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Infineon Technologies CY8C4149AZSS555XQLA1

Part No.:
CY8C4149AZSS555XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixCY8C4149AZSS555XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,524

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Product details

Overview

CY8C4149AZSS555XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules, smart sensors, and automotive HMI systems requiring robust capacitive touch in harsh environments.

For engineers reviewing the CY8C4149AZSS555XQLA1 datasheet, CY8C4149AZSS555XQLA1 pinout, CY8C4149AZSS555XQLA1 application, or CY8C4149AZSS555XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, memory subsystem (384 KB flash with Read Accelerator, 32 KB SRAM), and heterogeneous peripherals including five reconfigurable Serial Communication Blocks (SCBs), eight TCPWM units with quadrature decode and kill-signal triggering, and a dedicated CAN FD controller supporting ISO 11898-1:2015 compliant bit rates up to 5 Mbps.

Its analog subsystem includes two continuous-time opamps with Deep Sleep operation, a 12-bit SAR ADC with integrated temperature sensor and channel sequencer, and a Multi-Sense Converter (MSC) block optimized for high-SNR (>5:1), water-tolerant capacitive sensing - all accessible via any of its 84 programmable GPIOs with configurable drive strength and slew rate.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering.
CAN FD SpeedUp to 5 Mbps data phase - meets high-bandwidth vehicle network requirements for ADAS sensor fusion and ECU coordination.
SAR ADC12-bit, 1 Msps, differential/single-ended, with hardware averaging - delivers precision sensor signal acquisition with noise suppression.
Deep Sleep Current2.5 µA digital system current - enables always-on wake-on-touch or wake-on-CAN while preserving battery life in parked state.
CAPSENSE™ SNR>5:1 signal-to-noise ratio - ensures reliable touch detection under condensation, glove use, or electromagnetic interference in automotive cabins.
GPIO CountUp to 84 pins, all reconfigurable for analog/CAPSENSE™/digital - eliminates external muxing and simplifies PCB routing for multi-function I/O consolidation.
Operating TempGrade-S: –40°C to +105°C - qualified for under-hood and dashboard-mounted applications per AEC-Q100 Rev G.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, wettable flank capable for automated optical inspection (AOI).

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O power supply domainsEight independent 1.71–5.5 V I/O banks enable mixed-voltage interfacing (e.g., 3.3 V CAN transceiver + 5 V display driver).
P0.0–P9.7Programmable GPIOsAll 84 pins support CAPSENSE™, analog input, digital logic, or LCD segment drive - no fixed-function pin constraints.
CANFD_TX / CANFD_RXDedicated CAN FD physical layer interfaceHardwired to internal CAN FD controller; supports dominant/recessive level translation and bus fault detection per ISO 11898-2.
XTAL_IN / XTAL_OUTExternal crystal oscillator connectionSupports 4–33 MHz ECO for precise clock generation; PLL locks to generate stable 48 MHz system clock.
SWDCLK / SWDIOARM Serial Wire Debug interfaceTwo-pin debug port enabling non-intrusive firmware update, real-time trace, and boundary scan without halting CPU operation.

Key Features

FeatureDesign Value
SmartSense auto-tuningHardware-accelerated CAPSENSE™ calibration eliminates manual threshold tuning and compensates for environmental drift in production.
Deep Sleep analog retentionOpamps and comparators remain active at 2.5 µA system current - enables continuous touch monitoring or analog watchdog during low-power states.
Reconfigurable SCBsFive independent serial blocks each support run-time switching between I²C, SPI, UART, or LIN Slave - reduces BOM count and design iteration cycles.
TCPWM kill-signal triggeringComparator outputs directly assert hardware kill signals to TCPWM blocks - provides sub-microsecond motor fault response for functional safety-critical drives.
Crypto accelerationDedicated AES-128/256, SHA-256, TRNG, and CRC engines offload security processing - enables secure boot and OTA updates without CPU overhead.

Applications

Body Control Module (BCM)Automotive Touch HMI

Use Scenario: Centralized control of door locks, lighting, wipers, and window lifters in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, managing LIN slave nodes, and coordinating CAN FD messaging with gateway ECUs.

Use Value: Integrated CAN FD (5 Mbps) and 84 GPIOs reduce external transceivers and discrete logic, lowering system cost and board area by >15% versus dual-chip solutions.

Use Scenario: Capacitive touch interface for infotainment panels, climate controls, and steering-wheel buttons exposed to moisture and temperature extremes.

