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Infineon Technologies CY8C4149LDSS563XQLA1

Part No.:
CY8C4149LDSS563XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4149LDSS563XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,806

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Product details

Overview

CY8C4149LDSS563XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, integrated CAN FD up to 5 Mbps, and multi-sense capacitive sensing (MSC) with >5:1 SNR for touch interfaces in harsh environments.

For engineers reviewing the CY8C4149LDSS563XQLA1 datasheet, CY8C4149LDSS563XQLA1 pinout, CY8C4149LDSS563XQLA1 application, or CY8C4149LDSS563XQLA1 equivalent, this device supports reconfigurable analog/digital blocks, Deep Sleep mode at 2.5 µA, hardware crypto acceleration (AES/SHA/TRNG), and five SCBs for I²C/SPI/UART/LIN - critical for automotive body control, infotainment HMI, and motor drive supervision.

Technical Context

The CY8C4149LDSS563XQLA1 integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core to programmable analog (CTBm opamps, SAR ADC, LP comparators), digital logic (Smart I/O, TCPWM), and fixed-function peripherals (CAN FD, I2S TX Master, MSC). Its clock system includes ECO (4–33 MHz), PLL (48 MHz), WCO (32 kHz), IMO (±2%), and ILO (40 kHz).

It implements hardware-accelerated cryptography (AES-128/256, SHA-1/256, TRNG, CRC), supports CAPSENSE™ SmartSense auto-tuning, and delivers LCD segment drive capability directly from GPIOs - enabling unified HMI and sensor fusion without external components in space-constrained automotive modules.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling.
Memory384 KB flash with Read Accelerator + 32 KB SRAM - supports complex firmware, OTA updates, and dual-bank secure boot.
Analog Peripherals12-bit 1-Msps SAR ADC, 2 CTBm opamps, 2 LP comparators - enables simultaneous voltage/current sensing and low-power wake-on-event.
Digital Peripherals8× TCPWM blocks, 5× SCBs (I²C/SPI/UART/LIN), CAN FD @ 5 Mbps - supports motor control timing, multi-protocol comms, and high-speed vehicle bus integration.
Capacitive SensingMulti-Sense Converter (MSC) with >5:1 SNR and water tolerance - delivers robust touch detection in wet or noisy cabin environments.
Power ModesDeep Sleep at 2.5 µA with operational analog - extends battery life in always-on automotive modules like door handles or seat controls.
CryptographyHardware AES/SHA/TRNG/CRC accelerators - offloads secure boot, key derivation, and message authentication from CPU.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, automotive-grade moisture sensitivity level MSL3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO Port 0 with CAPSENSE™, analog, or digital functionConfigurable as SAR ADC input, opamp output, or CAN FD RX/TX - enables flexible signal routing without PCB redesign.
P1[0]–P1[7]GPIO Port 1 with LCD segment drive capabilityDrives up to 40-segment LCD directly - eliminates external display driver IC in instrument cluster or HVAC panels.
XTAL_IN / XTAL_OUTExternal crystal oscillator inputsSupports 4–33 MHz ECO for precise timing; required for CAN FD bit-rate accuracy and WCO backup.
CAN_TX / CAN_RXDedicated CAN FD physical layer interface5 Mbps operation with built-in transceiver-level signaling - connects directly to ISO 11898-2 compliant bus without external PHY.
VDDA / VDDDAnalog and digital power supply pinsIndependent 1.71–5.5 V rails allow mixed-signal isolation and noise-sensitive ADC operation in shared power domains.

Key Features

FeatureDesign Value
Reconfigurable Analog Blocks (CTBm)Two opamps support comparator mode, ADC buffering, and high-drive external output - reduces BOM count for sensor signal conditioning.
Smart I/O LogicBoolean operations on port inputs/outputs implemented in hardware - enables glitch-free edge detection and state filtering without CPU overhead.
CAPSENSE™ SmartSenseAutomatic hardware tuning of MSC parameters - eliminates manual calibration during production and compensates for aging or environmental drift.
Hardware Crypto EngineDedicated AES/SHA/TRNG accelerators with DMA-linked operation - achieves 10× faster encryption than software-only implementation for secure firmware updates.
Programmable TCPWM Kill InputComparator-triggered immediate PWM shutdown - meets ASIL-B functional safety requirements for motor overcurrent protection.

Applications

Automotive Door ModuleInstrument Cluster HMI

Use Scenario: Capacitive touch buttons and proximity sensing on door panels exposed to rain, condensation, and temperature cycling.

IC Role / Device Role / Timing Role: MCU host for CAPSENSE™ MSC block, CAN FD node for LIN-to-CAN gateway, and Deep Sleep supervisor for wake-on-handle-grip.

Use Value: >5:1 SNR and water tolerance ensure reliable touch detection without mechanical switches; 2.5 µA Deep Sleep extends battery reserve life in keyless entry systems.

