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Infineon Technologies CY8C4149AZAS555XQLA1

Part No.:
CY8C4149AZAS555XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4149AZAS555XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,616

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Product details

Overview

CY8C4149AZAS555XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in harsh environments.

For engineers reviewing the CY8C4149AZAS555XQLA1 datasheet, CY8C4149AZAS555XQLA1 pinout, CY8C4149AZAS555XQLA1 application, or CY8C4149AZAS555XQLA1 equivalent, this device supports reconfigurable analog/digital blocks, Deep Sleep mode at 2.5 µA digital current, hardware crypto acceleration (AES/SHA/TRNG), and five runtime-reconfigurable SCBs for I²C/SPI/UART/LIN - critical for automotive body control, infotainment HMI, and motor drive supervision.

Technical Context

The CY8C4149AZAS555XQLA1 implements a tightly coupled system-on-chip architecture with single-layer AHB-Lite interconnect, enabling concurrent access to flash (with Read Accelerator), SRAM, and peripherals including eight 16-bit TCPWM blocks with comparator-triggered kill signals for motor safety, and dual opamps supporting ADC input buffering and Deep Sleep operation.

Its analog subsystem integrates a 12-bit 1-Msps SAR ADC with built-in temperature sensor and channel sequencer, two low-power comparators, and a dedicated Multi-Sensing Converter (MSC) block optimized for CAPSENSE™ with automatic SmartSense tuning and water-tolerant operation - all programmable via ModusToolbox™ PDL APIs without firmware-level register manipulation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support for ASIL-B–capable partitioning.
Memory384 KB flash (with Read Accelerator) + 32 KB SRAM - enables secure OTA updates and dual-bank firmware swapping.
Analog ADC12-bit SAR ADC, 1 Msps, differential/single-ended, with internal temperature sensor and hardware averaging - supports battery monitoring and thermal management.
CAN InterfaceCAN FD block, up to 5 Mbps - meets ISO 11898-1:2015 for high-bandwidth vehicle network diagnostics and ECU coordination.
Capacitive SensingMulti-Sensing Converter (MSC) with >5:1 SNR and SmartSense auto-tuning - delivers robust touch control under condensation or glove use in automotive interiors.
Power ModesDeep Sleep mode with 2.5 µA digital current and active analog - extends battery life in always-on vehicle entry systems.
Crypto AccelerationHardware AES-128/256, SHA-1/256, TRNG, CRC - offloads secure boot, key derivation, and message authentication from CPU.

Pinout & Package

This device is packaged in a 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch) with wettable flank capability for automated optical inspection (AOI) and solder joint reliability in automotive reflow processes.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO Port 0Programmable as CAPSENSE™, analog input, or digital I/O with configurable drive strength and slew rate.
P1[0]–P1[7]GPIO Port 1Supports LCD segment drive, SCB function remapping, and TCPWM capture/compare inputs.
XTAL_IN / XTAL_OUTExternal Crystal OscillatorConnects to 4–33 MHz crystal for precise clock source; enables PLL lock to 48 MHz system clock.
VDDA / VSSAAnalog Power SupplyDedicated 1.71–5.5 V analog rail decoupled separately to minimize noise coupling into ADC and opamps.
CAN_TX / CAN_RXCAN FD Physical InterfaceDifferential pair routed internally to CAN FD controller; requires external transceiver for bus connection.

Key Features

FeatureDesign Value
Reconfigurable Analog BlocksTwo continuous-time opamps with ADC input buffering and Deep Sleep operation - eliminates external signal conditioning in sensor front-ends.
Smart I/O LogicBoolean logic on port pins without CPU intervention - enables glitch-free wake-up from Deep Sleep using GPIO edge detection.
Hardware Crypto EngineAES/SHA/TRNG/CRC acceleration - reduces secure boot time by >70% vs. software-only implementation and prevents timing side-channel leakage.
Auto-Tuned CAPSENSE™MSC block with SmartSense - removes manual calibration effort and maintains stable touch response across voltage, temperature, and contamination variations.
Runtime-Reconfigurable SCBsFive Serial Communication Blocks supporting I²C/SPI/UART/LIN in any combination - simplifies BOM consolidation across variants of automotive ECUs.

Applications

Automotive Door ModuleInfotainment Touch Panel

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting with LIN communication to body domain controller.

IC Role / Device Role / Timing Role: Main MCU executing real-time motor control (via TCPWM kill signals), CAPSENSE™ for capacitive door handle, and LIN Slave over SCB.

Use Value: Single-chip integration replaces discrete MCU + touch controller + LIN transceiver, reducing PCB area by 35% and qualifying to AEC-Q100 Grade-S.

Use Scenario: Glove-compatible touch interface for center console display with condensation resistance in humid cabin environments.

IC Role / Device Role / Timing Role: CAPSENSE™ MSC block performing multi-electrode scanning with SmartSense auto-calibration and SAR ADC reading ambient temperature for compensation.

