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Infineon Technologies CY8C4147LDSS593XQLA1

Part No.:
CY8C4147LDSS593XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LDSS593XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,203

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Product details

Overview

CY8C4147LDSS593XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, door module ECUs, and smart sensor nodes requiring robust capacitive touch and mixed-signal reconfigurability.

For engineers reviewing the CY8C4147LDSS593XQLA1 datasheet, CY8C4147LDSS593XQLA1 pinout, CY8C4147LDSS593XQLA1 application, or CY8C4147LDSS593XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), MSC SNR (>5:1), programmable analog routing, and ModusToolbox™ API support for rapid CAPSENSE™ and TCPWM deployment.

Technical Context

The device implements a single-layer AHB-Lite interconnect between Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and peripherals including five reconfigurable SCBs (I²C/SPI/UART/LIN), eight 16-bit TCPWM blocks with quadrature decode and kill-input triggering, and a dedicated CAN FD controller supporting ISO 11898-1:2015 with bit rates up to 5 Mbps.

Analog subsystem integrates a 12-bit 1-Msps SAR ADC with temperature sensor, two opamps operable in Deep Sleep, two low-power comparators, and a Multi-Sense Converter (MSC) block optimized for high-SNR (>5:1), water-tolerant capacitive sensing with hardware-accelerated SmartSense tuning.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Memory384 KB flash with Read Accelerator + 32 KB SRAM - enables firmware over-the-air updates and dual-bank operation
CAN FDUp to 5 Mbps data rate, ISO 11898-1:2015 compliant - supports high-bandwidth vehicle network diagnostics and actuator control
Capacitive SensingMulti-Sense Converter (MSC) with >5:1 SNR and SmartSense auto-tuning - eliminates manual calibration for wet-environment touch interfaces
Power ModesDeep Sleep at 2.5 µA digital system current with active analog - enables always-on capacitive wake-up in battery-powered modules
GPIOUp to 84 pins, all configurable as CAPSENSE™, analog, or digital I/O with programmable drive strength/slew rate - simplifies PCB routing and function reuse
Clock SourcesECO (4–33 MHz), WCO (32 kHz), IMO (±2%), ILO (40 kHz), PLL - provides flexible timing architecture for ASIL-B timing-critical functions

Pinout & Package

CY8C4147LDSS593XQLA1 is packaged in a 64-pin TQFP (10 mm × 10 mm, 0.5 mm pitch) with wettable flank capability for automated optical inspection (AOI) and solder joint reliability in automotive assembly.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O power supply domainsIndependent 1.71–5.5 V supplies per port group enable mixed-voltage interface design (e.g., 3.3 V CAN transceiver + 5 V display driver)
P0[0]–P7[7]Programmable GPIOAll pins support CAPSENSE™, analog input, digital logic, or LCD segment drive - no fixed-function pin constraints
CAN_TX / CAN_RXCAN FD physical layer interfaceDedicated differential pair with internal termination and slew-rate control - meets ISO 11898-2 EMC requirements without external components
SWDCLK / SWDIOARM Serial Wire Debug interface2-pin debug port supporting full-speed programming, trace, and real-time variable monitoring during development and field diagnostics
XRESExternal reset inputActive-low asynchronous reset with glitch filter - ensures deterministic startup after power brownout or ESD event

Key Features

FeatureDesign Value
Hardware Cryptography AcceleratorAES-128/256, SHA-1/256, TRNG, CRC - enables secure boot, firmware authentication, and encrypted CAN FD message payloads
Programmable Analog BlocksTwo CTBm opamps + two LP comparators, all operational in Deep Sleep - allows continuous analog monitoring (e.g., battery voltage, temp) with sub-µA quiescent current
Smart I/O LogicBoolean combinational logic on GPIO inputs/outputs - implements debounce, edge detection, or state machines without CPU intervention
ModusToolbox™ PDL SupportPeripheral Driver Library APIs for MSC, TCPWM, SCB, and Crypto - reduces CAPSENSE™ tuning time from days to minutes via GUI-based configuration
LCD Segment DriveDirect drive of up to 32 segments using GPIO pins - eliminates external LCD driver IC in cost-sensitive instrument cluster applications

Applications

Body Control Module (BCM)Door Module ECU

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting with touch-sensitive controls.

IC Role / Device Role / Timing Role: Main MCU executing ASIL-B safety functions, managing CAN FD communication with gateway, and running CAPSENSE™ for waterproof door handle touch detection.

Use Value: Eliminates mechanical switches and external touch controllers; MSC's >5:1 SNR ensures reliable operation under rain or condensation.

Use Scenario: Integrated door electronics handling window lift, anti-pinch, mirror fold/unfold, and proximity-based unlock.

