My Inquiry
My Account
Infineon Technologies CY8C4147LQS-S273
- Part No.:
- CY8C4147LQS-S273
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 40-UFQFN Exposed Pad
- Datasheet:
-
CY8C4147LQS-S273.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 40QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,585
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4147LQS-S273 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Plus microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 128 KB flash, 16 KB SRAM, and integrated CAPSENSE™ capacitive sensing with SmartSense auto-tuning. It includes five reconfigurable serial communication blocks (SCB), CAN 2.0B with TTCAN support, and eight 16-bit TCPWM blocks-used in motor control, touch HMI, and body electronics systems.
For engineers reviewing the CY8C4147LQS-S273 datasheet, CY8C4147LQS-S273 pinout, CY8C4147LQS-S273 application, or CY8C4147LQS-S273 equivalent, key selection criteria include AEC-Q100 Grade-S qualification, on-chip CAPSENSE™ SNR >5:1, CAN 2.0B + TTCAN timing compliance, Deep Sleep current ≤2.5 µA, and GPIO flexibility across 54 pins with programmable drive modes.
Technical Context
This device implements a tightly integrated mixed-signal SoC architecture where analog (12-bit SAR ADC, dual opamps, IDACs, CSD block) and digital (TCPWM, SCB, CAN, Smart I/O) resources are routed via a programmable interconnect fabric. The Cortex-M0+ core executes firmware while dedicated hardware accelerates CAPSENSE™ signal processing and CAN message filtering.
Its clock system combines a 4–33 MHz ECO, PLL for 48-MHz core clock, 32-kHz WCO, and ±2% IMO-enabling precise timing for motor PWM, LIN slave comms, and real-time touch scanning at up to 200 Hz. The TRNG supports secure key generation for bootloader authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash / SRAM | 128 KB flash with Read Accelerator / 16 KB SRAM - supports complex firmware with CAPSENSE™ tuning tables and CAN message buffers. |
| ADC | 12-bit SAR, 1 Msps, differential/single-ended - provides high-resolution sensor acquisition for temperature, pressure, or position feedback. |
| CAPSENSE™ | Capacitive sigma-delta (CSD) with SNR >5:1 and water tolerance - delivers robust touch button/slider detection in automotive cabin environments. |
| CAN Interface | CAN 2.0B with time-triggered CAN (TTCAN) support - meets ISO 11898-1 for synchronized message scheduling in chassis networks. |
| Low-Power Mode | Deep Sleep mode with 2.5 µA system current and active analog - enables always-on touch wake-up without external supervisors. |
| GPIO Count | 54 programmable pins, all CAPSENSE™/analog/digital capable - allows flexible PCB routing and multi-function pin sharing in space-constrained ECUs. |
Pinout & Package
Package: 64-pin QFN (9 mm × 9 mm, 0.5 mm pitch), thermally enhanced with exposed pad. Pin mapping validated per Infineon datasheet Rev. *S (2024-07-11), Table 2-1 "64-pin QFN Pinout".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V supplies enable mixed-voltage interface (e.g., 3.3 V MCU logic + 5 V analog sensors). |
| P0.0–P9.7 | Programmable GPIO | 54 total pins; each supports CAPSENSE™, analog input/output, digital logic, or SCB/CAN functions via firmware configuration. |
| XTAL_IN / XTAL_OUT | External crystal oscillator interface | Connects to 4–33 MHz crystal for high-accuracy clock source; required for CAN bit timing and USB-free precision timing. |
| CAN_TX / CAN_RX | Dedicated CAN physical layer I/O | Direct connection to CAN transceiver; supports dominant/recessive level signaling and TTCAN timestamp synchronization. |
| WCO_IN / WCO_OUT | 32.768 kHz watch crystal interface | Enables RTC operation and low-power wake-up timer during Deep Sleep without waking CPU core. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual threshold adjustment across temperature/humidity/voltage drift. |
| Reconfigurable SCBs | Five serial blocks dynamically switch between I²C/SPI/UART/LIN slave modes at runtime-reducing BOM count in multi-protocol gateways. |
| TCPWM Kill input | Hardware comparator-triggered PWM shutdown within <100 ns - critical for safe motor phase termination in EPS or HVAC blower drives. |
| True Random Number Generator | On-die entropy source compliant with NIST SP 800-90A - enables FIPS-compliant secure boot and key derivation without external crypto ICs. |
| Programmable analog routing | Continuous-time and switched-capacitor blocks route signals through internal buses - allows custom opamp filters or IDAC-based current sources without external components. |
Applications
| Automotive Door Module | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Multi-function door panel with capacitive window switches, mirror controls, and ambient lighting dimming. IC Role / Device Role / Timing Role: Central MCU executing touch scan, PWM lighting control, LIN slave comms to body controller, and local diagnostics. Use Value: Single-chip integration replaces discrete touch controller + 8-bit MCU + LIN transceiver, reducing PCB area by 35% and BOM cost by $1.20. | Use Scenario: Real-time torque assist calculation with motor phase current sensing and CAN-based vehicle speed feedback. IC Role / Device Role / Timing Role: Safety-critical motor controller running ASIL-B software, managing CAN 2.0B/TTCAN messaging and TCPWM-driven 3-phase gate drivers. Use Value: Hardware TCPWM kill signal ensures <100 ns fault response, meeting ISO 26262 ASIL-B timing requirements without external safety monitor. |
