My Inquiry
My Account
Infineon Technologies CY8C4149AZES558XQLA1
- Part No.:
- CY8C4149AZES558XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C4149AZES558XQLA1.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,276
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4149AZES558XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch in harsh environments.
For engineers reviewing the CY8C4149AZES558XQLA1 datasheet, CY8C4149AZES558XQLA1 pinout, CY8C4149AZES558XQLA1 application, or CY8C4149AZES558XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.
Technical Context
The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and a dedicated CAN FD controller supporting ISO 11898-1:2015 with bit rates up to 5 Mbps and payload lengths up to 64 bytes. Its clock system combines a 4–33 MHz ECO with PLL for 48 MHz core timing and a 32 kHz WCO for RTC and low-power wake-up.
Analog subsystem includes two continuous-time opamps (CTBm) with programmable drive modes and Deep Sleep operation, a 12-bit SAR ADC with differential input support and hardware-averaging sequencer, and a multi-sense converter (MSC) block optimized for high-SNR capacitive sensing with water tolerance and automatic SmartSense tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling |
| Memory | 384 KB flash (with Read Accelerator), 32 KB SRAM - supports firmware updates and complex state-machine logic without external memory |
| CAN FD | Up to 5 Mbps data rate, ISO 11898-1:2015 compliant - meets modern automotive domain controller bandwidth requirements |
| SAR ADC | 12-bit, 1 Msps, differential mode, hardware averaging - delivers precise sensor signal acquisition with noise suppression |
| Power Modes | Deep Sleep: 2.5 µA digital + operational analog - enables always-on capacitive wake-up with sub-µA system-level standby |
| CAPSENSE™ | Multi-Sense Converter (MSC) with >5:1 SNR and SmartSense auto-tuning - eliminates manual calibration for production touch panels |
| GPIO | Up to 84 pins, all reconfigurable as analog/digital/CAPSENSE™ - simplifies PCB layout and enables flexible I/O mapping per variant |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL-3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, UART TX/RX, and PWM output - configurable per pin via PRTx_PS register |
| P1[0]–P1[7] | Port 1 GPIO bank | Includes CAN FD TX/RX (P1[0]/P1[1]), SCB0 I2C SDA/SCL, and TCPWM outputs - enables mixed-signal routing without external muxing |
| P2[0]–P2[7] | Port 2 GPIO bank | Connects to MSC electrodes, SAR ADC inputs (AIN0–AIN7), and LCD segment drivers - direct analog front-end integration |
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V supplies - allows mixed-voltage interface (e.g., 3.3 V MCU core + 5 V sensor bus) |
| VDDD/VDDA | Digital/analog core supplies | Separate 1.71–5.5 V rails - reduces coupling noise between digital switching and precision analog conversion |
| XRES | External reset input | Active-low, Schmitt-triggered, 1.2 V threshold - ensures reliable reset under automotive voltage transients (ISO 7637-2 Pulse 4) |
Key Features
| Feature | Design Value |
|---|---|
| CAN FD Controller | Dedicated hardware block supporting ISO 11898-1:2015 with 64-byte payloads and error confinement - eliminates software stack overhead for safety-critical messaging |
| SmartSense Auto-Tuning | Hardware-accelerated MSC calibration that adjusts baseline, IDAC, and scan parameters in <100 ms - removes factory line calibration steps |
| Deep Sleep Analog Operation | Opamps, comparators, and MSC remain active at 2.5 µA system current - enables capacitive wake-up without full MCU boot |
| Reconfigurable SCBs | Five independent blocks each supporting I2C/SPI/UART/LIN Slave in runtime - reduces BOM count by eliminating discrete protocol translators |
| Crypto Acceleration | Hardware AES-128/256, SHA-256, TRNG, and CRC - accelerates secure boot and OTA update verification in <10 µs per 128-bit block |
Applications
| Body Control Module (BCM) | Automotive Touch HMI |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting using CAN FD communication with gateway ECUs. IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing CAN FD message scheduling, and sampling analog sensor inputs (e.g., hall-effect position feedback). Use Value: Integrated TCPWM blocks generate precise 20–100 kHz motor drive signals; Deep Sleep mode enables low-power occupancy detection via CAPSENSE™. | Use Scenario: Capacitive touch panel for infotainment or climate control with water splash immunity and glove operation. IC Role / Device Role / Timing Role: CAPSENSE™ master with MSC block performing real-time electrode scanning, SNR optimization, and SmartSense auto-calibration. Use Value: >5:1 SNR and hardware-based water rejection eliminate false triggers; 100-pin TQFP provides sufficient GPIO for 32+ touch keys and LED feedback drivers. |
| Smart Ambient Light Sensor Node | Electric Power Steering (EPS) Auxiliary MCU |
