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Infineon Technologies CY8C4149LDES583XQLA1

Part No.:
CY8C4149LDES583XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4149LDES583XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,468

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Product details

Overview

CY8C4149LDES583XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), 12-bit 1-Msps SAR ADC, dual opamps with Deep Sleep operation, and multi-sense capacitive sensing (MSC) with >5:1 SNR. It targets body control modules and in-vehicle human-machine interface systems requiring robust capacitive touch and real-time motor control.

For engineers reviewing the CY8C4149LDES583XQLA1 datasheet, CY8C4149LDES583XQLA1 pinout, CY8C4149LDES583XQLA1 application, or CY8C4149LDES583XQLA1 equivalent, key selection criteria include CAN FD timing compliance, MSC water-tolerance capability, Deep Sleep analog retention (2.5 µA system current), and GPIO reconfigurability across CAPSENSE™/ADC/digital functions.

Technical Context

The device implements a tightly coupled system-on-chip architecture with a single-layer AHB-Lite interconnect, enabling concurrent access to flash (with Read Accelerator), SRAM, and peripherals including five reconfigurable Serial Communication Blocks (SCBs) supporting I²C/SPI/UART/LIN, eight TCPWM blocks with quadrature decode and comparator-triggered kill signals, and a dedicated CAN FD controller compliant with ISO 11898-1:2015.

Analog subsystem integration includes two CTBm opamps supporting high-drive external mode and ADC input buffering, a temperature-sensor-integrated SAR ADC with channel sequencer and signal averaging, and two low-power comparators operational in Deep Sleep - all accessible via up to 84 programmable GPIOs with configurable drive strength and slew rate.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz - enables deterministic real-time execution for automotive control loops with <100 ns interrupt latency.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex firmware with bootloader, OTA update partitioning, and real-time data buffering.
CAN FD SpeedUp to 5 Mbps - meets high-bandwidth requirements for ADAS sensor fusion and domain controller communication.
SAR ADC12-bit, 1-Msps, differential/single-ended, with sequencer & signal averaging - delivers accurate battery voltage, temperature, and position sensing under EMI noise.
Deep Sleep Current2.5 µA digital system current with operational analog - enables always-on capacitive wake-up and low-power sensor monitoring without external supervisors.
CAPSENSE™ SNR>5:1 signal-to-noise ratio with water tolerance - ensures reliable touch detection on wet dashboards or steering wheels per ISO 10605 ESD immunity.
GPIO CountUp to 84 pins, all reconfigurable for CAPSENSE™/ADC/digital - eliminates external multiplexers and reduces BOM count in multi-function HMI designs.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™ CSD/CSX, SAR ADC input, SCB I²C/SPI, and TCPWM capture - configurable per-pin drive mode and slew rate.
P1[0]–P1[7]Port 1 GPIO bankIncludes CAN FD TX/RX (P1[0]/P1[1]), WCO input (P1[2]), ECO input (P1[3]), and Smart I/O logic inputs - enables hardware-based signal conditioning offload.
VDDIO0–VDDIO7I/O power domainsEight independent 1.71–5.5 V I/O supply rails - allows mixed-voltage interfacing (e.g., 3.3 V MCU core with 5 V sensor inputs).
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V domains with internal LDO regulation - isolates analog reference stability from digital switching noise.
XRESExternal reset inputActive-low, Schmitt-triggered, 1.2 V threshold - compatible with automotive watchdog ICs and failsafe reset supervisors.

Key Features

FeatureDesign Value
Hardware Crypto AccelerationAES-128/256, SHA-256, TRNG, and CRC engines - enables secure boot, firmware authentication, and encrypted CAN FD message payloads without CPU overhead.
SmartSense Auto-TuningFully automatic CAPSENSE™ calibration at runtime - eliminates manual tuning for electrode aging, humidity drift, and temperature variation in production vehicles.
LCD Segment DriveDirect GPIO-based segment/backplane drive (up to 320 segments) - replaces external LCD controllers in instrument cluster and center-stack displays.
I²S Master TXConfigurable sample rate (8–96 kHz), 16/24-bit word length, left/right justified - interfaces directly with automotive audio codecs and DSPs without external serializers.
Programmable Analog RoutingFlexible connection between SAR ADC, opamps, comparators, and MSC block - enables custom sensor signal chains (e.g., thermistor → opamp → ADC → MSC) without PCB redesign.

Applications

Body Control Module (BCM)Steering Wheel Touch Interface

Use Scenario: Centralized control of door locks, lighting, wipers, and window lift using CAN FD communication with gateway ECUs.

IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing CAN FD frame scheduling, and sampling analog sensor inputs (e.g., ambient light, rain sensor).

Use Value: Integrated TCPWM blocks generate precise PWM for LED dimming; Deep Sleep mode maintains CAN FD listen-only state at 2.5 µA, extending battery life during vehicle sleep.