Use Value: >5:1 SNR and water tolerance enable reliable operation without mechanical buttons - meeting OEM IP6K9K splash-test requirements.

Electric Power Steering (EPS) MonitorBody Control Module (BCM)

Use Scenario: Safety-critical monitoring of EPS motor current, position, and fault status with fail-safe reporting over CAN FD.

IC Role / Device Role / Timing Role: Secondary controller capturing analog motor phase currents via SAR ADC, triggering TCPWM kill signals on overcurrent, and transmitting diagnostics via CAN FD at 5 Mbps.

Use Value: Hardware comparator-triggered kill path ensures <1 µs response - satisfying ISO 26262 ASIL-B timing constraints for torque limitation.

Use Scenario: Centralized management of lighting, HVAC, wipers, and chimes with secure firmware updates and tamper-resistant logging.

IC Role / Device Role / Timing Role: Primary BCM MCU running ModusToolbox™-based firmware with hardware AES decryption for signed OTA images and TRNG for session key generation.

Use Value: On-die crypto acceleration enables full image verification in <200 ms - meeting UNECE R156 CSMS requirement for update integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F @ 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or MSC block.Targeted at gateway/routing functions; lacks hardware-optimized touch sensing for HMI.Select when CAN FD + Ethernet coexistence is required, not for touch-centric nodes.
Renesas RL78/F1416-bit RL78 core @ 32 MHz; AEC-Q100 Grade-2 (–40°C to +105°C); no CAN FD, only classical CAN 2.0B.Lower cost for non-FD networks; no hardware crypto or advanced capacitive sensing.Select for legacy CAN-based modules where FD bandwidth and touch are unnecessary.

Compared with S32K144HAT0MLHT and RL78/F14, CY8C4149AZAS555XQLA1 uniquely combines CAN FD, MSC-based CAPSENSE™, and hardware crypto in a single AEC-Q100 Grade-S chip - making it optimal for next-gen automotive HMI and distributed safety monitors where integration, security, and environmental robustness are co-prioritized.

Availability

CY8C4149AZAS555XQLA1 is available at Aetrix Electronics and suitable for automotive door modules, infotainment touch panels, electric power steering monitors, and body control modules requiring stable component supply under AEC-Q100 qualification and long-term production continuity.

Supply support for CY8C4149AZAS555XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D centers and ISO/TS 16949-certified automotive production lines.

CY8C4149AZAS555XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics and human-machine interface applications demanding reconfigurable analog/digital resources, functional safety readiness, and environmental resilience.

FAQ

What is the maximum operating temperature range for CY8C4149AZAS555XQLA1?

This part is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It includes an on-die temperature sensor integrated with the 12-bit SAR ADC, enabling real-time thermal monitoring without external components. The silicon process and packaging are validated for automotive under-hood and cabin environments per JEDEC JESD22-A108.

Does CY8C4149AZAS555XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes, the integrated CAN FD block supports data rates up to 5 Mbps and complies with ISO 11898-1:2015 physical layer timing requirements. It includes bit-rate switching, flexible data-length fields (up to 64 bytes), and error confinement features. An external CAN transceiver (e.g., Infineon TLE9251VS) is required for bus connection and fault protection.

How does the MSC block achieve >5:1 SNR in CAPSENSE™ applications?

The Multi-Sensing Converter (MSC) uses correlated double sampling, programmable IDAC current sources, and hardware-accelerated baseline tracking to suppress common-mode noise and drift. Its >5:1 signal-to-noise ratio is measured per IEC 61000-4-3 radiated immunity testing at 10 V/m, with SmartSense automatically adjusting IDAC and scan parameters to maintain performance under moisture or conductive contaminants.

Is ModusToolbox™ required to configure the programmable analog and digital blocks?

No - while ModusToolbox™ provides graphical configuration and auto-generated PDL code, all analog and digital blocks can be configured directly via memory-mapped registers defined in the device's TRM (002-30041 Rev. *G). Register-level initialization sequences for CTBm opamps, TCPWM, and MSC are fully documented and supported in bare-metal C projects without IDE dependency.

CY8C4149AZAS555XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4149AZAS555XQLA1 FAQ

1.How can I place an order for CY8C4149AZAS555XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4149AZAS555XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149AZAS555XQLA1 reliable?

The price and inventory of CY8C4149AZAS555XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZAS555XQLA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149AZAS555XQLA1 transactions.

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CY8C4149AZAS555XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149AZAS555XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149AZAS555XQLA1?

For technical support, including CY8C4149AZAS555XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZAS555XQLA1 requirements.

6.How does Aetrix verify that CY8C4149AZAS555XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149AZAS555XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZAS555XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149AZAS555XQLA1?

All CY8C4149AZAS555XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZAS555XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149AZAS555XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149AZAS555XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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