Infineon Technologies CY8C4147LQE-S273T
- Part No.:
- CY8C4147LQE-S273T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 40-UFQFN Exposed Pad
- Datasheet:
-
CY8C4147LQE-S273T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 40QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,429
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4147LQE-S273T from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Plus microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 128 KB flash, 16 KB SRAM, and integrated CAPSENSE™ capacitive sensing with SmartSense auto-tuning. It integrates programmable analog (2 opamps, 12-bit 1-Msps SAR ADC, 2 IDACs), digital logic (TCPWM, SCB, CAN 2.0B), and GPIO flexibility for embedded control in vehicle interior HMI systems.
For engineers reviewing the CY8C4147LQE-S273T datasheet, CY8C4147LQE-S273T pinout, CY8C4147LQE-S273T application, or CY8C4147LQE-S273T equivalent, key selection criteria include AEC-Q100 Grade-S qualification, on-chip CAPSENSE™ SNR >5:1 with water tolerance, CAN 2.0B + TTCAN support, Deep Sleep current of 2.5 µA, and reconfigurable SCB blocks for I²C/SPI/UART/LIN.
Technical Context
This device implements a mixed-signal SoC architecture where the Arm® Cortex®-M0+ core coordinates programmable analog (CTB, SAR ADC, IDACs) and digital (TCPWM, SCB, CAN) resources via a flexible interconnect fabric. Its clock system includes ECO (4–33 MHz), PLL (48 MHz), WCO (32 kHz), IMO (±2%), and ILO for precise timing across operating modes.
The CAPSENSE™ subsystem uses capacitive sigma-delta (CSD) modulation with hardware-accelerated SmartSense tuning, enabling robust touch detection under wet conditions. The CAN block supports time-triggered communication (TTCAN) with message filtering and error handling compliant with ISO 11898-1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash / SRAM | 128 KB flash with Read Accelerator / 16 KB SRAM - supports firmware updates and runtime data buffering without external memory. |
| ADC | 12-bit SAR, 1-Msps, differential/single-ended - provides high-resolution sensor signal acquisition with channel sequencer and averaging. |
| CAPSENSE™ | Capacitive sigma-delta (CSD) with SNR >5:1 and water tolerance - delivers reliable touch button/slider detection in automotive cabin environments. |
| CAN Interface | CAN 2.0B with TTCAN support - enables time-synchronized messaging for body control modules and gateway applications. |
| Power Range | 1.71 V to 5.5 V, Deep Sleep current = 2.5 µA - allows direct battery operation (12 V with LDO) and ultra-low-power wake-on-touch capability. |
| GPIO Count | Up to 54 pins, all configurable as CAPSENSE™, analog, or digital - eliminates need for external level shifters or dedicated touch controllers. |
Pinout & Package
Package: 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power supply domains | Independent 1.71–5.5 V supplies per port group enable mixed-voltage interfacing (e.g., 3.3 V MCU logic + 5 V analog sensors). |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO | Each pin supports CAPSENSE™, analog input/output, digital logic, or serial interface functions - configured at runtime via PDL or ModusToolbox™. |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Connects to 4–33 MHz crystal for precise clock source; required for CAN timing accuracy and ECU synchronization. |
| CAN_TX / CAN_RX | Dedicated CAN transceiver interface | Direct connection to external CAN PHY (e.g., TJA1042); supports dominant/recessive bit transmission and bus fault detection. |
| WCO_IN / WCO_OUT | 32-kHz watch crystal oscillator | Provides low-power RTC timing during Deep Sleep mode; maintains calendar time without waking CPU. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense Auto-Tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual threshold adjustment and ensures stable operation across temperature/humidity drift. |
| Reconfigurable SCBs | Five serial communication blocks dynamically switch between I²C, SPI, UART, or LIN slave modes - reduces BOM count by consolidating protocol interfaces. |
| Deep Sleep Analog Operation | Opamps and comparators remain active in Deep Sleep at 2.5 µA system current - enables continuous capacitive wake-up sensing without full MCU wake. |
| TTCAN Support | Time-triggered CAN scheduling with guaranteed message latency - meets ASAM MCD-2 MC timing requirements for distributed automotive control. |
| Programmable Drive Strength | GPIO output drive configurable from 2 mA to 25 mA per pin - supports direct LED driving or relay coil control without external drivers. |
Applications
| Automotive Door Module | Vehicle Infotainment Touch Panel |
|---|---|
Use Scenario: Control of window lift, mirror fold, and lock actuation via capacitive touch buttons on door trim. IC Role / Device Role / Timing Role: Primary MCU executing motor control PWM, CAPSENSE™ scan, and LIN slave communication to body controller. Use Value: Single-chip integration replaces discrete touch controller + 8-bit MCU + LIN transceiver, reducing PCB area by 35% and qualifying AEC-Q100 Grade-S for under-hood proximity. | Use Scenario: Multi-touch slider and gesture recognition on center console display overlay. IC Role / Device Role / Timing Role: CAPSENSE™ CSD engine with SmartSense performs real-time SNR optimization and wet-finger rejection while CPU handles UI state machine. Use Value: >5:1 SNR and automatic recalibration maintain touch responsiveness in condensation-prone cabin environments without firmware intervention. |
| Body Control Unit (BCU) | Electronic Parking Brake (EPB) Interface |
