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Infineon Technologies CY8C4149AZES568XQLA1
- Part No.:
- CY8C4149AZES568XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C4149AZES568XQLA1.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,191
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Product details
Overview
CY8C4149AZES568XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-grade PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch and real-time control.
For engineers reviewing the CY8C4149AZES568XQLA1 datasheet, CY8C4149AZES568XQLA1 pinout, CY8C4149AZES568XQLA1 application, or CY8C4149AZES568XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.
Technical Context
The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and dedicated CAN FD controller - enabling concurrent I2C/SPI/UART/LIN and high-speed CAN FD communication without CPU intervention. Its programmable analog subsystem includes two CTBm opamps with Deep Sleep support and a 12-bit SAR ADC with built-in temperature sensor and channel sequencer.
Digital flexibility is delivered via eight TCPWM blocks supporting center-aligned PWM and quadrature decoding, plus Smart I/O for Boolean logic on port signals. The MSC block implements multi-sense capacitive sensing with hardware-accelerated noise rejection and water-tolerance - critical for automotive interior touch panels exposed to condensation or spills.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with <20 ns interrupt latency for motor safety loops. |
| Memory | 384 KB flash (with Read Accelerator), 32 KB SRAM - supports secure OTA updates and dual-bank firmware rollback. |
| CAN FD | Up to 5 Mbps data rate with ISO 11898-1:2015 compliance - meets automotive ECU requirements for high-bandwidth diagnostics and ADAS sensor fusion. |
| SAR ADC | 12-bit, 1 Msps, differential/single-ended, with signal averaging - delivers 70 dB SNR for precision battery voltage and temperature monitoring. |
| CAPSENSE™ MSC | Multi-sense converter with >5:1 SNR and automatic SmartSense tuning - eliminates manual calibration for production-line touch panel deployment. |
| Power Modes | Deep Sleep at 2.5 µA digital + operational analog - sustains wake-on-touch or wake-on-CAN while preserving system state. |
| GPIO Count | Up to 84 pins, all reconfigurable as CAPSENSE™/analog/digital - reduces BOM count by eliminating external sense resistors or level shifters. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™ CSD/CSX, analog input to SAR ADC, or high-drive digital output (25 mA sink/source). |
| P1[0]–P1[7] | Port 1 GPIO bank | Configurable as CAN FD TX/RX, SCB0 I2C SDA/SCL, or TCPWM capture inputs with glitch filtering. |
| P2[0]–P2[7] | Port 2 GPIO bank | Supports LCD segment drive (up to 32 segments), CTBm opamp outputs, or comparator reference inputs. |
| VDDIO0–VDDIO3 | I/O power domains | Independent 1.71–5.5 V supplies per port group - enables mixed-voltage interfacing (e.g., 3.3 V MCU + 5 V sensors). |
| VDDD/VDDA | Digital/analog core supply | Separate 1.71–5.5 V rails with internal LDO regulation - isolates analog measurement accuracy from digital switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Crypto Accelerator | AES-128/256, SHA-256, TRNG, and CRC engines - enables secure boot and encrypted CAN FD message signing without CPU overhead. |
| Smart I/O Logic | Programmable Boolean gates on GPIO paths - implements debounce, edge detection, or pulse stretching in hardware, freeing CPU cycles. |
| MSC with SmartSense | Auto-calibrating CAPSENSE™ engine - achieves production-ready touch performance without factory tuning or firmware adjustments. |
| Reconfigurable SCBs | Five independent blocks supporting runtime I2C/SPI/UART/LIN mode switching - simplifies protocol migration during ECU development. |
| Deep Sleep Analog Retention | Opamps, comparators, and MSC remain active at 2.5 µA system current - enables always-on touch wake and low-power sensor monitoring. |
Applications
| Body Control Module (BCM) | Automotive Touch HMI |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and lighting sequences in modern vehicles. IC Role / Device Role / Timing Role: Main MCU executing ASAM-compliant diagnostic stacks, managing LIN slave nodes, and coordinating CAN FD-based actuator commands. Use Value: Integrated CAN FD + 8 TCPWM blocks enable synchronized PWM dimming of LED ambient lighting while maintaining 5 Mbps diagnostic throughput. | Use Scenario: Capacitive touch interface for infotainment center, climate control, or steering-wheel controls in passenger cabins. IC Role / Device Role / Timing Role: CAPSENSE™ master with MSC block performing real-time water-tolerant gesture recognition and proximity wake-up. Use Value: >5:1 SNR and SmartSense auto-tuning eliminate field failures due to condensation or finger moisture - reducing warranty claims. |
| Electric Power Steering (EPS) Sensor Hub | Battery Management System (BMS) Monitor |
