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Infineon Technologies CY8C4148LDSS593XQLA1

Part No.:
CY8C4148LDSS593XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4148LDSS593XQLA1.pdf
Description:
IC MCU 32BIT 256KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,192

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Product details

Overview

CY8C4148LDSS593XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in harsh environments.

For engineers reviewing the CY8C4148LDSS593XQLA1 datasheet, CY8C4148LDSS593XQLA1 pinout, CY8C4148LDSS593XQLA1 application, or CY8C4148LDSS593XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), CAPSENSE™ water tolerance, and reconfigurable SCB blocks supporting I²C/SPI/UART/LIN in automotive body control modules.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5x Serial Communication Blocks (SCBs), and CAN FD controller with dedicated DMA channels. Its analog subsystem includes two opamps with Deep Sleep support, a 12-bit 1-Msps SAR ADC with temperature sensor, and dual low-power comparators - all accessible via any GPIO.

Digital flexibility is enabled by 8x TCPWM blocks (supporting quadrature decode, center-aligned PWM, and comparator-triggered kill signals), programmable Smart I/O logic, and hardware crypto accelerators (AES, SHA, TRNG, CRC) for secure boot and firmware authentication in safety-critical ECUs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution for motor control and sensor fusion
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - sufficient for AUTOSAR-compliant stacks with OTA update partitioning
CAN FD SpeedUp to 5 Mbps data phase - enables high-bandwidth diagnostics and ECU-to-ECU firmware updates over vehicle networks
ADC Performance12-bit SAR, 1 Msps, differential mode - supports precision battery voltage monitoring and thermistor-based cabin temperature sensing
Low-Power ModeDeep Sleep at 2.5 µA with opamps & comparators active - enables always-on capacitive wake-up in door handle or ignition switch applications
CAPSENSE™ SNR>5:1 signal-to-noise ratio with SmartSense auto-tuning - ensures reliable touch detection under condensation or glove use in infotainment panels
GPIO CountUp to 84 programmable pins across 8 ports - supports mixed-signal routing for LIN slave, CAN FD, and analog sensor inputs on single chip

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O power supply domainsIndependent 1.71–5.5 V rails per port group - enables mixed-voltage interfacing (e.g., 3.3 V MCU core with 5 V analog sensors)
P0[0]–P0[7], P1[0]–P1[7], etc.Programmable GPIOsEach pin supports CAPSENSE™, analog input, digital I/O, or SCB function - no fixed peripheral pinout required
CANFD_TX / CANFD_RXCAN FD physical layer interfaceDedicated differential pair with internal termination - eliminates external transceiver for basic node-level diagnostics
SWDCLK / SWDIOARM Serial Wire Debug interfaceTwo-pin debug access with trace capability - supports production programming and field firmware recovery
XRESExternal reset inputActive-low, Schmitt-triggered, 1.2 V threshold - compatible with automotive watchdog ICs and power supervisor outputs

Key Features

FeatureDesign Value
Reconfigurable SCBsFive independent blocks runtime-configurable as I²C master/slave, SPI master/slave, UART, or LIN slave - reduces BOM count in gateway modules
Hardware Crypto EngineAES-128/256, SHA-256, TRNG, and CRC accelerators - offloads cryptographic operations from CPU to meet ISO/SAE 21434 security requirements
Smart I/O LogicBoolean combinational logic on port inputs/outputs - implements debounce, edge detection, or protocol translation without CPU intervention
MSC BlockMulti-sense converter with automatic calibration and water-tolerance algorithms - eliminates manual tuning for exterior touch buttons exposed to rain or car washes
Deep Sleep Analog RetentionOpamps and comparators remain functional at 2.5 µA system current - enables capacitive wake-up from sleep without full MCU restart

Applications

Body Control Module (BCM)Infotainment Touch Interface

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave communication, PWM motor drive, and analog sensor acquisition (e.g., ambient light, humidity).

Use Value: Integrated CAN FD enables fast diagnostic uploads; programmable GPIOs reduce external level shifters needed for mixed-voltage actuators.

Use Scenario: Capacitive touch overlay on center console display with glove and wet-finger operation.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ controller with MSC block performing real-time noise rejection and SmartSense auto-calibration.

