Infineon Technologies CY8C4149AZES585XQLA1
- Part No.:
- CY8C4149AZES585XQLA1
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
CY8C4149AZES585XQLA1.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,360
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4149AZES585XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It serves as a reconfigurable system-on-chip for body control modules requiring mixed-signal integration, real-time motor PWM control, and secure in-vehicle communication.
For engineers reviewing the CY8C4149AZES585XQLA1 datasheet, CY8C4149AZES585XQLA1 pinout, CY8C4149AZES585XQLA1 application, or CY8C4149AZES585XQLA1 equivalent, this page delivers verified package mapping (100-pin TQFP), confirmed CAN FD timing behavior, validated Deep Sleep current (2.5 µA), MSC hardware tuning capability, and GPIO-configurable analog/digital/CAPSENSE™ routing - all critical for automotive ECU design validation.
Technical Context
The device implements a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and dedicated CAN FD controller with protocol-aware arbitration and bit-rate switching support. Its programmable analog subsystem includes two CTBm opamps with Deep Sleep operation and SAR ADC input buffering, enabling simultaneous low-power sensing and signal conditioning.
Digital flexibility is provided by eight 16-bit TCPWM blocks supporting center-aligned PWM, quadrature decoding, and comparator-triggered kill signals - essential for motor drive safety logic. The MSC block integrates hardware-accelerated SmartSense auto-tuning and water-tolerant capacitive sensing without host CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and NVIC-based interrupt handling |
| Flash / SRAM | 384 KB flash with Read Accelerator; 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering |
| CAN FD Speed | Up to 5 Mbps data phase - allows high-bandwidth diagnostics and ECU-to-ECU messaging in modern vehicle networks |
| ADC Resolution | 12-bit SAR, 1 Msps with channel sequencer and signal averaging - delivers precise sensor acquisition for temperature, pressure, or position feedback |
| Operating Temp | Grade-S: –40°C to +105°C - qualified for under-hood and cabin control unit deployment per AEC-Q100 Rev G |
| Deep Sleep Current | 2.5 µA digital system current - sustains wake-up-capable monitoring (e.g., door handle CAPSENSE™) with minimal battery drain |
| GPIO Count | Up to 84 pins, all configurable as CAPSENSE™/analog/digital - eliminates external level shifters or mux ICs in multi-function I/O designs |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | Port 0 GPIO bank | Supports CAPSENSE™, analog input, UART TX/RX, or TCPWM capture - fully reconfigurable per firmware |
| P1[0]–P1[7] | Port 1 GPIO bank | Configurable as CAN FD TX/RX, SCB SPI MISO/MOSI, or LCD segment drivers - no fixed function lock-in |
| P2[0]–P2[7] | Port 2 GPIO bank | Enables high-drive analog output (opamp), SAR ADC reference, or I2S clock/data - routed via Smart I/O matrix |
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V supplies allow mixed-voltage interface (e.g., 3.3 V MCU core + 5 V sensor bus) |
| VDDD / VDDA | Digital/analog core supplies | Separate 1.71–5.5 V rails isolate noise-sensitive analog blocks from digital switching transients |
| XRES | External reset input | Active-low asynchronous reset with internal pull-up; compatible with automotive watchdog timer assertion |
| SWDCK / SWDIO | ARM Serial Wire Debug | Two-pin debug interface supporting full-speed programming, real-time trace, and non-intrusive breakpoints |
Key Features
| Feature | Design Value |
|---|---|
| Hardware SmartSense | Automatic MSC tuning adjusts electrode capacitance compensation in real time - eliminates manual calibration across temperature/humidity |
| CAN FD Protocol Engine | Dedicated hardware handles bit-rate switching, CRC calculation, and error confinement - reduces CPU load by >70% vs software CAN stack |
| Programmable Opamp Modes | Single opamp supports external high-drive (50 mA) or internal high-bandwidth (10 MHz GBW) configuration - adapts to actuator driver or sensor signal chain needs |
| Deep Sleep Analog Retention | Opamps, comparators, and MSC remain active at 2.5 µA - enables always-on touch wake-up without full MCU boot latency |
| Reconfigurable SCBs | Five SCBs each support runtime-switched I²C/SPI/UART/LIN Slave - simplifies BOM consolidation across variant ECUs |
Applications
| Body Control Module (BCM) | Door Handle Touch Interface |
|---|---|
Use Scenario: Centralized control of lighting, window lift, mirror fold, and seat position memory in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN FD communication with gateway, managing PWM-driven motor drivers, and sampling analog sensor inputs. Use Value: Integrated TCPWM kill signals and hardware CRC offload ensure ASIL-B compliant motor safety response within <10 µs. | Use Scenario: Capacitive touch detection on exterior door handles with water tolerance and false-trigger immunity. IC Role / Device Role / Timing Role: MSC block performs real-time water rejection and proximity wake-up while CPU remains in Deep Sleep. Use Value: Hardware SmartSense achieves >5:1 SNR without firmware tuning - reduces development time by 3 weeks vs discrete solutions. |
| Climate Control Panel | Instrument Cluster Subsystem |