Use Scenario: Capacitive touch detection on leather-wrapped steering wheel with water splash and glove operation.

IC Role / Device Role / Timing Role: Dedicated CAPSENSE™ controller with MSC block performing real-time signal processing and SmartSense auto-calibration.

Use Value: >5:1 SNR and water tolerance ensure false-trigger-free operation under condensation; GPIO reconfigurability allows shared pins for touch and haptic feedback drivers.

Instrument Cluster Display DriverElectric Power Steering (EPS) Sensor Hub

Use Scenario: Driving segmented LCD for speedometer, fuel gauge, and warning indicators in analog-style clusters.

IC Role / Device Role / Timing Role: LCD segment driver with integrated timing control and GPIO-based backplane switching.

Use Value: Eliminates external LCD driver IC; 320-segment support enables full-graphic analog needle rendering with software-defined sweep angles.

Use Scenario: Aggregating torque sensor, motor phase current, and temperature readings for EPS motor control loop.

IC Role / Device Role / Timing Role: Signal acquisition hub with 12-bit SAR ADC (1-Msps, sequenced channels), opamp buffering, and CAN FD transmission.

Use Value: Differential ADC mode rejects common-mode noise from high-current motor phases; opamp low-power mode retains bias during standby for fast wake-up response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core, 112 MHz; includes Ethernet MAC but no integrated CAPSENSE™ or MSC blockTargets higher-performance gateway and ADAS preprocessing; lacks native capacitive touch engineSelect when Ethernet connectivity or floating-point math acceleration is required over capacitive sensing integration
Renesas RH850/F1L32-bit RXv2 core, 120 MHz; AEC-Q100 Grade-1 (–40°C to +150°C); no hardware crypto acceleratorsDesigned for powertrain and safety-critical EPS; requires external security co-processor for secure bootSelect for ASIL-B functional safety compliance where extended temperature range and lockstep cores are mandatory

Compared with S32K144W and RH850/F1L, CY8C4149LDES583XQLA1 uniquely integrates CAPSENSE™ MSC, Deep Sleep analog retention, and CAN FD in a single die - reducing system-level component count and PCB area for cost-sensitive body electronics and HMI applications.

Availability

CY8C4149LDES583XQLA1 is available at Aetrix Electronics and suitable for body control modules, steering wheel touch interfaces, instrument cluster displays, and electric power steering sensor hubs requiring stable component supply across automotive production lifecycles.

Supply support for CY8C4149LDES583XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security ICs, with global R&D centers and automotive-grade wafer fabs.

CY8C4149LDES583XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics and human-machine interface applications demanding AEC-Q100 qualification, integrated analog/digital reconfigurability, and CAN FD connectivity.

FAQ

What is the maximum operating temperature grade for CY8C4149LDES583XQLA1?

CY8C4149LDES583XQLA1 is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C. This rating is verified per test condition HTOL (High Temperature Operating Life) and TC (Temperature Cycling), making it suitable for under-hood and dashboard-mounted automotive applications where ambient temperatures exceed standard commercial ranges.

Does CY8C4149LDES583XQLA1 support CAN FD physical layer compliance?

Yes - the integrated CAN FD controller complies with ISO 11898-1:2015 and supports bit rates up to 5 Mbps in FD mode. It includes programmable bit timing, error counters, and loopback self-test modes. External transceiver (e.g., TJA1044T) is required for physical layer signaling, but the MCU handles protocol framing, arbitration, and CRC calculation in hardware.

How many GPIOs support simultaneous CAPSENSE™ and ADC functionality?

All 84 GPIOs support both CAPSENSE™ (CSD/CSX) and SAR ADC input roles, with no fixed pin assignment. The analog routing matrix allows any GPIO to be dynamically assigned as ADC input while simultaneously serving as a CAPSENSE™ electrode - confirmed in Section 4.9.1 and Table 5-1 of the datasheet Rev. *G.

Is ModusToolbox™ required for development with this device?

No - while ModusToolbox™ is Infineon's recommended IDE with PDL libraries and CAPSENSE™ Tuner GUI, CY8C4149LDES583XQLA1 is fully compatible with Arm®-compliant toolchains including Keil MDK, IAR Embedded Workbench, and GCC-based builds. Debugging uses standard SWD interface and supports J-Link, CMSIS-DAP, and PyOCD.

CY8C4149LDES583XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4149LDES583XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4149LDES583XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149LDES583XQLA1 reliable?

The price and inventory of CY8C4149LDES583XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149LDES583XQLA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149LDES583XQLA1 transactions.

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CY8C4149LDES583XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149LDES583XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149LDES583XQLA1?

For technical support, including CY8C4149LDES583XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149LDES583XQLA1 requirements.

6.How does Aetrix verify that CY8C4149LDES583XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149LDES583XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149LDES583XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149LDES583XQLA1?

All CY8C4149LDES583XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149LDES583XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149LDES583XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149LDES583XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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