Use Scenario: Driver-facing LCD display with touch overlay, backlight dimming, and real-time gauge rendering.

IC Role / Device Role / Timing Role: Primary controller executing graphics rendering, driving 40-segment LCD directly, and managing CAN FD communication with ECU for speed/RPM data.

Use Value: Integrated LCD segment drive eliminates external driver IC; hardware TCPWM enables flicker-free PWM dimming synchronized to display refresh.

Body Control Unit (BCU)Electric Power Steering (EPS) Supervision

Use Scenario: Centralized control of lighting, window lift, mirror adjustment, and interior ambient lighting across multiple zones.

IC Role / Device Role / Timing Role: Main MCU with five SCBs handling UART diagnostics, I²C sensor reads, SPI EEPROM access, and LIN slave communication to sub-nodes.

Use Value: Run-time reconfigurable SCBs allow dynamic protocol switching - simplifies variant management across vehicle trims without firmware fork.

Use Scenario: Safety-critical monitoring of EPS motor current, temperature, and position feedback alongside torque sensor signals.

IC Role / Device Role / Timing Role: Secondary supervisory MCU performing independent ADC sampling, CAN FD fault reporting, and hardware-triggered PWM kill for torque-limit enforcement.

Use Value: Comparator-based TCPWM kill input responds in <100 ns - satisfies ASIL-B timing constraints for torque cut-off during overheat or short-circuit events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F core, 112 MHz, 1 MB flash, no integrated CAPSENSE™ or MSC blockTargets higher-performance motor control; lacks native capacitive sensing hardwareChoose when floating-point math or larger code footprint is required, but add external touch controller for HMI.
Renesas RL78/F1416-bit RL78 core, 32 MHz, 512 KB flash, CAN 2.0B only (no CAN FD), no hardware cryptoCost-optimized for basic body electronics; limited security and bandwidth vs. CAN FDPrefer for legacy CAN networks where 5 Mbps throughput and AES acceleration are not required.

Compared with S32K144W and RL78/F14, CY8C4149LDSS563XQLA1 uniquely combines AEC-Q100 Grade-S operation, integrated MSC capacitive sensing, CAN FD, and hardware crypto in a single die - reducing system complexity and component count for next-gen automotive HMI and domain controllers.

Availability

CY8C4149LDSS563XQLA1 is available at Aetrix Electronics and suitable for automotive door modules, instrument cluster HMIs, body control units, and EPS supervision systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.

Supply support for CY8C4149LDSS563XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar sensors, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4149LDSS563XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for automotive body electronics and human-machine interface applications demanding reconfigurable analog/digital resources, functional safety readiness, and robust capacitive sensing.

FAQ

What is the maximum operating temperature range for CY8C4149LDSS563XQLA1?

This part is qualified to AEC-Q100 Grade-S, supporting continuous operation from –40°C to +105°C ambient temperature. It is validated for use in under-hood and cabin-mounted automotive modules where thermal stress exceeds consumer-grade limits, including door latches, seat controls, and HVAC actuators.

Does CY8C4149LDSS563XQLA1 support CAN FD with ISO 11898-2 physical layer compliance?

Yes - the integrated CAN FD block supports data rates up to 5 Mbps and complies with ISO 11898-2 electrical specifications. It requires only an external CAN transceiver (e.g., Infineon TLE6250) for full bus termination and differential signaling; no additional protocol translation logic is needed.

Can the MSC block perform mutual-capacitance scanning without firmware intervention?

Yes - the Multi-Sense Converter (MSC) supports hardware-accelerated mutual-capacitance scanning with automatic baseline tracking and SmartSense tuning. All timing, sequencing, and noise rejection are handled in dedicated logic, freeing the CPU for application tasks while maintaining >5:1 SNR in wet conditions.

Is ModusToolbox™ required to configure the programmable analog and digital blocks?

No - while ModusToolbox™ provides graphical configuration and API generation, all CTBm, TCPWM, SCB, and MSC blocks can be configured directly via register writes using the PDL (Peripheral Driver Library) or bare-metal C code. Full register maps and initialization sequences are documented in the PSoC™ 4100S Max TRM.

CY8C4149LDSS563XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4149LDSS563XQLA1 FAQ

1.How can I place an order for CY8C4149LDSS563XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4149LDSS563XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149LDSS563XQLA1 reliable?

The price and inventory of CY8C4149LDSS563XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149LDSS563XQLA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4149LDSS563XQLA1 transactions.

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CY8C4149LDSS563XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149LDSS563XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149LDSS563XQLA1?

For technical support, including CY8C4149LDSS563XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149LDSS563XQLA1 requirements.

6.How does Aetrix verify that CY8C4149LDSS563XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149LDSS563XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149LDSS563XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149LDSS563XQLA1?

All CY8C4149LDSS563XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149LDSS563XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149LDSS563XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149LDSS563XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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