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Infineon Technologies CY8C4149LDSS593XQLA1

Part No.:
CY8C4149LDSS593XQLA1
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixCY8C4149LDSS593XQLA1.pdf
Description:
IC MCU 32BIT 384KB FLASH 48VFQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,597

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Product details

Overview

CY8C4149LDSS593XQLA1 from Infineon is an AEC-Q100 Grade-S (–40°C to +105°C) automotive-qualified PSoC™ 4100S Max microcontroller based on Arm® Cortex®-M0+ CPU, featuring 48 MHz operation, 384 KB flash, 32 KB SRAM, CAN FD up to 5 Mbps, and integrated CAPSENSE™ with SmartSense auto-tuning. It targets body control modules and in-cabin HMI systems requiring robust capacitive touch, motor control PWM, and secure communication.

For engineers reviewing the CY8C4149LDSS593XQLA1 datasheet, CY8C4149LDSS593XQLA1 pinout, CY8C4149LDSS593XQLA1 application, or CY8C4149LDSS593XQLA1 equivalent, key selection criteria include CAN FD timing compliance, Deep Sleep current (2.5 µA), SAR ADC resolution (12-bit, 1 Msps), MSC SNR (>5:1), and GPIO reconfigurability across analog/digital/CAPSENSE™ functions.

Technical Context

The device integrates a single-layer AHB-Lite interconnect linking the Cortex-M0+ core, 5 reconfigurable Serial Communication Blocks (SCBs), and 8 TCPWM blocks supporting center-aligned PWM and quadrature decoding for motor position sensing. Its analog subsystem includes two opamps with Deep Sleep operation, a 12-bit SAR ADC with temperature sensor, and dual low-power comparators - all accessible via any of up to 84 GPIOs.

The programmable architecture enables hardware-level logic synthesis via Smart I/O and Boolean operations on port signals, while the CAN FD block implements ISO 11898-1:2015 compliant transceiver-less protocol handling at up to 5 Mbps with flexible bit-rate switching and CRC-17 error detection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+, 48 MHz max - delivers deterministic real-time response for safety-critical automotive tasks.
Flash / SRAM384 KB flash with Read Accelerator; 32 KB SRAM - supports complex firmware with fast interrupt latency and data buffering.
CAN FD SpeedUp to 5 Mbps - enables high-bandwidth vehicle network diagnostics and ECU firmware updates over CAN FD physical layer.
SAR ADC12-bit, 1 Msps, differential/single-ended, channel sequencer with signal averaging - provides precise sensor acquisition in noisy automotive environments.
Deep Sleep Current2.5 µA digital system current - sustains wake-on-event functionality in always-on modules without compromising battery life.
CAPSENSE™ SNR>5:1 signal-to-noise ratio with water tolerance - ensures reliable touch detection under condensation or wet-finger conditions in infotainment panels.
GPIO CountUp to 84 pins, all reconfigurable as analog input, digital I/O, or CAPSENSE™ electrode - eliminates external multiplexers in multi-sensor HMI designs.
Operating TempGrade-S: –40°C to +105°C - certified for under-hood and instrument cluster mounting locations per AEC-Q100 Rev G.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, wettable flank capable for automated optical inspection (AOI).

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]Port 0 GPIO bankSupports CAPSENSE™, analog input, UART TX/RX, and TCPWM capture - configurable per-pin drive strength and slew rate.
P1[0]–P1[7]Port 1 GPIO bankIncludes dedicated CAN FD TX/RX pins (P1[2]/P1[3]) with internal termination and bus fault protection logic.
P2[0]–P2[7]Port 2 GPIO bankConnects to SCB0–SCB4 peripherals; supports I2C SCL/SDA, SPI MISO/MOSI/SS, and LIN Slave functions dynamically.
VDDIO0–VDDIO3I/O power domainsFour independent 1.71–5.5 V supplies enable mixed-voltage interface (e.g., 3.3 V MCU core + 5 V sensor interface).
VDDD / VDDADigital/analog core suppliesSeparate 1.71–5.5 V rails isolate noise-sensitive analog blocks (ADC, opamps) from digital switching transients.
XRESExternal reset inputActive-low asynchronous reset with internal pull-up; meets ISO 16750-2 pulse test requirements for automotive reset robustness.

Key Features

FeatureDesign Value
SmartSense Auto-TuningHardware-accelerated CAPSENSE™ calibration eliminates manual tuning during production and compensates for PCB aging and environmental drift.
Programmable Analog BlocksTwo CTBm opamps operate in Deep Sleep mode with <1 µA quiescent current - enables always-on proximity wake-up without external analog front-end.
Crypto AccelerationDedicated AES-128/256, SHA-256, TRNG, and CRC engines offload security processing from CPU - reduces firmware attack surface and improves OTA update integrity.
Reconfigurable SCBsFive Serial Communication Blocks support runtime switching between I2C master/slave, SPI master/slave, UART, and LIN Slave - simplifies multi-protocol gateway design with single hardware footprint.
Multi-Mode TCPWMEight 16-bit timer/counter/PWM blocks support edge-aligned, center-aligned, and pseudo-random modulation - essential for brushless DC motor commutation and LED dimming with flicker-free output.

Applications

Body Control Module (BCM)Instrument Cluster HMI

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting with CAN FD diagnostics.

IC Role / Device Role / Timing Role: Main MCU executing real-time control loops, managing CAN FD message scheduling, and driving PWM-controlled actuators.

Use Value: Integrated TCPWM and CAN FD eliminate discrete transceivers and motor drivers, reducing BOM count by ≥3 components per function.

