Infineon Technologies CY8C4148LDES593XQLA1
- Part No.:
- CY8C4148LDES593XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
CY8C4148LDES593XQLA1.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 48VFQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,663
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Product details
Overview
CY8C4148LDES593XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on the Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch in harsh environments.
For engineers reviewing the CY8C4148LDES593XQLA1 datasheet, CY8C4148LDES593XQLA1 pinout, CY8C4148LDES593XQLA1 application, or CY8C4148LDES593XQLA1 equivalent, key selection considerations include its CAN FD interface timing, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), and GPIO flexibility (up to 84 pins, all CAPSENSE™-capable).
Technical Context
The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, memory subsystem (384 KB flash with Read Accelerator, 32 KB SRAM), and heterogeneous peripherals including five reconfigurable Serial Communication Blocks (SCBs), eight TCPWM units, and dual opamps supporting analog sensing in Deep Sleep mode. Its clock system combines ECO (4–33 MHz), PLL, WCO (32 kHz), and precision internal oscillators (IMO ±2%, ILO 40 kHz).
The programmable analog architecture includes a 12-bit SAR ADC with differential input, channel sequencer, and built-in temperature sensor; two CTBm opamps with comparator/ADC buffer modes; and two low-power comparators-all operable in Deep Sleep. The MSC block delivers >5:1 SNR for CAPSENSE™ and supports water-tolerant touch detection via hardware-accelerated SmartSense tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash / SRAM | 384 KB flash with Read Accelerator / 32 KB SRAM - supports complex firmware with fast code execution and multi-tasking data buffers. |
| CAN FD Speed | Up to 5 Mbps - meets high-bandwidth automotive network requirements for ADAS sensor fusion and gateway communication. |
| SAR ADC | 12-bit, 1 Msps, differential mode, channel sequencer - enables precise multi-channel sensor acquisition (e.g., battery voltage, temperature, pressure) without CPU overhead. |
| Deep Sleep Current | 2.5 µA digital system current - sustains always-on wake-up capability (e.g., door handle touch, proximity detection) with minimal battery drain. |
| CAPSENSE™ SNR | >5:1 signal-to-noise ratio - ensures reliable touch operation under condensation, glove use, or electromagnetic noise in automotive cabins. |
| GPIO Count | Up to 84 programmable pins - allows full integration of touch, LED drive, analog sensing, and serial interfaces on a single die. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL-3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input (SAR ADC), digital I/O, and SCB/I2C/SPI functions; configurable slew rate and drive strength. |
| P1[0]–P1[7] | Port 1 GPIO bank | Includes dedicated CAN FD TX/RX pins (P1[0]/P1[1]), TCPWM inputs, and LCD segment outputs. |
| XRES | External reset input | Active-low asynchronous reset with internal pull-up; compatible with automotive watchdog timer assertion. |
| WCO_IN / WCO_OUT | 32-kHz watch crystal oscillator terminals | Enables RTC functionality and low-power timekeeping during Deep Sleep with ±20 ppm stability. |
| VDDA / VSSA | Analog power supply / ground | Separate 1.71–5.5 V analog domain ensures clean reference for SAR ADC and opamps, reducing digital noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| SmartSense auto-tuning | Hardware-accelerated CAPSENSE™ calibration eliminates manual firmware tuning for electrode drift, humidity, or temperature variation. |
| Programmable analog blocks | Two CTBm opamps operate in Deep Sleep with <1 µA quiescent current, enabling always-on analog front-end monitoring. |
| CAN FD with protocol offload | Dedicated CAN FD block handles bit-rate switching (up to 5 Mbps), CRC calculation, and message filtering-reducing CPU load by ~40% vs. software-implemented CAN. |
| Reconfigurable SCBs | Five Serial Communication Blocks support runtime switching between I2C, SPI, UART, or LIN Slave - simplifies BOM consolidation across variants. |
| True Random Number Generator | On-chip TRNG compliant with NIST SP 800-90B, used for secure key generation in automotive OTA update authentication. |
Applications
| Body Control Module (BCM) | Automotive Touch HMI |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time CAN FD messaging, PWM motor control, and analog sensor polling (e.g., ambient light, temperature). Use Value: Integrates 84 GPIOs and TCPWM blocks to replace discrete logic and driver ICs, reducing PCB area by 35% versus legacy 8-bit solutions. | Use Scenario: Capacitive touch panel for center console, climate control, or steering wheel controls with water/glove tolerance. IC Role / Device Role / Timing Role: CAPSENSE™ master with SmartSense auto-calibration and SAR ADC for proximity/humidity compensation. Use Value: Achieves >5:1 SNR and automatic recalibration-enabling reliable touch detection even after thermal cycling from –40°C to +105°C. |
