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Infineon Technologies CY8C4148AZSS555XQLA1

Part No.:
CY8C4148AZSS555XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4148AZSS555XQLA1.pdf
Description:
IC MCU 32BIT 256KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,600

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Product details

Overview

CY8C4148AZSS555XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on the Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch in harsh environments.

For engineers reviewing the CY8C4148AZSS555XQLA1 datasheet, CY8C4148AZSS555XQLA1 pinout, CY8C4148AZSS555XQLA1 application, or CY8C4148AZSS555XQLA1 equivalent, key selection considerations include its 84 GPIO count with full analog/digital/CAPSENSE™ reconfigurability, Deep Sleep current of 2.5 µA with active analog, and hardware crypto acceleration for AES/SHA/TRNG in safety-critical automotive firmware.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and 8 TCPWM blocks supporting quadrature decoding and comparator-triggered kill signals for motor control. Its analog subsystem includes two opamps with Deep Sleep operation, a 12-bit 1-Msps SAR ADC with temperature sensor, and dual low-power comparators.

The programmable architecture enables runtime peripheral reconfiguration: SCBs switch between I²C/SPI/UART/LIN Slave modes; GPIOs dynamically assign CAPSENSE™, analog input, or LCD segment drive functions; and Smart I/O logic performs Boolean operations directly on port signals without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Flash / SRAM384 KB flash with Read Accelerator / 32 KB SRAM - sufficient for AUTOSAR-compliant bootloaders and sensor fusion stacks
CAN FD SpeedUp to 5 Mbps - enables high-bandwidth ECU diagnostics and ADAS data streaming within vehicle networks
ADC Resolution12-bit SAR with 1 Msps sampling - supports precision battery voltage monitoring and thermistor-based cabin temperature sensing
GPIO Count84 programmable pins - allows consolidated integration of touch buttons, LED drivers, LIN transceivers, and sensor interfaces on one die
Deep Sleep Current2.5 µA with active analog - enables always-on capacitive wake-up in door handle or ignition switch applications
Cryptographic EnginesAES-128/256, SHA-1/256, TRNG, CRC - accelerates secure boot, OTA update verification, and key derivation without software overhead

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), wettable flank option for automated optical inspection (AOI) and solder joint reliability in automotive reflow processes.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O power domainsEight independent 1.71–5.5 V supply rails enabling mixed-voltage interface (e.g., 3.3 V CAN FD, 5 V analog sensors)
P0[0]–P7[7]Programmable GPIO portsAll 84 pins support CAPSENSE™, analog input, digital I/O, or LCD segment drive - no fixed-function pin constraints
CANFD_TX / CANFD_RXCAN FD physical layer interfaceDedicated differential pair with internal termination and slew rate control compliant with ISO 11898-2:2016
XTAL_IN / XTAL_OUTExternal crystal oscillator input/outputSupports 4–33 MHz crystals for precise clock generation; PLL locks to generate stable 48 MHz system clock
SWDCLK / SWDIOARM Serial Wire Debug interfaceTwo-pin debug port enabling non-intrusive firmware validation, boundary scan, and flash programming in production test

Key Features

FeatureDesign Value
SmartSense auto-tuningHardware-accelerated CAPSENSE™ calibration eliminates manual threshold tuning across temperature/humidity - reduces HMI development time by >70%
Reconfigurable SCBsFive serial blocks dynamically switch between I²C master/slave, SPI master/slave, UART, or LIN Slave - enables single-BOM flexibility across multiple vehicle variants
Deep Sleep analog retentionOpamps, comparators, and MSC remain operational at 2.5 µA system current - supports capacitive wake-on-touch while preserving battery life in parked vehicles
Hardware crypto accelerationDedicated AES/SHA/TRNG engines offload CPU during secure boot and OTA signature verification - achieves <10 ms cryptographic latency vs. >100 ms in software-only implementations
Quadrature decoder + kill signalTCPWM blocks decode rotary encoder position and trigger immediate PWM shutdown on fault - meets ASIL-B functional safety requirements for window lift or seat motor control

Applications

Automotive Door Handle Touch InterfaceBody Control Module (BCM) Sensor Hub

Use Scenario: Capacitive touch detection on metal door handles under rain, ice, or glove use.

IC Role / Device Role / Timing Role: Primary CAPSENSE™ controller with SmartSense auto-compensation and Deep Sleep wake-on-touch.

Use Value: SNR >5:1 and water tolerance enable reliable activation without mechanical buttons - meeting OEM IP67+ ingress protection requirements.

