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Infineon Technologies CY8C4148LDES563XQLA1

Part No.:
CY8C4148LDES563XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4148LDES563XQLA1.pdf
Description:
IC MCU 32BIT 256KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,292

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Product details

Overview

CY8C4148LDES563XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It serves as a reconfigurable system-on-chip for safety-critical body electronics and human-machine interface control.

For engineers reviewing the CY8C4148LDES563XQLA1 datasheet, CY8C4148LDES563XQLA1 pinout, CY8C4148LDES563XQLA1 application, or CY8C4148LDES563XQLA1 equivalent, key selection factors include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO flexibility (up to 84 pins, all CAPSENSE™-capable).

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and heterogeneous peripherals including five reconfigurable SCBs (I²C/SPI/UART/LIN), eight TCPWM blocks with quadrature decode and kill-signal triggering, and dual CTBm opamps supporting high-drive external mode and Deep Sleep operation.

Its analog subsystem centers on a 12-bit SAR ADC with differential input, channel sequencer, signal averaging, and embedded temperature sensor; the MSC block delivers water-tolerant capacitive sensing via hardware-accelerated multi-sense conversion, while the Crypto block provides AES, SHA, TRNG, and CRC acceleration for secure boot and firmware updates.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling.
Flash / SRAM384 KB flash with Read Accelerator / 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering.
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth in-vehicle networking requirements for ADAS domain controllers and gateway modules.
SAR ADC12-bit, 1 Msps, differential mode, channel sequencer - enables simultaneous multi-sensor acquisition (e.g., temperature, pressure, position) without CPU overhead.
Deep Sleep Current2.5 µA digital system current - sustains always-on wake-up capability in battery-backed modules like door handles or seat occupancy sensors.
CAPSENSE™ SNR>5:1 signal-to-noise ratio - ensures reliable touch detection under wet conditions and EMI noise in infotainment and climate control panels.
GPIO CountUp to 84 programmable pins - allows direct connection of buttons, LEDs, sensors, and LIN/CAN transceivers without external glue logic.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input (SAR ADC), digital I/O, and SCB/I²C functions; configurable slew rate and drive strength.
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX pins (P1[2]/P1[3]), TCPWM capture inputs, and LCD segment outputs.
XRESExternal reset inputActive-low asynchronous reset with internal pull-up; compatible with automotive watchdog timer assertion signals.
VDDIO0–VDDIO3I/O power domainsFour independent 1.71–5.5 V supply rails enabling mixed-voltage interfacing (e.g., 3.3 V MCU core + 5 V sensor interface).
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V domains isolate noise-sensitive analog blocks (ADC, opamps) from digital switching transients.

Key Features

FeatureDesign Value
SmartSense auto-tuningHardware-accelerated CAPSENSE™ calibration eliminates manual threshold tuning and maintains stable touch response across temperature/humidity drift.
Reconfigurable SCBsFive Serial Communication Blocks dynamically switch between I²C master/slave, SPI master/slave, UART, or LIN Slave - reduces BOM count in multi-protocol ECUs.
Deep Sleep analog retentionOpamps and comparators remain active at 2.5 µA system current - enables continuous capacitive proximity wake-up without full MCU wake.
Hardware crypto acceleratorsAES-128/256, SHA-1/256, TRNG, and CRC engines offload security operations from CPU - critical for UDS diagnostic session keys and OTA firmware signature verification.
Quadrature decoder + kill signalTCPWM blocks support motor position tracking and hardware-triggered fault shutdown - satisfies ASIL-B functional safety requirements for window lift or sunroof control.

Applications

Body Control Module (BCM)Touch-Based Climate Control Panel

Use Scenario: Centralized management of door locks, lighting, wipers, and mirrors in modern vehicles.

IC Role / Device Role / Timing Role: Main controller executing LIN slave communication, PWM fan speed control, and GPIO-based relay actuation.

Use Value: Integrated TCPWM and SCB-LIN reduce external components; CAN FD enables fast diagnostics and software updates over vehicle backbone.

Use Scenario: Capacitive touch interface for HVAC settings with water splash tolerance and haptic feedback.

IC Role / Device Role / Timing Role: CAPSENSE™ MSC block performs real-time finger detection and gesture decoding; SAR ADC monitors ambient temperature sensor.