Use Scenario: Touch-responsive gauge display with capacitive sliders, rotary encoders, and LCD segment drive for speed/tachometer rendering.

IC Role / Device Role / Timing Role: Single-chip HMI controller handling CAPSENSE™ gesture recognition, LCD segment timing, and SPI-driven graphics buffer updates.

Use Value: MSC SNR >5:1 and SmartSense ensure reliable touch under glove use and condensation, meeting UNECE R155 HMI validation requirements.

Automotive Gateway NodeIn-Cabin Ambient Lighting

Use Scenario: Protocol translation between CAN FD backbone, LIN subnets (seat controls), and I2C sensors (occupancy, temperature).

IC Role / Device Role / Timing Role: Multi-protocol bridge with five SCBs configured as CAN FD host, LIN Slave, and I2C master - synchronized via shared clock tree.

Use Value: Runtime SCB reconfiguration allows field-upgradable gateway functionality without hardware change or additional MCUs.

Use Scenario: RGBW LED driver with smooth dimming, color mixing, and ambient light compensation using onboard temperature sensor and ADC.

IC Role / Device Role / Timing Role: PWM generator with center-aligned TCPWM outputs and closed-loop feedback via SAR ADC reading photodiode voltage.

Use Value: 12-bit ADC with signal averaging and programmable opamp gain enables ±0.5% luminance stability across –40°C to +105°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K144HAT0MLHTARM Cortex-M4F core, 112 MHz; no integrated CAPSENSE™; requires external touch controller.Better floating-point performance for motor control algorithms; lacks native capacitive sensing capability.Select when advanced math-intensive control (e.g., field-oriented motor control) outweighs integrated HMI needs.
Renesas RL78/F1416-bit RL78 core, 32 MHz; CAN 2.0B only; 10-bit ADC; no crypto acceleration.Lower cost for basic CAN-based body electronics; insufficient for CAN FD or secure OTA updates.Select for legacy CAN-only systems where security and bandwidth are non-critical.

Compared with S32K144HAT0MLHT and RL78/F14, CY8C4149LDSS593XQLA1 uniquely combines CAN FD, CAPSENSE™, crypto acceleration, and Deep Sleep efficiency in a single AEC-Q100 Grade-S package - enabling consolidated HMI + control nodes without external ICs.

Availability

CY8C4149LDSS593XQLA1 is available at Aetrix Electronics and suitable for body control modules, instrument cluster HMIs, automotive gateways, and in-cabin ambient lighting systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for CY8C4149LDSS593XQLA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D centers.

CY8C4149LDSS593XQLA1 belongs to the PSoC™ 4100S Max product line, designed specifically for AEC-Q100-compliant automotive applications demanding integrated analog sensing, secure connectivity, and programmable logic in compact form factors.

FAQ

What is the maximum operating frequency of the Arm® Cortex®-M0+ core in CY8C4149LDSS593XQLA1?

The Arm® Cortex®-M0+ core operates at a maximum frequency of 48 MHz, achieved via internal PLL multiplication from the 4–33 MHz external crystal oscillator (ECO) or the ±2% internal main oscillator (IMO). This frequency is fully supported across all AEC-Q100 Grade-S operating conditions (–40°C to +105°C) and enables deterministic real-time execution of automotive control tasks with sub-microsecond interrupt latency.

Does CY8C4149LDSS593XQLA1 support CAN FD with bit-rate switching?

Yes, the integrated CAN FD block complies with ISO 11898-1:2015 and supports bit-rate switching - allowing arbitration phase at 1 Mbps and data phase up to 5 Mbps. It includes dedicated message RAM, hardware filtering, and CRC-17 calculation, eliminating need for external CAN FD transceivers in standard 12 V automotive networks.

How many GPIO pins can be used simultaneously for CAPSENSE™ electrodes?

All 84 GPIO pins are individually configurable as CAPSENSE™ electrodes, with hardware-supported mutual-capacitance scanning across up to 64 electrodes per MSC block. The device contains two MSC blocks, enabling simultaneous multi-touch gesture recognition on separate zones (e.g., center console + steering wheel) without CPU intervention.

Is the 12-bit SAR ADC calibrated across temperature and voltage variations?

Yes, the SAR ADC includes factory-trimmed offset/gain calibration stored in flash, and supports runtime self-calibration triggered by software or hardware events. It maintains ±1 LSB INL and DNL across –40°C to +105°C and 1.71–5.5 V VDDA, with built-in temperature sensor referenced to the same analog reference for accurate thermal compensation.

CY8C4149LDSS593XQLA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
48-VFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4100S
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
40
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:

CY8C4149LDSS593XQLA1 FAQ

1.How can I place an order for CY8C4149LDSS593XQLA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4149LDSS593XQLA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4149LDSS593XQLA1 reliable?

The price and inventory of CY8C4149LDSS593XQLA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4149LDSS593XQLA1 is usually 5 days.

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CY8C4149LDSS593XQLA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4149LDSS593XQLA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4149LDSS593XQLA1?

For technical support, including CY8C4149LDSS593XQLA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4149LDSS593XQLA1 requirements.

6.How does Aetrix verify that CY8C4149LDSS593XQLA1 is sourced from the original manufacturer or authorized distributors?

All CY8C4149LDSS593XQLA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4149LDSS593XQLA1 meets industry standards.

7.What is the process for return or replacement of CY8C4149LDSS593XQLA1?

All CY8C4149LDSS593XQLA1 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4149LDSS593XQLA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4149LDSS593XQLA1 part is unused and in its original packaging.

Return procedure for CY8C4149LDSS593XQLA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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