| Smart Sensor Node | Automotive Gateway Subsystem |
Use Scenario: Tire pressure monitoring system (TPMS) or battery management sensor node with ultra-low-power wake-on-event operation. IC Role / Device Role / Timing Role: Low-power MCU with 2.5 µA Deep Sleep current, wake-up via comparator or GPIO interrupt, and integrated temperature sensor. Use Value: Eliminates external RTC and analog front-end components, extending coin-cell battery life to >10 years in intermittent-sampling mode. | Use Scenario: In-vehicle network bridge translating between CAN FD, LIN, and UART-based sub-systems (e.g., infotainment ↔ HVAC). IC Role / Device Role / Timing Role: Protocol-aware gateway controller using five SCBs and CAN FD block with hardware message filtering. Use Value: Reduces latency by 60% versus software-based bridging, with deterministic timing for safety-critical message forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144HAT0MLHT | ARM Cortex-M4F core, 112 MHz; no integrated CAPSENSE™; requires external touch controller. | Better floating-point performance for motor control algorithms; lacks native capacitive sensing. | Select when advanced math-intensive tasks dominate over HMI touch integration. |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz; AEC-Q100 Grade-2 (–40°C to +105°C); no CAN FD, only classical CAN 1 Mbps. | Lower cost for basic BCM functions; insufficient bandwidth for next-gen ADAS sensor aggregation. | Select for cost-sensitive entry-level body electronics where CAN FD and CAPSENSE™ are not required. |
Compared with S32K144HAT0MLHT and RL78/F14, CY8C4148LDES593XQLA1 uniquely combines CAN FD, CAPSENSE™ with SmartSense, and Deep Sleep efficiency in a single AEC-Q100 Grade-S package-making it optimal for integrated automotive HMI and sensor nodes where mixed-signal integration reduces system complexity.
Availability
CY8C4148LDES593XQLA1 is available at Aetrix Electronics and suitable for automotive body control modules, touch-based HMIs, smart sensor nodes, and gateway subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY8C4148LDES593XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security ICs, with global R&D centers and ISO/TS 16949-certified automotive production lines.
CY8C4148LDES593XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive applications demanding functional safety, mixed-signal integration, and AEC-Q100 compliance without external analog/digital co-processors.
FAQ
What is the maximum operating temperature range for CY8C4148LDES593XQLA1?
This part is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It includes on-die temperature sensing calibrated against the SAR ADC, enabling real-time thermal monitoring for derating or fault reporting in engine bay or cabin-mounted ECUs.
Does CY8C4148LDES593XQLA1 support hardware-based cryptographic acceleration?
Yes-it integrates a dedicated Crypto block supporting AES-128/256 encryption/decryption, SHA-256 hashing, CRC-32, PRNG, and NIST SP 800-90B–compliant TRNG. These accelerators offload secure boot verification and OTA update signature validation from the Cortex-M0+ core.
Can all GPIO pins be used for CAPSENSE™ sensing simultaneously?
Yes-any of the up to 84 GPIO pins can be configured as CAPSENSE™ electrodes. The MSC block supports simultaneous scanning of multiple sensors with hardware-based baseline tracking and noise rejection, enabling full-console touch panels without external controllers.
Is ModusToolbox™ required for development with this MCU?
No-ModusToolbox™ is Infineon's recommended IDE with PDL libraries and CAPSENSE™ Tuner GUI, but the device is fully compatible with Arm®-standard tools including Keil MDK, IAR Embedded Workbench, and GCC-based toolchains via CMSIS-Pack support and open-source HAL drivers.
CY8C4148LDES593XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
CY8C4148LDES593XQLA1 FAQ
1.How can I place an order for CY8C4148LDES593XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4148LDES593XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of CY8C4148LDES593XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4148LDES593XQLA1 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4148LDES593XQLA1?
For technical support, including CY8C4148LDES593XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4148LDES593XQLA1 requirements.
6.How does Aetrix verify that CY8C4148LDES593XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4148LDES593XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4148LDES593XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4148LDES593XQLA1?
All CY8C4148LDES593XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4148LDES593XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4148LDES593XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4148LDES593XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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