ADAS domain controllers
ADC Resolution12-bit SAR, 1-Msps sampling - enables precise battery voltage/current monitoring in BMS applications
Deep Sleep Current2.5 µA digital system current - supports always-on wake-on-touch or wake-on-CAN without external supervisors
GPIO CountUp to 84 programmable pins - allows full integration of CAPSENSE™ buttons, LED drivers, and LIN transceivers on one die
Operating TempGrade-S: –40°C to +105°C - qualified for under-hood automotive environments per AEC-Q100 Rev G

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, SCB I²C/SPI, and LCD segment drive - configurable per pin
P1[0]–P1[7]Port 1 GPIO bankIncludes CAN FD TX/RX (P1[0]/P1[1]), TCPWM capture inputs, and Smart I/O logic routing
VDDIO0–VDDIO7I/O supply railsIndependent 1.71–5.5 V domains per port group - enables mixed-voltage interface with legacy sensors
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V inputs decoupled for noise isolation between MCU logic and precision analog blocks
XRESExternal reset inputActive-low asynchronous reset with internal pull-up - compatible with automotive watchdog ICs and power sequencers

Key Features

FeatureDesign Value
Multi-Sense Converter (MSC)Capacitive sensing block with >5:1 SNR and hardware-based water tolerance - eliminates false triggers in wet cabin environments
SmartSense Auto-TuningOn-the-fly hardware calibration of CAPSENSE™ electrodes - removes manual tuning during production test and field aging
CAN FD BlockDedicated peripheral with bit-rate switching up to 5 Mbps - supports UDS diagnostics and OTA firmware updates over vehicle networks
Programmable AnalogTwo CTB opamps with high-drive external mode and ADC input buffering - enables direct connection to resistive sensors without external opamp stages
Crypto AccelerationHardware AES-128/256, SHA-256, TRNG, and CRC - offloads secure boot and firmware signature verification from CPU

Applications

Body Control Module (BCM)Door Module

Use Scenario: Centralized control of lighting, window lift, mirror adjustment, and door lock actuation in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave protocol, PWM motor control, and CAPSENSE™ touch detection on door panels.

Use Value: Single-chip integration reduces BOM count by eliminating discrete LIN transceivers, opamps, and touch controllers while maintaining AEC-Q100 compliance.

Use Scenario: Localized intelligence for anti-pinch window control, proximity sensing, and ambient light-responsive LED dimming.

IC Role / Device Role / Timing Role: Real-time TCPWM quadrature decoding for motor position feedback and 12-bit ADC monitoring of current sense resistors.

Use Value: On-die opamp buffering and 1-Msps sampling enable closed-loop current control without external signal conditioning circuitry.

Climate Control PanelInstrument Cluster Interface

Use Scenario: Capacitive touch interface for HVAC controls with glove-mode and water-tolerance requirements.

IC Role / Device Role / Timing Role: MSC-based CAPSENSE™ controller with SmartSense auto-tuning and LCD segment drive for segmented display backlighting.

Use Value: Hardware water tolerance and automatic electrode recalibration eliminate field failures due to condensation or spills.

Use Scenario: Secondary microcontroller managing CAN FD communication with main cluster MCU and driving analog gauges via PWM.

IC Role / Device Role / Timing Role: CAN FD node handling UDS diagnostic requests and generating precise 16-bit PWM waveforms for stepper motor gauge drivers.

Use Value: Deterministic 5 Mbps CAN FD timing and dedicated TCPWM blocks ensure jitter-free gauge needle positioning during rapid acceleration events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC560P50L5Power Architecture e200z0h core, 64 MHz, no integrated CAPSENSE™ or MSC blockLacks hardware capacitive sensing; requires external touch controller for HMIPreferred when legacy Power Architecture toolchain and ASIL-B functional safety certification are required
TC375LPDTriCore™ AURIX™ TC3xx, 300 MHz, ASIL-D certified, 6 MB flash, no CAN FDSupports complex safety-critical tasks but lacks integrated capacitive sensing and LCD driveSelected for high-integrity powertrain or braking systems where CAN FD is not needed

Compared with SPC560P50L5 and TC375LPD, CY8C4147LDSS583XQLA1 uniquely combines AEC-Q100 Grade-S qualification, CAN FD, MSC-based CAPSENSE™, and LCD segment drive in a single low-power 48-MHz Cortex-M0+ device-making it optimal for cost-sensitive, space-constrained automotive HMI and body electronics.

Availability

CY8C4147LDSS583XQLA1 is available at Aetrix Electronics and suitable for body control modules, door modules, climate control panels, and instrument cluster interfaces requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4147LDSS583XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4147LDSS583XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics requiring integrated analog sensing, robust communication (CAN FD), and certified reliability under harsh environmental conditions.

FAQ

What is the maximum operating temperature grade for CY8C4147LDSS583XQLA1?

This part is AEC-Q100 Grade-S qualified, rated for continuous operation from –40°C to +105°C ambient temperature. It is not rated for Grade-E (–40°C to +125°C) use. Thermal derating applies above 105°C, and junction temperature must remain below 125°C under all operating conditions per datasheet Section 7.2.

Does CY8C4147LDSS583XQLA1 support CAN FD physical layer compliance?

Yes - the integrated CAN FD block supports bit-rate switching up to 5 Mbps and complies with ISO 11898-1:2015. It includes built-in CRC calculation, bit stuffing, and error confinement logic. External CAN transceiver (e.g., TJA1044T) is required for physical layer interfacing.

Can all 84 GPIOs be used simultaneously for CAPSENSE™ sensing?

No - while any GPIO can be assigned to CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 32 simultaneous sensing channels. Concurrent use of all 84 pins for sensing would require time-multiplexing across multiple scan cycles, reducing effective update rate and SNR.

Is ModusToolbox™ required for development with this MCU?

No - ModusToolbox™ is Infineon's recommended IDE with PDL libraries and configurators, but the device is fully compatible with Arm®-compliant tools including Keil MDK, IAR Embedded Workbench, and GCC-based toolchains. Debugging via SWD is supported using standard J-Link or CMSIS-DAP probes.

CY8C4147LDSS583XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LDSS583XQLA1 FAQ

1.How can I place an order for CY8C4147LDSS583XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147LDSS583XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147LDSS583XQLA1 reliable?

The price and inventory of CY8C4147LDSS583XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDSS583XQLA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LDSS583XQLA1 transactions.

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Once your CY8C4147LDSS583XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDSS583XQLA1?

For technical support, including CY8C4147LDSS583XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDSS583XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDSS583XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDSS583XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDSS583XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDSS583XQLA1?

All CY8C4147LDSS583XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDSS583XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDSS583XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDSS583XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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