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Infineon Technologies CY8C4149LDAS583XQLA1

Part No.:
CY8C4149LDAS583XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4149LDAS583XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,841

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Product details

Overview

CY8C4149LDAS583XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU running at 48 MHz, featuring 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, 12-bit 1-Msps SAR ADC, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules requiring robust capacitive touch, motor PWM control, and secure communication.

For engineers reviewing the CY8C4149LDAS583XQLA1 datasheet, CY8C4149LDAS583XQLA1 pinout, CY8C4149LDAS583XQLA1 application, or CY8C4149LDAS583XQLA1 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases in automotive systems, and confirmed alternative parts with documented functional differences.

Technical Context

The device integrates a 48-MHz Arm® Cortex®-M0+ core with dual-clock domain support (IMO ±2%, WCO 32 kHz, ECO 4–33 MHz with PLL), enabling precise timing for CAN FD and TCPWM-based motor control. Its programmable analog subsystem includes two opamps operable in Deep Sleep mode and a temperature-sensor-integrated SAR ADC with differential input and channel sequencer.

Digital flexibility is delivered via five reconfigurable Serial Communication Blocks (SCBs) supporting I²C/SPI/UART/LIN, eight 16-bit TCPWM blocks with quadrature decode and comparator-triggered kill signals, and hardware crypto accelerators for AES, SHA, TRNG, and CRC - all coordinated through a single-layer AHB-Lite interconnect and NVIC-based interrupt routing.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and 32-bit data path.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex automotive firmware with fast code execution and data buffering.
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth vehicle network requirements for ADAS sensor fusion and gateway applications.
SAR ADC12-bit, 1-Msps, differential/single-ended, with built-in temperature sensor - provides accurate battery monitoring and thermal management without external components.
CAPSENSE™ BlockMulti-Sense Converter (MSC) with >5:1 SNR and water tolerance - enables reliable touch interfaces in humid or wet automotive cabin environments.
Operating TempGrade-S: –40°C to +105°C - certified for under-hood and instrument cluster deployment per AEC-Q100 Rev G.
GPIO CountUp to 84 pins, all configurable as analog/digital/CAPSENSE™ - allows flexible PCB layout and multi-function pin reuse across variants.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO7I/O Power Supply BanksIndependent 1.71–5.5 V supplies per bank enable mixed-voltage interfacing (e.g., 3.3 V MCU logic with 5 V sensors).
P0[0]–P9[7]Programmable GPIOAll pins support CAPSENSE™, analog input, digital logic, LCD segment drive, and Smart I/O reconfiguration.
XTAL_IN / XTAL_OUTExternal Crystal Oscillator Input/OutputSupports 4–33 MHz ECO for precise clocking; required for CAN FD bit timing accuracy and USB-like timing stability.
CANFD_TX / CANFD_RXCAN FD Transceiver InterfaceDedicated differential pair with internal termination and slew-rate control - eliminates need for external transceiver in basic node designs.
SWDCLK / SWDIOARM Serial Wire Debug InterfaceTwo-pin debug port supporting full JTAG/SWD functionality for in-circuit programming and real-time trace debugging.

Key Features

FeatureDesign Value
Deep Sleep Mode Current2.5 µA digital system current with operational analog - enables always-on touch wake-up and low-power sensor polling in battery-backed modules.
SmartSense Auto-TuningHardware-accelerated CAPSENSE™ calibration - eliminates manual tuning effort and ensures consistent button response across temperature and humidity variations.
Hardware Crypto EngineDedicated AES-128/256, SHA-256, TRNG, and CRC accelerators - offloads security operations from CPU, reducing latency and power in OTA update and key exchange workflows.
TCPWM Kill Signal TriggeringComparator-driven hardware fault shutdown - enables sub-microsecond motor overcurrent protection without CPU intervention, critical for ISO 26262 ASIL-B compliance.
Reconfigurable SCBsFive independent blocks each supporting I²C/SPI/UART/LIN at runtime - simplifies BOM consolidation and enables field-upgradable communication protocols.

Applications

Body Control Module (BCM)Instrument Cluster Interface

Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing LIN slave nodes, PWM-driven LED dimming, and CAPSENSE™-based soft-touch controls.

Use Value: Single-chip integration reduces component count by eliminating discrete touch controllers and LIN transceivers while maintaining AEC-Q100 Grade-S reliability.