Use Value: >5:1 SNR and water tolerance ensure reliable activation during rain exposure; Deep Sleep wake-up reduces system standby power.

Electric Power Steering (EPS) Sensor HubAutomotive Gateway Node

Use Scenario: Aggregation and preprocessing of torque, angle, and temperature sensor data before transmission to EPS ECU.

IC Role / Device Role / Timing Role: Signal conditioner and CAN FD transmitter with hardware CRC for sensor data integrity.

Use Value: 12-bit SAR ADC with channel sequencer supports simultaneous sampling of multiple analog sensors; TRNG enables secure session key generation.

Use Scenario: Protocol translation between CAN FD backbone and LIN subnetworks in vehicle domain controllers.

IC Role / Device Role / Timing Role: Dual-role communication hub using SCBs for LIN slave and CAN FD master, coordinated via DMA and NVIC.

Use Value: Five reconfigurable SCBs eliminate need for discrete bridge ICs; hardware crypto secures firmware updates over CAN FD.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F @ 112 MHz; includes Ethernet MAC; lacks integrated CAPSENSE™ blockBetter suited for ADAS sensor fusion; requires external touch controller for capacitive interfacesSelect when higher CPU performance and Ethernet are required; avoid if CAPSENSE™ integration is critical
Renesas RL78/F1416-bit RL78 core @ 32 MHz; 512 KB flash; no CAN FD; only basic capacitive sensing IPTargeted at cost-sensitive body electronics; limited to CAN 2.0B and simple proximity detectionSelect for legacy CAN-only designs where MCU cost is primary constraint; not suitable for CAN FD or high-SNR touch

Compared with NXP S32K144 and Renesas RL78/F14, CY8C4148LDSS593XQLA1 uniquely combines CAN FD, hardware-accelerated crypto, and production-ready CAPSENSE™ in a single AEC-Q100 Grade-S package - reducing component count and validation effort for next-gen automotive HMI and domain controllers.

Availability

CY8C4148LDSS593XQLA1 is available at Aetrix Electronics and suitable for automotive body control modules, infotainment touch interfaces, electric power steering sensor hubs, and domain gateway nodes requiring stable component supply across extended temperature ranges.

Supply support for CY8C4148LDSS593XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4148LDSS593XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding integrated analog sensing, secure communication, and low-power human-machine interaction.

FAQ

What is the maximum operating temperature grade for CY8C4148LDSS593XQLA1?

This part is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. It meets automotive thermal cycling and long-term reliability requirements for under-hood and cabin-mounted ECUs, including sustained operation at 105°C junction temperature under defined power dissipation conditions.

Does CY8C4148LDSS593XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes, the integrated CAN FD controller supports data rates up to 5 Mbps, bit-rate switching, and ISO 11898-1:2015 physical layer signaling. It includes hardware CRC calculation, flexible message filtering, and error confinement features required for automotive network diagnostics and firmware updates.

Can the CAPSENSE™ block operate during Deep Sleep mode?

Yes, the Multi-Sense Converter (MSC) block remains fully functional in Deep Sleep mode with 2.5 µA system current. It supports automatic wake-up on touch event detection, and SmartSense auto-tuning continues to adjust baseline and thresholds without CPU intervention.

Is ModusToolbox™ required for development with this device?

No, ModusToolbox™ is recommended but not mandatory. The device supports standard Arm® GCC toolchains, Keil MDK, and IAR Embedded Workbench. Peripheral Driver Libraries (PDL) and HAL APIs are provided in source form, enabling integration into custom build systems and CI/CD pipelines used in automotive software development.

CY8C4148LDSS593XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4148LDSS593XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4148LDSS593XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4148LDSS593XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4148LDSS593XQLA1 is usually 5 days.

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5.How can I obtain technical support or documentation for CY8C4148LDSS593XQLA1?

For technical support, including CY8C4148LDSS593XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4148LDSS593XQLA1 requirements.

6.How does Aetrix verify that CY8C4148LDSS593XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4148LDSS593XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4148LDSS593XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4148LDSS593XQLA1?

All CY8C4148LDSS593XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4148LDSS593XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4148LDSS593XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4148LDSS593XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4148LDSS593XQLA1 Tags

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