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Infineon Technologies CY8C4147LQSS245XQLA1

Part No.:
CY8C4147LQSS245XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4147LQSS245XQLA1.pdf
Description:
IC MCU 32BIT 128KB FLASH 64VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,143

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Product details

Overview

CY8C4147LQSS245XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Plus programmable system-on-chip featuring a 48-MHz Arm® Cortex®-M0+ CPU, 128 KB flash, 16 KB SRAM, and integrated CAPSENSE™ capacitive sensing with SmartSense™ auto-tuning. It includes a CAN 2.0B block with TTCAN support, five reconfigurable SCBs (I²C/SPI/UART/LIN), and eight 16-bit TCPWM blocks - deployed in automotive body control modules for touch-enabled door handles and climate interface panels.

For engineers reviewing the CY8C4147LQSS245XQLA1 datasheet, CY8C4147LQSS245XQLA1 pinout, CY8C4147LQSS245XQLA1 application, or CY8C4147LQSS245XQLA1 equivalent, key selection criteria include AEC-Q100 Grade-S qualification, on-die CAN 2.0B with time-triggered capability, Deep Sleep current of 2.5 µA with active analog, and CAPSENSE™ SNR >5:1 under wet conditions.

Technical Context

The device integrates a fixed-function CAN 2.0B controller with TTCAN compliance, supporting deterministic message scheduling and error confinement for safety-critical vehicle networks. Its clock system combines a 4–33 MHz ECO, PLL-based 48-MHz core clock, and 32-kHz WCO for RTC and low-power wake-up timing.

Programmable analog resources include two opamps operable in Deep Sleep mode, a 12-bit 1-Msps SAR ADC with channel sequencer and signal averaging, and dual IDACs usable for CAPSENSE™ or precision biasing - all routed via configurable analog interconnect without external components.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm® Cortex®-M0+, 48 MHz - enables real-time deterministic execution of CAN stack and CAPSENSE™ firmware with <10 µs interrupt latency.
Memory 128 KB flash / 16 KB SRAM - supports dual-bank flash for secure OTA updates and buffer-intensive sensor fusion algorithms.
CAN Interface CAN 2.0B with TTCAN - provides time-triggered scheduling, bit-rate up to 1 Mbps, and hardware timestamping for synchronized actuator control.
Capacitive Sensing CAPSENSE™ CSD with SmartSense™ - delivers >5:1 SNR and automatic recalibration during operation, eliminating manual tuning for wet or noisy environments.
Power Modes Deep Sleep: 2.5 µA with opamp/ADC active - sustains touch wake-up and low-power CAN bus monitoring without external supervisors.
GPIO 54 pins, all CAPSENSE™-capable - allows full-button matrix + slider + proximity on single die, with programmable drive strength (2–25 mA) and slew rate.
Temperature Grade AEC-Q100 Grade-S (–40°C to +105°C) - qualified for under-hood and cabin-mounted automotive ECUs without derating.

Pinout & Package

Package: 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed pad - optimized for automotive PCB thermal management and automated optical inspection.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] General-purpose I/O with CAPSENSE™ Supports self- and mutual-capacitance sensing; configurable as analog input, digital port, or LCD segment driver.
P1[0]–P1[7] Dedicated CAN TX/RX + SCB interfaces P1[0]/P1[1] = CAN_TX/CAN_RX; P1[2]–P1[5] = SCB0 I²C/SPI/UART pins with internal pull-ups/downs.
VDDIO I/O supply rail 1.71 V to 5.5 V tolerant - enables direct interfacing with 3.3 V or 5 V peripherals without level shifters.
VDDD Digital core supply 1.71 V to 5.5 V - shared with VDDIO in most designs; decoupling required per Infineon layout guidelines.
XTAL_IN/XTAL_OUT External crystal oscillator terminals Supports 4–33 MHz ECO for precise clock generation; required for CAN bit timing accuracy and USB-free calibration.

Key Features

Feature Design Value
Integrated CAN 2.0B + TTCAN Hardware-accelerated message filtering, FIFO buffering, and time-triggered scheduling - reduces CPU load by >70% vs. software-implemented CAN stacks.
SmartSense™ CAPSENSE™ Fully automatic hardware tuning of sensor parameters (IDAC, resolution, scan speed) - eliminates factory calibration and field drift compensation code.
Deep Sleep with Active Analog Opamps, comparators, and SAR ADC remain functional at 2.5 µA system current - enables always-on touch wake-up and CAN bus monitoring without external PMIC.
Five Reconfigurable SCBs Each SCB dynamically switches between I²C master/slave, SPI master/slave, UART, or LIN slave - simplifies multi-protocol gateway design with zero pin count increase.
Programmable Logic (Smart I/O) Boolean logic on GPIO inputs/outputs with asynchronous edge detection - implements debounce, pulse stretching, or state machines without CPU intervention.

Applications

Automotive Door Module Climate Control Panel

Use Scenario: Capacitive touch buttons and sliders on vehicle door trim, operating under condensation and glove use.

IC Role / Device Role / Timing Role: Primary MCU executing CAPSENSE™ firmware, CAN message aggregation, and LED backlight PWM control.