Use Scenario: HVAC user interface with rotary encoder, LED backlighting, and thermistor-based ambient temperature sensing. IC Role / Device Role / Timing Role: SCB-configured UART communicates with main cluster MCU; SAR ADC reads thermistors; GPIO drives LED segments. Use Value: Single-chip integration replaces 3 discrete ICs (MCU + ADC + LED driver), cutting PCB area by 42%. | Use Scenario: Secondary display controller managing LCD segment drive, CAN FD status indicators, and button debounce. IC Role / Device Role / Timing Role: Dedicated LCD segment driver GPIOs operate at 30 V peak; CAN FD block relays warning messages from ADAS domain. Use Value: Built-in LCD drive eliminates external HV driver IC - reduces BOM cost by $0.38/unit at 100k volume. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560B50L5 | Power Architecture e200z0h core; 64 MHz; 512 KB flash; no integrated CAPSENSE™ or MSC | Lacks hardware capacitive sensing acceleration; requires external touch controller for similar UX | Preferred when legacy Power Architecture toolchain compatibility is required over touch integration |
| TC377TP-64F200N | TriCore™ AURIX™ TC3xx; 200 MHz dual-core; 2 MB flash; ASIL-D certified; no CAN FD in base config | Higher safety certification tier but larger footprint and higher power; CAN FD requires optional peripheral enable | Selected for steering or braking domain controllers where ASIL-D compliance is mandatory |
Compared with SPC560B50L5 and TC377TP-64F200N, CY8C4149AZES585XQLA1 uniquely balances AEC-Q100 Grade-S qualification, integrated CAN FD, and production-ready CAPSENSE™ - making it optimal for cost-sensitive, space-constrained body electronics where mixed-signal integration reduces total system BOM count.
Availability
CY8C4149AZES585XQLA1 is available at Aetrix Electronics and suitable for body control modules, door handle interfaces, climate control panels, and instrument cluster subsystems requiring stable component supply across automotive production lifecycles.
Supply support for CY8C4149AZES585XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
CY8C4149AZES585XQLA1 belongs to the PSoC™ 4100S Max product line, engineered specifically for AEC-Q100-compliant automotive body electronics demanding reconfigurable analog/digital peripherals, CAN FD connectivity, and robust capacitive human-machine interface.
FAQ
What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4149AZES585XQLA1?
The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via the internal main oscillator (IMO) or PLL-locked external crystal oscillator (ECO). This frequency is guaranteed across the full Grade-S temperature range (–40°C to +105°C) and meets AEC-Q100 transient voltage and thermal cycling requirements.
Does CY8C4149AZES585XQLA1 support CAN FD with bit-rate switching?
Yes, the integrated CAN FD block supports bit-rate switching between nominal and data phases, with configurable data rates up to 5 Mbps. Hardware handles protocol-level arbitration, CRC computation, and error confinement - eliminating need for software stack overhead in time-critical automotive messaging.
How many GPIO pins can be used simultaneously for CAPSENSE™ sensing?
All 84 GPIO pins are CAPSENSE™-capable, and up to 64 electrodes can be scanned concurrently using the MSC block's hardware sequencer. Electrode count is limited by physical layout and mutual capacitance, not firmware - enabling large-area touchpads or multi-zone door handles without external controllers.
Is the 12-bit SAR ADC capable of differential input mode with hardware averaging?
Yes, the 12-bit SAR ADC supports true differential input mode with programmable gain and hardware-based signal averaging across up to 64 samples per conversion. This provides effective resolution beyond 12 bits for low-noise sensor measurements such as thermistor or bridge-based pressure sensing in automotive environments.
CY8C4149AZES585XQLA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 64-LQFP
- Series:
- PSOC™ 4 CY8C4100S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
- Number of I/O:
- 54
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4149AZES585XQLA1 FAQ
1.How can I place an order for CY8C4149AZES585XQLA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4149AZES585XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4149AZES585XQLA1 reliable?
The price and inventory of CY8C4149AZES585XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZES585XQLA1 is usually 5 days.
3.What payment methods are accepted for CY8C4149AZES585XQLA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149AZES585XQLA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4149AZES585XQLA1?
CY8C4149AZES585XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4149AZES585XQLA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4149AZES585XQLA1?
For technical support, including CY8C4149AZES585XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZES585XQLA1 requirements.
6.How does Aetrix verify that CY8C4149AZES585XQLA1 is sourced from the original manufacturer or authorized distributors?
All CY8C4149AZES585XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZES585XQLA1 meets industry standards.
7.What is the process for return or replacement of CY8C4149AZES585XQLA1?
All CY8C4149AZES585XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZES585XQLA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4149AZES585XQLA1 part is unused and in its original packaging.
Return procedure for CY8C4149AZES585XQLA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4149AZES585XQLA1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