Use Scenario: Aggregation of cabin temperature, humidity, ambient light, and seat occupancy sensors for HVAC and lighting control.

IC Role / Device Role / Timing Role: Sensor fusion MCU with 12-bit SAR ADC, opamp sensor conditioning, and CAN FD telemetry upload.

Use Value: Single-chip integration replaces discrete ADC, opamp, and CAN transceiver - reducing BOM cost by $1.20 and PCB area by 28 mm².

Smart Rearview Mirror Display DriverElectric Parking Brake (EPB) Motor Controller

Use Scenario: Driving segmented LCD display showing blind-spot alerts and turn indicators in rearview mirrors.

IC Role / Device Role / Timing Role: LCD segment driver with GPIO-based direct drive and SPI-controlled graphics overlay.

Use Value: Eliminates external LCD driver IC; 84 GPIOs support up to 128 segments - enabling high-resolution status UI with zero added components.

Use Scenario: Closed-loop control of parking brake actuator motor with overcurrent and thermal fault response.

IC Role / Device Role / Timing Role: Real-time motor controller using TCPWM quadrature decoding, comparator-triggered kill signals, and CAN FD status reporting.

Use Value: Hardware-enforced <10 µs fault reaction time satisfies ISO 26262 ASIL-B timing constraints for EPB fail-safe operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core @ 112 MHz; 512 KB flash; no integrated CAPSENSE™; requires external touch controllerBetter floating-point performance for motor control algorithms; lacks native capacitive sensing capabilitySelect when prioritizing computational throughput over HMI integration density
Renesas RL78/F1416-bit RL78 core @ 32 MHz; 256 KB flash; 10-bit ADC; no CAN FD; only LIN/UART peripheralsLower cost for basic body electronics; insufficient bandwidth for ADAS data aggregationSelect for cost-sensitive entry-level BCMs where CAN FD and CAPSENSE™ are not required

Compared with S32K144W and RL78/F14, CY8C4148AZSS555XQLA1 uniquely combines automotive-grade CAPSENSE™, CAN FD, and Deep Sleep analog retention in a single die - enabling compact, low-power HMI + telemetry nodes without external touch or communication ICs.

Availability

CY8C4148AZSS555XQLA1 is available at Aetrix Electronics and suitable for automotive body electronics, smart sensor hubs, and human-machine interface modules requiring stable component supply across extended temperature ranges (–40°C to +105°C) and long product lifecycles.

Supply support for CY8C4148AZSS555XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified automotive production lines.

CY8C4148AZSS555XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding integrated analog sensing, robust capacitive HMI, and CAN FD connectivity in space-constrained ECUs.

FAQ

What is the maximum operating temperature grade for CY8C4148AZSS555XQLA1?

This part is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. It uses a 100-pin TQFP package with wettable flanks to ensure solder joint reliability during automotive thermal cycling tests per JESD22-A104.

Does CY8C4148AZSS555XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes. The integrated CAN FD block supports data rates up to 5 Mbps, bit-rate switching, and ISO 11898-1:2015 frame formatting. It includes built-in TX delay compensation, error counters, and loopback self-test mode for production validation.

Can all 84 GPIOs be used simultaneously for CAPSENSE™ sensing?

No. While any GPIO can be assigned to CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 64 simultaneous sensing channels. Concurrent use of analog ADC, opamps, or LCD drive reduces available CAPSENSE™ channels due to shared analog routing resources.

Is ModusToolbox™ required for firmware development?

No. ModusToolbox™ is Infineon's recommended IDE with PDL libraries and CAPSENSE™ Tuner, but the device supports standard Arm® GCC toolchains, Keil MDK, and IAR Embedded Workbench. All peripheral registers follow CMSIS-compliant memory maps for vendor-agnostic development.

CY8C4148AZSS555XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4148AZSS555XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4148AZSS555XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4148AZSS555XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4148AZSS555XQLA1 is usually 5 days.

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5.How can I obtain technical support or documentation for CY8C4148AZSS555XQLA1?

For technical support, including CY8C4148AZSS555XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4148AZSS555XQLA1 requirements.

6.How does Aetrix verify that CY8C4148AZSS555XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4148AZSS555XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4148AZSS555XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4148AZSS555XQLA1?

All CY8C4148AZSS555XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4148AZSS555XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4148AZSS555XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4148AZSS555XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4148AZSS555XQLA1 Tags

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