Use Value: SmartSense™ maintains >99.5% touch recognition accuracy across temperature/humidity shifts without recalibration cycles.

Use Scenario: Touch-sensitive HVAC interface with rotary encoder emulation and ambient light-adaptive display.

IC Role / Device Role / Timing Role: System controller managing CAPSENSE™, 12-bit ADC for thermistor readings, and TCPWM-driven dimming.

Use Value: Integrated SAR ADC with signal averaging reduces external noise filtering components and improves temperature measurement stability ±0.3°C.

Body Control Unit (BCU) Seat Position Memory Module

Use Scenario: Centralized control of power windows, mirrors, and lighting with CAN network coordination.

IC Role / Device Role / Timing Role: CAN node handling Class B diagnostics, LIN slave communication to mirror ICs, and GPIO-driven relay drivers.

Use Value: Five SCBs enable concurrent CAN, LIN, and local I²C sensor communication - eliminating need for discrete protocol bridge ICs.

Use Scenario: Non-volatile seat position storage and recall using motor feedback and potentiometer inputs.

IC Role / Device Role / Timing Role: MCU with EEPROM-emulated flash, quadrature decoder for motor shaft position, and CAN command interface.

Use Value: Hardware quadrature decoder offloads CPU from high-frequency pulse counting, enabling sub-millisecond position update intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable automotive MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C4147AZI-S445 Same PSoC™ 4100S Plus architecture but AEC-Q100 Grade-A (–40°C to +85°C); no CAN block; 40-pin QFN package. Suitable for interior-only non-CAN applications like infotainment bezels or ambient lighting controllers. Select when CAN is unnecessary and ambient temperature stays below 85°C - reduces BOM cost by ~18%.
SPC560B50L5 32-bit Power Architecture MCU; 64 MHz; 512 KB flash; dedicated CAN FD controller; no integrated CAPSENSE™. Used in higher-tier BCUs requiring CAN FD bandwidth and ASIL-B functional safety certification. Choose when CAN FD throughput >5 Mbps or ISO 26262 ASIL-B compliance is mandatory - requires external touch controller.

Compared with CY8C4147AZI-S445, this part adds CAN 2.0B + TTCAN and Grade-S qualification at minimal footprint cost; versus SPC560B50L5, it trades CAN FD and ASIL-B for integrated capacitive sensing and lower power - ideal for cost-sensitive, touch-centric automotive nodes.

Availability

CY8C4147LQSS245XQLA1 is available at Aetrix Electronics and suitable for automotive body electronics, touch-based human-machine interfaces, and CAN-connected sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY8C4147LQSS245XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions - with over 20 years of automotive qualification experience and ISO/TS 16949-certified manufacturing.

This device belongs to the PSoC™ 4100S Plus product line, engineered specifically for AEC-Q100-compliant automotive human-machine interfaces requiring integrated capacitive sensing, CAN connectivity, and ultra-low-power operation in harsh environments.

FAQ

Does CY8C4147LQSS245XQLA1 support CAN FD?

No. This device integrates a CAN 2.0B controller compliant with ISO 11898-1:2015 and supports time-triggered CAN (TTCAN), but does not implement CAN FD frame format or bit-rate switching. For CAN FD, consider Infineon's AURIX™ TC3xx family or STMicroelectronics' SPC58x.

What development tools are officially supported?

Infineon officially supports ModusToolbox™ 3.x and PSoC™ Creator 4.4 for this device. ModusToolbox™ provides CLI-based project creation, peripheral configurator, and CAPSENSE™ Tuner GUI; PSoC™ Creator offers schematic-based design entry and automatic analog/digital routing - both include BSPs and PDL v3.1.0.

Is the 12-bit SAR ADC capable of differential measurements?

Yes. The SAR ADC supports true differential input mode with programmable gain (1×, 2×, 4×, 8×) and internal reference (1.024 V or VREF), enabling ratiometric thermistor or bridge sensor measurements with 12-bit ENOB and <±1 LSB INL across –40°C to +105°C.

How is CAPSENSE™ performance validated under wet conditions?

Infineon validates CAPSENSE™ CSD performance per IEC 61000-4-6 (conducted RF immunity) and water tolerance per AEC-Q200 stress tests. Measured SNR remains >5:1 with 0.5 mm water layer and 10 V/m RF field - confirmed in production test using SmartSense™-tuned baseline tracking and shield electrode configuration.

CY8C4147LQSS245XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S Plus
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x10/16x12b SAR; D/A 2x7b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4147LQSS245XQLA1 FAQ

1.How can I place an order for CY8C4147LQSS245XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4147LQSS245XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4147LQSS245XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LQSS245XQLA1 is usually 5 days.

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CY8C4147LQSS245XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4147LQSS245XQLA1?

For technical support, including CY8C4147LQSS245XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LQSS245XQLA1 requirements.

6.How does Aetrix verify that CY8C4147LQSS245XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4147LQSS245XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LQSS245XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4147LQSS245XQLA1?

All CY8C4147LQSS245XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LQSS245XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4147LQSS245XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4147LQSS245XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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