Use Scenario: Distributed cabin light control node measuring ambient brightness, temperature, and occupancy via analog sensors and reporting over CAN FD. IC Role / Device Role / Timing Role: Sensor fusion MCU acquiring 12-bit SAR ADC samples, processing temperature-compensated lux values, and transmitting via CAN FD. Use Value: On-chip temperature sensor calibrates photodiode readings; 32 KB SRAM buffers multiple sensor frames before transmission. | Use Scenario: Secondary MCU monitoring torque sensor drift, motor phase currents, and fault status in EPS systems, interfacing with main EPS controller via CAN FD. IC Role / Device Role / Timing Role: Safety-monitoring co-processor running independent diagnostics, comparing ADC readings against expected ranges, and triggering fail-safe signals via TCPWM kill lines. Use Value: Comparator-based TCPWM kill signal generation responds in <100 ns - meets ASIL-B timing constraints for torque path monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core, 112 MHz, no integrated CAPSENSE™, requires external touch controller | Better floating-point performance for motor control algorithms; lacks hardware touch tuning | Select when vector math intensity exceeds M0+ capability and touch is handled externally |
| Renesas RL78/F14 | 16-bit RL78 core, 32 MHz, 256 KB flash, no CAN FD, only CAN 2.0B | Lower cost for legacy CAN networks; insufficient for next-gen ADAS domain controllers | Select for cost-sensitive body electronics where CAN FD bandwidth is not required |
Compared with NXP S32K144W and Renesas RL78/F14, CY8C4149AZES558XQLA1 uniquely integrates CAPSENSE™ SmartSense, CAN FD, and Deep Sleep analog operation in a single AEC-Q100 Grade-S package-reducing system BOM count and enabling unified HMI + control functionality without external ICs.
Availability
CY8C4149AZES558XQLA1 is available at Aetrix Electronics and suitable for automotive body control modules, touch-based HMIs, smart sensor nodes, and EPS auxiliary monitoring systems requiring stable component supply and long-term automotive lifecycle support.
Supply support for CY8C4149AZES558XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and automotive qualification expertise.
CY8C4149AZES558XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding integrated analog sensing, CAN FD connectivity, and ultra-low-power capacitive HMI interfaces.
FAQ
What is the maximum operating temperature grade for CY8C4149AZES558XQLA1?
CY8C4149AZES558XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C. This rating is verified per test condition Tc = +105°C with thermal derating applied above 85°C ambient for sustained reliability in engine bay–adjacent locations such as door modules and seat controllers.
Does this part support CAN FD physical layer compliance with ISO 11898-2?
CY8C4149AZES558XQLA1 implements the CAN FD protocol layer and data link layer per ISO 11898-1:2015 but does not integrate the physical transceiver. An external ISO 11898-2-compliant transceiver (e.g., Infineon TLE9251VS) must be used to meet full physical layer requirements including dominant/recessive voltage thresholds and bus fault protection.
How many CAPSENSE™ electrodes can be supported simultaneously?
The MSC block supports up to 32 self-capacitance or 16 mutual-capacitance electrodes concurrently, limited by available GPIO and scan time budget. With 84 total GPIO pins and hardware-accelerated SmartSense, full 32-key touchpad scanning completes in under 25 ms at 100 Hz refresh rate while maintaining >5:1 SNR in wet conditions.
Is ModusToolbox™ required for development, or can Keil MDK be used?
ModusToolbox™ is recommended for full peripheral configuration (especially CAPSENSE™ SmartSense and CAN FD register setup), but Keil MDK-ARM v5.36+ is fully supported via Infineon's PDL (Peripheral Driver Library) and CMSIS-compliant startup files. Debugging works with standard SWD probes; no proprietary toolchain lock-in exists.
CY8C4149AZES558XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 84
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4149AZES558XQLA1 FAQ
1.How can I place an order for CY8C4149AZES558XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4149AZES558XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4149AZES558XQLA1 reliable?
The price and inventory of CY8C4149AZES558XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZES558XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4149AZES558XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149AZES558XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4149AZES558XQLA1?
CY8C4149AZES558XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4149AZES558XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4149AZES558XQLA1?
For technical support, including CY8C4149AZES558XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZES558XQLA1 requirements.
6.How does Aetrix verify that CY8C4149AZES558XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4149AZES558XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZES558XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4149AZES558XQLA1?
All CY8C4149AZES558XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZES558XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4149AZES558XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4149AZES558XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4149AZES558XQLA1 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