Use Scenario: Aggregation and preprocessing of torque, angle, and motor current signals for EPS ECUs. IC Role / Device Role / Timing Role: Signal conditioner with 12-bit SAR ADC (1 Msps), opamp buffering, and hardware-averaged temperature sensing. Use Value: On-chip ADC averaging and opamp gain stages reduce external signal conditioning components by 40% versus discrete solutions. | Use Scenario: Cell voltage, pack temperature, and isolation monitoring in 12–48 V automotive auxiliary battery systems. IC Role / Device Role / Timing Role: Safety-monitoring MCU with cryptographic acceleration for secure firmware updates and tamper-evident logging. Use Value: AES-256 and TRNG support ISO 26262 ASIL-B software partitioning - enabling certified functional safety without external security ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core, 112 MHz, no integrated CAPSENSE™, requires external touch controller | Targeted at higher-performance motor control; lacks native capacitive sensing capability | Select when floating-point math or Ethernet is required; avoid if touch HMI integration is primary goal. |
| Renesas RL78/F14 | RL78 core, 32 MHz, 256 KB flash, no CAN FD, only basic capacitive sensing (no SmartSense) | Cost-optimized for simple BCM functions; limited to CAN 2.0B and lower SNR touch | Select for legacy CAN-only designs with tight cost constraints; not suitable for water-tolerant touch or 5 Mbps diagnostics. |
Compared with S32K144W and RL78/F14, CY8C4149AZES568XQLA1 uniquely combines CAN FD, hardware-accelerated CAPSENSE™ with SmartSense, and Deep Sleep analog retention - making it optimal for integrated automotive HMI and sensor-hub applications where mixed-signal integration reduces PCB area and validation effort.
Availability
CY8C4149AZES568XQLA1 is available at Aetrix Electronics and suitable for body control modules, automotive touch HMIs, electric power steering sensor hubs, and battery management system monitors requiring stable component supply across automotive production lifecycles.
Supply support for CY8C4149AZES568XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
CY8C4149AZES568XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding integrated analog/digital reconfigurability, functional safety support, and robust capacitive sensing.
FAQ
What is the maximum operating temperature grade for CY8C4149AZES568XQLA1?
CY8C4149AZES568XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. This rating is verified per test condition HTOL (High-Temperature Operating Life) and TC (Temperature Cycling), and applies to the full 100-pin TQFP package configuration with specified voltage and load conditions.
Does CY8C4149AZES568XQLA1 support CAN FD with ISO 11898-1:2015 physical layer compliance?
Yes - the integrated CAN FD controller supports bit rates up to 5 Mbps and complies with ISO 11898-1:2015 for data phase timing, including flexible data-rate switching, CRC-17/21 calculation, and error confinement. External transceiver (e.g., TJA1044T) is required for physical layer interface.
Can all 84 GPIOs be used simultaneously for CAPSENSE™ sensing?
No - while any GPIO can be assigned to CAPSENSE™, the Multi-Sense Converter (MSC) block supports up to 32 simultaneous CSD (capacitive sigma-delta) channels or 16 CSX (capacitive spread-spectrum) channels per scan. Total pin count is constrained by MSC resource allocation, not GPIO quantity.
Is ModusToolbox™ required for development with CY8C4149AZES568XQLA1?
ModusToolbox™ is the recommended and fully supported IDE, providing PDL drivers, CAPSENSE™ Tuner, and CAN FD configuration tools. However, the device is Arm®-compliant and can be programmed using GCC-based toolchains (e.g., GNU Arm Embedded Toolchain) with appropriate linker scripts and startup code from Infineon's PDL GitHub repository.
CY8C4149AZES568XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 84
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4149AZES568XQLA1 FAQ
1.How can I place an order for CY8C4149AZES568XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4149AZES568XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4149AZES568XQLA1 reliable?
The price and inventory of CY8C4149AZES568XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZES568XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4149AZES568XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149AZES568XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4149AZES568XQLA1?
CY8C4149AZES568XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4149AZES568XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4149AZES568XQLA1?
For technical support, including CY8C4149AZES568XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZES568XQLA1 requirements.
6.How does Aetrix verify that CY8C4149AZES568XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4149AZES568XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZES568XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4149AZES568XQLA1?
All CY8C4149AZES568XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZES568XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4149AZES568XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4149AZES568XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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