Use Value: >5:1 SNR and SmartSense ensure reliable operation under condensation; low-power Deep Sleep extends battery life in keyless entry integration.

Automotive Gateway NodeSeat Occupancy & Position Sensing

Use Scenario: Protocol translation between CAN FD backbone and sub-networks (LIN, UART sensors).

IC Role / Device Role / Timing Role: Dual-CAN FD interface with hardware filtering and message RAM; SCBs handle UART-based sensor telemetry.

Use Value: 5 Mbps CAN FD throughput supports high-rate ADAS data forwarding; cryptography accelerators enable secure gateway authentication.

Use Scenario: Detection of occupant presence, weight distribution, and seat position for airbag deployment logic.

IC Role / Device Role / Timing Role: SAR ADC reads resistive seat sensors; MSC block monitors capacitive seat surface for occupancy; GPIOs drive seat motor drivers.

Use Value: Simultaneous analog and capacitive sensing on shared pins simplifies PCB layout; AEC-Q100 Grade-S rating ensures reliability at 105°C cabin temperatures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F core, 112 MHz, 1 MB flash, CAN FD, no integrated CAPSENSE™Requires external touch controller for HMI; stronger floating-point performance for motor control algorithmsSelect when higher computational throughput is needed and touch sensing is handled separately.
Renesas RL78/F1416-bit RL78 core, 32 MHz, 512 KB flash, CAN 2.0B only, no crypto acceleratorLimited to legacy CAN networks; lacks hardware security for secure boot or OTA updatesSelect for cost-sensitive, non-connected body electronics where CAN FD and cryptographic features are not required.

Compared with S32K144HAT0MLHT and RL78/F14, CY8C4148LDES563XQLA1 uniquely combines CAPSENSE™, CAN FD, and crypto acceleration in a single AEC-Q100 Grade-S package-ideal for integrated HMI + gateway + safety-sensing nodes where BOM consolidation and functional safety are priorities.

Availability

CY8C4148LDES563XQLA1 is available at Aetrix Electronics and suitable for automotive body electronics, touch-based HMI systems, and gateway modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualification.

Supply support for CY8C4148LDES563XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4148LDES563XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics and human-machine interface applications demanding reconfigurable analog/digital resources, functional safety compliance, and seamless toolchain integration via ModusToolbox™.

FAQ

What is the maximum operating temperature range for CY8C4148LDES563XQLA1?

This device is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It is validated for use in engine bay-adjacent modules and interior cabin electronics exposed to elevated thermal stress, with thermal derating applied per datasheet Section 6.1.

Does CY8C4148LDES563XQLA1 support hardware-based secure boot?

Yes - it includes a dedicated cryptography accelerator with AES-128/256, SHA-256, TRNG, and CRC engines, enabling authenticated and encrypted firmware image verification during boot. Secure boot implementation requires configuration via ModusToolbox™ and adherence to Infineon's PSoC™ 4 Secure Boot Application Note AN229327.

Can all GPIO pins be used for CAPSENSE™ sensing simultaneously?

No - while any GPIO pin can be configured for CAPSENSE™, the MSC block supports up to 32 simultaneous sensing channels. Physical pin count (84) exceeds MSC channel limit; concurrent usage depends on routing constraints and mutual capacitance coupling, as detailed in the CAPSENSE™ design guide section 4.3.5.

Is external crystal required for CAN FD operation?

No - CAN FD bit timing accuracy is maintained using the internal IMO (±2%) with PLL lock to 48 MHz, meeting ISO 11898-1:2015 requirements for nominal bit rates up to 2 Mbps. For 5 Mbps operation, an external 33 MHz ECO is recommended to achieve <±0.5% timing tolerance under temperature variation.

CY8C4148LDES563XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4148LDES563XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4148LDES563XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4148LDES563XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4148LDES563XQLA1 is usually 5 days.

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5.How can I obtain technical support or documentation for CY8C4148LDES563XQLA1?

For technical support, including CY8C4148LDES563XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4148LDES563XQLA1 requirements.

6.How does Aetrix verify that CY8C4148LDES563XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4148LDES563XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4148LDES563XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4148LDES563XQLA1?

All CY8C4148LDES563XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4148LDES563XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4148LDES563XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4148LDES563XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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