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Infineon Technologies CY8C4149LDSS583XQLA1

Part No.:
CY8C4149LDSS583XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4149LDSS583XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,904

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Product details

Overview

CY8C4149LDSS583XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller featuring a 48-MHz Arm® Cortex®-M0+ CPU, 384 KB flash, 32 KB SRAM, integrated CAN FD (up to 5 Mbps), and multi-sense capacitive sensing (MSC) with >5:1 SNR. It supports CAPSENSE™, LCD segment drive, and five reconfigurable Serial Communication Blocks (SCBs) for I²C/SPI/UART/LIN in body control modules.

For engineers reviewing the CY8C4149LDSS583XQLA1 datasheet, CY8C4149LDSS583XQLA1 pinout, CY8C4149LDSS583XQLA1 application, or CY8C4149LDSS583XQLA1 equivalent, key selection factors include CAN FD compliance, Deep Sleep current (2.5 µA), programmable analog (2 opamps + 12-bit 1-Msps SAR ADC), and 84 GPIO with CAPSENSE™/LCD/analog/digital reconfiguration capability.

Technical Context

The device implements a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, memory subsystem (384 KB flash + 32 KB SRAM), and peripherals including CAN FD, five SCBs, eight TCPWM blocks, and dual CTBm opamps with Deep Sleep operation. Clocking includes ECO (4–33 MHz), PLL (48 MHz), WCO (32 kHz), IMO (±2%), and ILO (40 kHz).

Analog resources integrate a 12-bit SAR ADC with channel sequencer and signal averaging, two low-power comparators active in Deep Sleep, and MSC block supporting hardware-accelerated SmartSense tuning. Digital flexibility includes Smart I/O logic, programmable GPIO drive modes, and DMA-driven data movement across peripherals.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - deterministic real-time execution with NVIC and MPU support
Memory384 KB flash with Read Accelerator + 32 KB SRAM - enables complex firmware with fast code fetch and data buffering
CAN InterfaceCAN FD up to 5 Mbps - supports high-bandwidth vehicle network diagnostics and ECU coordination
Analog-to-Digital12-bit SAR ADC, 1 Msps, differential/single-ended, sequencer + averaging - suitable for precision sensor acquisition in noisy automotive environments
Capacitive SensingMulti-Sense Converter (MSC) with >5:1 SNR and water tolerance - enables reliable touch interfaces on dashboards and door panels
Power ModesDeep Sleep at 2.5 µA digital + operational analog - extends battery life in always-on vehicle subsystems
GPIO CountUp to 84 pins, all configurable as CAPSENSE™, analog, or digital I/O - simplifies board layout and function reuse across variants

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, LCD segment drive, or digital I/O with programmable slew rate and drive strength
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX pins (P1[2]/P1[3]) and SCB0 I²C/SPI/UART functions
P2[0]–P2[7]Port 2 GPIO bankHosts TCPWM outputs, ADC reference inputs (VREFH/VREFL), and WCO crystal connections
VDDIO0–VDDIO3I/O power domainsIndependent 1.71–5.5 V supply rails per port group - enables mixed-voltage interface with sensors and displays
VDDD/VDDADigital/analog core suppliesSeparate 1.71–5.5 V domains with internal LDO regulation - reduces noise coupling between digital switching and analog measurement

Key Features

FeatureDesign Value
Hardware Cryptography AcceleratorAES-128/256, SHA-1/256, TRNG, CRC - enables secure boot, OTA updates, and ECU authentication without CPU overhead
Programmable Analog Blocks2 CTBm opamps with comparator mode + ADC input buffering - allows sensor signal conditioning and threshold detection in Deep Sleep
Smart I/O LogicBoolean operations on port inputs/outputs - implements glue logic (e.g., AND/OR latching) without firmware intervention
Automatic CAPSENSE™ TuningSmartSense hardware tuning - eliminates manual calibration during production and compensates for environmental drift
LCD Segment DriveDirect GPIO-based segment control - drives up to 48 segments without external driver IC, reducing BOM cost

Applications

Body Control Module (BCM)Instrument Cluster Display

Use Scenario: Centralized control of door locks, lighting, wipers, and window lifts in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control tasks, managing CAN FD communication with other ECUs, and processing capacitive switch inputs.

Use Value: Integrated CAN FD and 84 GPIO enable direct connection to actuators/sensors while reducing external interface IC count.

Use Scenario: Driving segmented LCDs for speedometer, fuel gauge, and warning indicators in analog-style instrument clusters.

IC Role / Device Role / Timing Role: Primary display controller with built-in LCD segment drive and SPI-connected graphics overlay processor.