Use Scenario: Centralized lighting, wiper, and horn control with CAN network coordination. IC Role / Device Role / Timing Role: CAN 2.0B node managing message arbitration, filtering, and TTCAN-scheduled diagnostics reporting. Use Value: Hardware-based TTCAN scheduler ensures <50 µs jitter on safety-critical status messages, meeting ISO 26262 ASIL-B timing constraints. | Use Scenario: Interfacing parking brake switch signals and motor driver enable lines with fail-safe monitoring. IC Role / Device Role / Timing Role: Dual-redundant GPIO inputs with configurable slew rate and internal pull-ups monitor mechanical switch states; TCPWM generates controlled brake release timing. Use Value: Programmable drive strength and slew control prevent EMI-induced false triggers during high-current motor commutation events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core, 112 MHz, 1 MB flash, no integrated CAPSENSE™, requires external touch controller | Better floating-point performance for motor control algorithms; lacks on-die capacitive sensing | Select when advanced math-intensive control (e.g., field-oriented motor control) outweighs touch integration needs. |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz, 512 KB flash, built-in touch voltage detection (not sigma-delta), no CAN FD or TTCAN | Lower cost for basic touch + CAN applications; limited SNR (<3:1) and no wet-finger tolerance | Select for cost-sensitive non-safety-critical interior switches where AEC-Q100 Grade-A suffices. |
Compared with S32K144W and RL78/F14, CY8C4147LQE-S273T uniquely combines AEC-Q100 Grade-S qualification, hardware-accelerated CAPSENSE™ with >5:1 SNR, and TTCAN in a single 48-pin QFN - optimizing BOM count and layout for space-constrained automotive HMI nodes.
Availability
CY8C4147LQE-S273T is available at Aetrix Electronics and suitable for automotive door modules, infotainment touch panels, body control units, and electronic parking brake interfaces requiring stable component supply and long-term lifecycle assurance.
Supply support for CY8C4147LQE-S273T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
CY8C4147LQE-S273T belongs to the PSoC™ 4100S Plus product line, designed specifically for automotive interior human-machine interface applications requiring integrated capacitive sensing, functional safety-ready peripherals, and AEC-Q100 compliance.
FAQ
Does CY8C4147LQE-S273T support CAN FD?
No. This device implements CAN 2.0B with time-triggered extensions (TTCAN) but does not support CAN FD frame format or higher bit rates. It complies with ISO 11898-1 for classical CAN operation up to 1 Mbps, sufficient for body electronics and comfort systems where FD bandwidth is unnecessary.
What development tools are officially supported for this part?
Infineon officially supports ModusToolbox™ (v3.1+) and legacy PSoC™ Creator v4.4 for firmware development. Hardware debugging requires MiniProg3 or KitProg3 programmers. The CY8CKIT-149 prototyping kit provides validated hardware reference design, pin headers, and onboard CAPSENSE™ electrodes for rapid evaluation.
Is the 12-bit SAR ADC capable of simultaneous sampling?
No. The SAR ADC has a single conversion core with a channel sequencer supporting up to 32-channel scanning and hardware-averaging (2–64 samples), but it does not provide true simultaneous sampling across multiple channels. For synchronized multi-sensor acquisition, external sample-and-hold circuits or external ADCs are required.
How is CAPSENSE™ calibrated in production?
SmartSense auto-tuning runs automatically at startup and periodically during operation using on-chip IDACs and CTB resources. Calibration parameters (baseline, noise threshold, finger threshold) are stored in flash and adjusted dynamically based on environmental drift - no factory calibration fixtures or manual tuning required for automotive-grade deployment.
CY8C4147LQE-S273T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 40-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S Plus
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 24MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x10b, 20x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LQE-S273T FAQ
1.How can I place an order for CY8C4147LQE-S273T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LQE-S273T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LQE-S273T reliable?
The price and inventory of CY8C4147LQE-S273T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LQE-S273T is usually 5 days.
3.What payment methods are accepted for CY8C4147LQE-S273T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LQE-S273T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4147LQE-S273T?
CY8C4147LQE-S273T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LQE-S273T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LQE-S273T?
For technical support, including CY8C4147LQE-S273T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LQE-S273T requirements.
6.How does Aetrix verify that CY8C4147LQE-S273T is sourced from the original manufacturer or authorized distributors?
All CY8C4147LQE-S273T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LQE-S273T meets industry standards.
7.What is the process for return or replacement of CY8C4147LQE-S273T?
All CY8C4147LQE-S273T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LQE-S273T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LQE-S273T part is unused and in its original packaging.
Return procedure for CY8C4147LQE-S273T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4147LQE-S273T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