IC Role / Device Role / Timing Role: Real-time motor control via TCPWM kill-input triggering and CAN FD status reporting; Deep Sleep mode enables ultra-low-power occupancy sensing.

Use Value: 2.5 µA Deep Sleep current extends battery life during vehicle park mode; programmable analog monitors motor current for stall detection.

Smart Rearview MirrorAutomotive HVAC Panel

Use Scenario: Auto-dimming mirror with ambient light sensing, glare detection, and touch-adjustable settings.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog light sensor data, digital touch input, and LIN slave communication to main body ECU.

Use Value: Single-chip integration replaces discrete ADC + microcontroller + touch controller; SmartSense auto-calibrates CAPSENSE™ across temperature drift.

Use Scenario: Climate control panel with capacitive slider, rotary encoder emulation, and display backlight management.

IC Role / Device Role / Timing Role: CAPSENSE™ MSC processes multi-touch gestures; LCD segment drive powers segmented display; SCB operates as I²C master to fan controller IC.

Use Value: Hardware-accelerated gesture decoding offloads CPU; 32-segment LCD drive removes need for external display driver.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core, 112 MHz, includes Ethernet MAC and FlexCAN with FD; lacks integrated CAPSENSE™ and programmable analogBetter suited for gateway or ADAS domain controllers requiring higher compute and networking; not optimized for capacitive HMISelect when CAN FD coexists with Ethernet or safety ASIL-D requirements; avoid if CAPSENSE™ integration and analog flexibility are primary needs
Renesas RL78/F1416-bit RL78 core, 32 MHz, AEC-Q100 Grade-2, integrated LCD controller and touch sense; no CAN FD, limited crypto accelerationCost-optimized for basic HVAC or lighting panels where CAN FD and security are not requiredChoose for non-networked, low-compute automotive panels with strict BOM cost targets; insufficient for CAN FD body networks

Compared with S32K144W and RL78/F14, CY8C4147LDSS593XQLA1 uniquely combines CAN FD, hardware CAPSENSE™ tuning, and programmable analog/digital fabric in a single AEC-Q100 Grade-S package-enabling consolidated HMI + control functionality without external ASICs or companion chips.

Availability

CY8C4147LDSS593XQLA1 is available at Aetrix Electronics and suitable for body control modules, door ECUs, smart rearview mirrors, and HVAC panels requiring stable component supply, automotive qualification, and long-term lifecycle support.

Supply support for CY8C4147LDSS593XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global manufacturing and automotive qualification infrastructure.

CY8C4147LDSS593XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics requiring reconfigurable mixed-signal capability, functional safety readiness, and seamless integration of capacitive HMI with CAN FD networking.

FAQ

What is the maximum operating temperature range for CY8C4147LDSS593XQLA1?

CY8C4147LDSS593XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. This rating is verified per test condition 2.1.1 of AEC-Q100 Rev-H and applies to all integrated peripherals including CAN FD, MSC, and TCPWM blocks under full load conditions.

Does CY8C4147LDSS593XQLA1 support hardware-based secure boot?

Yes. The device includes a dedicated cryptography accelerator supporting AES-128/256 encryption/decryption, SHA-256 hashing, and a true random number generator (TRNG). These features enable secure boot verification, encrypted firmware updates, and runtime key generation compliant with ISO/SAE 21434 cybersecurity requirements.

Can all GPIO pins be used for CAPSENSE™ sensing simultaneously?

No. While any GPIO pin can be configured for CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 32 simultaneous sensing channels. Pin allocation is constrained by MSC routing resources and mutual capacitance crosstalk limits-not by pin count alone-and requires layout-aware channel grouping per the PSoC™ Creator or ModusToolbox™ MSC configuration tool.

Is external crystal required for CAN FD operation?

No. CAN FD bit timing accuracy is maintained using the internal 48 MHz PLL clock derived from the ±2% IMO, eliminating need for external crystal in standard implementations. However, for applications requiring <±0.5% bit rate tolerance (e.g., high-speed diagnostic sessions), an external 24 MHz crystal with ECO and PLL is recommended per section 4.2.6 of the datasheet.

CY8C4147LDSS593XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LDSS593XQLA1 FAQ

1.How can I place an order for CY8C4147LDSS593XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147LDSS593XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4147LDSS593XQLA1 reliable?

The price and inventory of CY8C4147LDSS593XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LDSS593XQLA1 is usually 5 days.

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CY8C4147LDSS593XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4147LDSS593XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LDSS593XQLA1?

For technical support, including CY8C4147LDSS593XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LDSS593XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LDSS593XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LDSS593XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LDSS593XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LDSS593XQLA1?

All CY8C4147LDSS593XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LDSS593XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LDSS593XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LDSS593XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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