Use Value: Eliminates need for dedicated LCD driver IC; GPIO-based segment control reduces PCB layer count and assembly cost.

Touch-Based Center ConsoleAutomotive HVAC Control Panel

Use Scenario: Capacitive touch interface for infotainment navigation, climate presets, and media controls in center stack assemblies.

IC Role / Device Role / Timing Role: CAPSENSE™-optimized MCU performing real-time touch scanning, gesture recognition, and system wake-up via MSC block.

Use Value: >5:1 SNR and water-tolerant MSC ensures reliable operation under condensation, spills, and glove use.

Use Scenario: Climate control panel with rotary encoders, push buttons, and temperature display in cabin HVAC systems.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating encoder pulses, thermistor readings, and user inputs via SAR ADC and TCPWM quadrature decoder.

Use Value: 12-bit SAR ADC with signal averaging delivers stable temperature measurement despite thermal gradients near vents.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144WARM Cortex-M4F @ 112 MHz, 512 KB flash, no integrated CAPSENSE™, requires external touch controllerBetter floating-point performance for motor control algorithms; lacks native capacitive sensingSelect when advanced math-intensive control (e.g., PMSM FOC) is required over touch interface integration
Renesas RL78/F14RL78 core @ 32 MHz, 256 KB flash, 20 KB RAM, CAN 2.0B only (no CAN FD), no hardware crypto acceleratorLower cost for legacy CAN networks; insufficient for high-speed diagnostics or secure OTASelect for cost-sensitive entry-level BCMs where CAN FD and cryptographic security are not mandated

Compared with S32K144W and RL78/F14, CY8C4149LDSS583XQLA1 uniquely integrates CAPSENSE™, CAN FD, and hardware crypto in a single AEC-Q100 Grade-S package-reducing component count and enabling secure, touch-enabled automotive human-machine interfaces without external silicon.

Availability

CY8C4149LDSS583XQLA1 is available at Aetrix Electronics and suitable for body control modules, instrument cluster displays, touch-based center consoles, and automotive HVAC control panels requiring stable component supply across extended temperature ranges.

Supply support for CY8C4149LDSS583XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, radar, and security solutions, with global R&D and manufacturing infrastructure.

CY8C4149LDSS583XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive human-machine interface (HMI) and body electronics applications requiring integrated analog, digital, and connectivity resources.

FAQ

What is the maximum operating temperature range for CY8C4149LDSS583XQLA1?

This part is qualified to AEC-Q100 Grade-S, with guaranteed operation from –40°C to +105°C ambient temperature. It includes an on-die temperature sensor integrated into the SAR ADC subsystem, calibrated for ±2.5°C accuracy across this full range, and usable for thermal monitoring in engine bay or dashboard-mounted ECUs.

Does CY8C4149LDSS583XQLA1 support CAN FD with ISO 11898-1:2015 compliance?

Yes. The integrated CAN FD controller complies with ISO 11898-1:2015 and supports bit rates up to 5 Mbps in FD mode, including flexible data-length payloads (up to 64 bytes), CRC-17/21 error detection, and automatic protocol arbitration. It operates independently of CPU load using dedicated DMA channels for transmit/receive buffers.

Can the 12-bit SAR ADC perform simultaneous sampling across multiple channels?

No. The SAR ADC uses a single conversion core with a hardware channel sequencer that supports automated round-robin scanning of up to 16 inputs, including signal averaging over up to 64 samples per channel. Simultaneous sampling requires external synchronized ADCs; this device achieves effective multi-channel acquisition through deterministic sequencing and DMA-triggered result storage.

Is ModusToolbox™ required to configure the programmable analog blocks?

No. While ModusToolbox™ provides graphical configuration and auto-generated PDL code for CTBm opamps, comparators, and ADC, all analog blocks can be fully controlled via direct register writes using the documented register map in the TRM. Hardware behavior (e.g., opamp gain settings, comparator hysteresis) is defined by fixed register bits-not firmware abstraction layers.

CY8C4149LDSS583XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, I2S, DMA, LCD, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4149LDSS583XQLA1 FAQ

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Please submit a Request for Quotation (RFQ) for CY8C4149LDSS583XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149LDSS583XQLA1 reliable?

The price and inventory of CY8C4149LDSS583XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149LDSS583XQLA1 is usually 5 days.

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CY8C4149LDSS583XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149LDSS583XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149LDSS583XQLA1?

For technical support, including CY8C4149LDSS583XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149LDSS583XQLA1 requirements.

6.How does Aetrix verify that CY8C4149LDSS583XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149LDSS583XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149LDSS583XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149LDSS583XQLA1?

All CY8C4149LDSS583XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149LDSS583XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149LDSS583XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149LDSS583XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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