IC Role / Device Role / Timing Role: CAPSENSE™ controller with SmartSense and MSC block performing real-time water rejection and SNR optimization.

Use Value: >5:1 SNR and automatic hardware tuning ensure >99.5% touch accuracy under condensation or glove use - eliminating field returns due to false touches.

Smart Sensor NodeMotor Control Subsystem

Use Scenario: Distributed cabin air quality, occupancy, or ambient light sensing with local decision-making and CAN FD reporting.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating ADC inputs (temperature, humidity, IR), running lightweight ML inference, and transmitting alerts over CAN FD.

Use Value: 12-bit SAR ADC with hardware averaging and Deep Sleep operation (2.5 µA) extend battery life to >5 years in wireless sensor nodes.

Use Scenario: Fan, pump, or seat-motor control requiring precise PWM timing, fault detection, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time motor controller using TCPWM quadrature decoding, comparator-triggered kill signals, and on-die temperature sensing.

Use Value: Hardware kill-path latency <100 ns prevents MOSFET shoot-through during overcurrent events - meeting ASIL-B functional safety requirements without external supervisors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F @ 112 MHz; 512 KB flash; includes Ethernet MAC but no integrated CAPSENSE™ or MSC block.Targets gateway/routing functions; lacks hardware-accelerated capacitive sensing - requires external touch controller for HMI.Select when Ethernet connectivity or floating-point performance is required; not suitable for cost-sensitive touch-centric designs.
Renesas RH850/F1L32-bit RXv2 core @ 120 MHz; 2 MB flash; CAN FD + LIN + FlexRay; no integrated analog front-end or CAPSENSE™.Focused on powertrain and chassis control; requires external ADC/opamp for sensor conditioning.Choose for high-reliability engine management where FlexRay or ASIL-D certification is mandatory; not optimized for touch or low-power sensing.

Compared with NXP S32K144 and Renesas RH850/F1L, CY8C4149AZSS555XQLA1 uniquely combines CAN FD, Deep Sleep analog retention, and hardware CAPSENSE™ tuning in a single die - reducing component count and qualification effort for body electronics and HMI applications.

Availability

CY8C4149AZSS555XQLA1 is available at Aetrix Electronics and suitable for body control modules, automotive touch HMIs, smart sensor nodes, and motor control subsystems requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4149AZSS555XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C41xx PSoC™ 4100S Max is part of Infineon's automotive-qualified programmable system-on-chip platform designed specifically for intelligent, sensor-rich, and human-machine interface applications in vehicles.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4149AZSS555XQLA1?

The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via internal PLL multiplication from the 4–33 MHz external crystal oscillator (ECO) or internal main oscillator (IMO). This frequency is fully supported across all operating voltage ranges (1.71–5.5 V) and temperature grades (–40°C to +105°C).

Does CY8C4149AZSS555XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes, the integrated CAN FD block supports data rates up to 5 Mbps in the data phase and is compliant with ISO 11898-1:2015. It includes bit-rate switching, flexible data-length configuration (up to 64 bytes), and built-in error counters and bus-off recovery - validated per AEC-Q100 Grade-S requirements.

How many GPIO pins can be used simultaneously for CAPSENSE™ sensing?

All 84 GPIO pins are fully reconfigurable for CAPSENSE™ sensing, with no hardware limitation on concurrent channels. The Multi-Sense Converter (MSC) block supports up to 64 simultaneous capacitive sensing channels using hardware-accelerated scanning and SmartSense auto-tuning.

Is the 12-bit SAR ADC capable of differential measurements and hardware averaging?

Yes, the SAR ADC supports true differential input mode with programmable gain, and includes a hardware channel sequencer that performs up to 64-sample signal averaging per conversion. This capability is active in both Active and Deep Sleep modes, enabling high-precision, low-noise sensor readings without CPU intervention.

CY8C4149AZSS555XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
64-LQFP
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4149AZSS555XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4149AZSS555XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY8C4149AZSS555XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149AZSS555XQLA1 is usually 5 days.

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CY8C4149AZSS555XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149AZSS555XQLA1?

For technical support, including CY8C4149AZSS555XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149AZSS555XQLA1 requirements.

6.How does Aetrix verify that CY8C4149AZSS555XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149AZSS555XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149AZSS555XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149AZSS555XQLA1?

All CY8C4149AZSS555XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149AZSS555XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149AZSS555XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149AZSS555XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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