Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C4149AZES555XQLA1

Part No.:
CY8C4149AZES555XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4149AZES555XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,751

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C4149AZES555XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It serves as a reconfigurable system-on-chip for body control modules, smart sensors, and automotive HMI interfaces.

For engineers reviewing the CY8C4149AZES555XQLA1 datasheet, CY8C4149AZES555XQLA1 pinout, CY8C4149AZES555XQLA1 application, or CY8C4149AZES555XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO flexibility (up to 84 pins, all CAPSENSE™-capable).

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and heterogeneous peripherals including five reconfigurable Serial Communication Blocks (SCBs), eight TCPWM units, and dual opamps with Deep Sleep support. Its analog subsystem includes a 12-bit SAR ADC with temperature sensor, two low-power comparators, and CTBm blocks enabling programmable gain/feedback configurations.

Digital reconfigurability is implemented via Smart I/O logic blocks and programmable routing matrix, allowing Boolean operations on port signals without CPU intervention. The CAN FD block supports ISO 11898-1:2015 with bit rates up to 5 Mbps and flexible message filtering, while the MSC block delivers hardware-accelerated capacitive sensing with water-tolerant scanning and automatic calibration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling.
Memory384 KB flash (with Read Accelerator), 32 KB SRAM - supports firmware updates in field and real-time data buffering for sensor fusion.
CAN FDUp to 5 Mbps data rate, ISO 11898-1:2015 compliant - meets high-bandwidth vehicle network requirements for ADAS domain controllers.
SAR ADC12-bit, 1 Msps, differential/single-ended, channel sequencer with signal averaging - enables precise battery voltage monitoring and motor phase current sampling.
CAPSENSE™ MSCMulti-sense converter with >5:1 SNR and hardware SmartSense tuning - delivers robust touch interface under condensation or glove use in automotive cockpits.
Power ModesDeep Sleep at 2.5 µA digital current with operational analog - extends battery life in always-on vehicle entry systems.
GPIO CountUp to 84 pins, all configurable as analog/digital/CAPSENSE™ - eliminates external multiplexers in multi-function ECU designs.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL-3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, UART TX/RX, and PWM output - enables shared pin usage across HMI, diagnostics, and motor control.
P1[0]–P1[7]Port 1 GPIO bankConfigurable as CAN FD TX/RX, I2C SDA/SCL, or LCD segment drivers - allows direct connection to infotainment display and communication buses.
XTAL_IN / XTAL_OUTExternal crystal oscillator inputsAccepts 4–33 MHz crystal for ECO; enables PLL-based 48 MHz system clock with ±0.2% stability over temperature.
VDDIO0–VDDIO3I/O power domainsIndependent 1.71–5.5 V supplies per port group - permits mixed-voltage interfacing with legacy 3.3 V and modern 1.8 V peripherals.
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V rails with internal LDO regulation - isolates noise-sensitive analog blocks from digital switching transients.

Key Features

FeatureDesign Value
Reconfigurable analog blocks (CTBm)Two opamps with selectable drive modes (high-bandwidth internal / high-drive external) and comparator/ADC buffer functions - reduces BOM count by replacing discrete signal conditioning circuits.
Hardware CAPSENSE™ engine (MSC)Integrated multi-sense converter with automatic SmartSense tuning and >5:1 SNR - eliminates manual calibration effort and improves production yield for touch buttons.
CAN FD with flexible message RAMDedicated 32 KB message RAM with hardware FIFO and filtering - enables concurrent handling of 100+ CAN FD frames without CPU overhead in gateway applications.
Programmable Smart I/O logicBoolean logic on GPIO inputs/outputs with asynchronous edge detection - implements debounce, pulse stretching, or state machines without consuming CPU cycles.
Cryptography acceleratorAES-128/256, SHA-256, TRNG, CRC - accelerates secure boot, OTA firmware authentication, and encrypted CAN FD message signing.

Applications

Body Control Module (BCM)Automotive Touch HMI

Use Scenario: Centralized control of door locks, lighting, wipers, and window lifts in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing LIN slave nodes, and communicating via CAN FD backbone.

Use Value: 8 TCPWM blocks enable simultaneous PWM dimming for 8 LED channels; Deep Sleep mode reduces quiescent current to <5 µA during vehicle sleep states.

Use Scenario: Capacitive touch interface for center console and steering wheel controls with water/glove tolerance.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ controller with hardware MSC block and SmartSense auto-calibration.

Use Value: >5:1 SNR ensures reliable detection under condensation; 84 GPIOs allow integration of 20+ touch buttons and proximity sensors without external ICs.

Electric Power Steering (EPS) Sensor HubAutomotive Gateway Node

Use Scenario: Aggregation and preprocessing of torque, angle, and temperature sensor data before transmission to EPS ECU.