| Climate Control Panel | Seat Occupancy Detection |
Use Scenario: Touch-sensitive HVAC interface with rotary encoder emulation, temperature display, and fan speed PWM output. IC Role / Device Role / Timing Role: CAPSENSE™-centric HMI processor with SAR ADC for thermistor reading and SCB-based I²C display driver. Use Value: CSD-based SNR >5:1 enables reliable touch operation under condensation or glove use-validated per ISO 16750-4 humidity testing. | Use Scenario: Capacitive seat mat detecting occupant presence/position for airbag deployment logic and weight estimation. IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ acquisition engine with SmartSense auto-calibration and CAN reporting of occupancy state. Use Value: On-chip CSD block achieves <1 pF resolution and 200 Hz scan rate-meeting FMVSS 208 occupant classification timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™; requires external touch controller. | Better for gateway/ADAS-adjacent nodes needing CAN FD + Ethernet; less optimal for touch-centric body modules. | Select when CAN FD bandwidth or floating-point math is required over capacitive sensing integration. |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz; AEC-Q100 Grade-2 (–40°C to +105°C); no CAN TTCAN or hardware CAPSENSE™ acceleration. | Suitable for cost-sensitive non-safety touch applications; lacks TTCAN timing precision and Deep Sleep analog retention. | Choose only for legacy 16-bit migration paths where CAN FD or high-SNR touch is not required. |
Compared with S32K144W and RL78/F14, CY8C4147LQS-S273 uniquely integrates CAPSENSE™ with SmartSense, TTCAN, and sub-3 µA Deep Sleep-making it optimal for AEC-Q100 Grade-S touch-and-motor control nodes where mixed-signal consolidation reduces system-level validation effort.
Availability
CY8C4147LQS-S273 is available at Aetrix Electronics and suitable for automotive body electronics, electric power steering modules, climate control panels, and seat occupancy detection systems requiring stable component supply and long-term lifecycle assurance.
Supply support for CY8C4147LQS-S273 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
CY8C4147LQS-S273 belongs to the PSoC™ 4100S Plus product line-designed specifically for AEC-Q100-compliant automotive human-machine interfaces and distributed control units requiring integrated analog, CAPSENSE™, and CAN connectivity.
FAQ
Does CY8C4147LQS-S273 support CAN FD?
No. This device implements CAN 2.0B with optional time-triggered CAN (TTCAN) per ISO 11898-1, but does not support CAN FD data rates or extended frame formats. For CAN FD, consider Infineon's AURIX™ TC3xx family or NXP S32K3xx devices.
What development tools are officially supported for this part?
Infineon officially supports ModusToolbox™ (v3.1+) and PSoC™ Creator (v4.4) IDEs. Both provide full peripheral configuration, CAPSENSE™ tuning GUI, CAN stack libraries, and debug via KitProg3 or MiniProg3. Third-party Arm® toolchains (Keil MDK, IAR EWARM) are also supported via PDL headers.
Is the 12-bit SAR ADC capable of simultaneous sampling?
No. The SAR ADC has a single conversion engine with channel sequencer and signal averaging, but no hardware simultaneous sampling across multiple channels. For true simultaneous acquisition, external parallel-output ADCs or higher-tier PSoC™ devices with dual ADCs are required.
How is CAPSENSE™ performance validated for automotive environments?
Infineon validates CAPSENSE™ on CY8C4147LQS-S273 per ISO 11452-2 (radiated immunity), ISO 10605 (ESD), and ISO 16750-4 (humidity). SmartSense auto-tuning maintains SNR >5:1 across –40°C to +105°C, 10–95% RH, and 4.5–5.5 V supply-verified using production test fixtures per AEC-Q100 stress profiles.
CY8C4147LQS-S273 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 40-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 24MHz
- Connectivity:
- FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x10b, 20x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4147LQS-S273 FAQ
1.How can I place an order for CY8C4147LQS-S273 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4147LQS-S273 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4147LQS-S273 reliable?
The price and inventory of CY8C4147LQS-S273 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4147LQS-S273 is usually 5 days.
3.What payment methods are accepted for CY8C4147LQS-S273?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4147LQS-S273 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4147LQS-S273?
CY8C4147LQS-S273 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4147LQS-S273 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4147LQS-S273?
For technical support, including CY8C4147LQS-S273 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4147LQS-S273 requirements.
6.How does Aetrix verify that CY8C4147LQS-S273 is sourced from the original manufacturer or authorized distributors?
All CY8C4147LQS-S273 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4147LQS-S273 meets industry standards.
7.What is the process for return or replacement of CY8C4147LQS-S273?
All CY8C4147LQS-S273 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4147LQS-S273, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4147LQS-S273 part is unused and in its original packaging.
Return procedure for CY8C4147LQS-S273:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4147LQS-S273 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