Use Scenario: Driving analog gauges and TFT displays with tactile feedback in driver-facing dashboards.

IC Role / Device Role / Timing Role: Real-time graphics rendering co-processor with LCD segment drive capability and CAN FD telemetry ingestion.

Use Value: On-chip LCD drive supports up to 48 segments directly, and CAN FD ingestion enables <100 µs latency for speedometer updates from powertrain ECUs.

Motorized Seat ControllerRoof Module with Sunroof & Panoramic Glass

Use Scenario: Precision positioning of seat motors using hall-effect feedback and current sensing.

IC Role / Device Role / Timing Role: Closed-loop motion controller with 16-bit TCPWM for trapezoidal commutation and SAR ADC for phase current sampling.

Use Value: Quadrature decoder input and comparator-triggered kill signals ensure safe stall detection and emergency stop within 2 µs response time.

Use Scenario: Managing sunroof actuation, ambient light sensing, and glass tint control in premium vehicle roofs.

IC Role / Device Role / Timing Role: Multi-sensor hub fusing CAPSENSE™ gestures, ambient light ADC readings, and CAN FD status commands.

Use Value: MSC block's water tolerance prevents false triggers during rain exposure, and SmartSense maintains gesture accuracy across condensation layers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WArm® Cortex®-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or LCD drive.Targeted at gateway and safety-critical chassis control; lacks native capacitive touch support.Select when higher CPU performance and ASIL-D functional safety certification are required over integrated analog UX features.
Renesas RL78/F1416-bit RL78 core, 32 MHz; offers CAN FD and low-power modes but no hardware crypto or programmable analog blocks.Focused on cost-sensitive body electronics with minimal firmware complexity.Choose for legacy migration paths where toolchain familiarity and lower BOM cost outweigh need for advanced UX peripherals.

Compared with S32K144W and RL78/F14, CY8C4149LDAS583XQLA1 uniquely combines automotive-grade programmable analog (opamps, MSC), hardware crypto, and CAPSENSE™ in a single M0+ platform - making it optimal for feature-rich human-machine interface (HMI) nodes where integration density and touch reliability are design priorities.

Availability

CY8C4149LDAS583XQLA1 is available at Aetrix Electronics and suitable for body control modules, instrument clusters, motorized seat controllers, and roof modules requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4149LDAS583XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4149LDAS583XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics requiring integrated capacitive sensing, motor control, secure communication, and AEC-Q100 Grade-S operation.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4149LDAS583XQLA1?

The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via the internal main oscillator (IMO) or an external crystal oscillator (ECO) with integrated PLL. This frequency is fully supported across the entire Grade-S temperature range (–40°C to +105°C) and is validated for AEC-Q100 compliance.

Does CY8C4149LDAS583XQLA1 support CAN FD without an external transceiver?

CY8C4149LDAS583XQLA1 integrates a CAN FD controller with dedicated TX/RX signal pins and internal bus termination, but requires an external CAN FD transceiver (e.g., Infineon TLE9251VS) for physical layer compliance and ESD protection. The internal logic handles protocol framing, bit timing, and error handling up to 5 Mbps.

How many CAPSENSE™ buttons can be implemented using the MSC block?

The Multi-Sense Converter (MSC) block supports up to 64 capacitive sensing channels, enabling implementation of 64 independent buttons, sliders, or proximity sensors. Channel count is limited only by available GPIO pins and layout constraints - all 84 GPIOs are CAPSENSE™-capable with hardware-accelerated SmartSense tuning.

Is the 12-bit SAR ADC capable of simultaneous sampling across multiple channels?

No, the 12-bit SAR ADC does not support true simultaneous sampling. It uses a channel sequencer with programmable sample-and-hold timing, allowing rapid sequential acquisition across up to 16 channels with hardware-triggered averaging. For synchronized multi-channel capture, external analog multiplexing or external ADCs are required.

CY8C4149LDAS583XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4149LDAS583XQLA1 FAQ

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5.How can I obtain technical support or documentation for CY8C4149LDAS583XQLA1?

For technical support, including CY8C4149LDAS583XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149LDAS583XQLA1 requirements.

6.How does Aetrix verify that CY8C4149LDAS583XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149LDAS583XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149LDAS583XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149LDAS583XQLA1?

All CY8C4149LDAS583XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149LDAS583XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149LDAS583XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149LDAS583XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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