IC Role / Device Role / Timing Role: Signal acquisition node with 12-bit SAR ADC (1 Msps), temperature sensor, and CAN FD interface.

Use Value: On-chip temperature sensor calibrated against ADC reference enables drift-compensated torque measurement; 2.5 µA Deep Sleep current extends battery backup runtime.

Use Scenario: Protocol translation between CAN FD, LIN, and UART-connected sub-systems in zonal architecture.

IC Role / Device Role / Timing Role: Bridge controller with five SCBs (reconfigurable as I2C/SPI/UART/LIN) and dedicated CAN FD block.

Use Value: Independent SCB run-time reconfiguration allows dynamic assignment of UART-to-CAN FD bridging without firmware reload; 32 KB message RAM prevents frame loss at 5 Mbps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WHT0MLHTARM Cortex-M4F core, 112 MHz, 1 MB flash, no integrated CAPSENSE™, CAN FD up to 5 MbpsHigher compute throughput for motor control algorithms; requires external touch controller for HMISelect when floating-point math or larger code footprint dominates design requirements over integrated analog sensing.
Renesas RH850/F1L32-bit RXv2 core, 120 MHz, 2 MB flash, CAN FD, no programmable analog blocks, 12-bit ADC onlyStronger ASIL-B support stack; lacks reconfigurable analog/digital fabric and CAPSENSE™ accelerationPrefer for safety-critical powertrain applications where ISO 26262 ASIL-D certification path is mandatory.

Compared with S32K144WHT0MLHT and RH850/F1L, CY8C4149AZES555XQLA1 uniquely combines automotive CAN FD, hardware CAPSENSE™, and reconfigurable analog/digital blocks in a single die - reducing component count and PCB area for cost-sensitive body electronics and HMI nodes.

Availability

CY8C4149AZES555XQLA1 is available at Aetrix Electronics and suitable for body control modules, automotive touch HMIs, electric power steering sensor hubs, and zonal gateway nodes requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4149AZES555XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4149AZES555XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications requiring integrated analog sensing, reconfigurable logic, and CAN FD connectivity in compact ECUs.

FAQ

What is the maximum operating temperature range for CY8C4149AZES555XQLA1?

This part is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It includes on-die thermal monitoring via the integrated SAR ADC temperature sensor, which is factory-calibrated and usable for system-level thermal management without external components.

Does CY8C4149AZES555XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes, the integrated CAN FD block fully complies with ISO 11898-1:2015, supporting data rates up to 5 Mbps, flexible data length (up to 64 bytes), and error confinement mechanisms. It includes dedicated message RAM, hardware filtering, and bit-rate switching capability required for automotive Ethernet coexistence.

Can all 84 GPIO pins be used simultaneously for CAPSENSE™ sensing?

No - while any GPIO pin can be configured for CAPSENSE™, the MSC block supports up to 32 physical sensing electrodes per scan cycle due to hardware resource limits in the multi-sense converter. Simultaneous use of all 84 pins requires time-multiplexed scanning across multiple groups.

Is ModusToolbox™ required to develop firmware for this device?

ModusToolbox™ is the recommended and fully supported IDE, providing Peripheral Driver Libraries (PDL), CAPSENSE™ Tuner, and CAN FD configuration tools. However, the device is Arm®-compliant and can also be programmed using GCC-based toolchains and OpenOCD with appropriate startup files and linker scripts provided in Infineon's GitHub repositories.

CY8C4149AZES555XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4149AZES555XQLA1 FAQ

1.How can I place an order for CY8C4149AZES555XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4149AZES555XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149AZES555XQLA1 reliable?

The price and inventory of CY8C4149AZES555XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZES555XQLA1 is usually 5 days.

3.What payment methods are accepted for CY8C4149AZES555XQLA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149AZES555XQLA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4149AZES555XQLA1?

CY8C4149AZES555XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149AZES555XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149AZES555XQLA1?

For technical support, including CY8C4149AZES555XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZES555XQLA1 requirements.

6.How does Aetrix verify that CY8C4149AZES555XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149AZES555XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZES555XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149AZES555XQLA1?

All CY8C4149AZES555XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZES555XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149AZES555XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149AZES555XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4149AZES555XQLA1 Tags

  • CY8C4149AZES555XQLA1
  • CY8C4149AZES555XQLA1 PDF
  • CY8C4149AZES555XQLA1 Datasheet
  • CY8C4149AZES555XQLA1 Specifications
  • CY8C4149AZES555XQLA1 Images
  • Infineon Technologies
  • Infineon Technologies CY8C4149AZES555XQLA1
  • Buy CY8C4149AZES555XQLA1
  • CY8C4149AZES555XQLA1 Price
  • CY8C4149AZES555XQLA1 Distributor
  • CY8C4149AZES555XQLA1 Supplier
  • CY8C4149AZES555XQLA1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER