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Infineon Technologies CY8C4247FNI-BL473T
- Part No.:
- CY8C4247FNI-BL473T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 76-UFBGA, WLCSP
- Datasheet:
-
CY8C4247FNI-BL473T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 76WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,365
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Product details
Overview
CY8C4247FNI-BL473T from Infineon is a PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU (48 MHz), 256 KB flash, 32 KB SRAM, and a fully embedded AIROC™ Bluetooth® LE 4.2 radio subsystem with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit 1-Msps SAR ADC, and up to 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package for wireless human interface and sensor node applications.
For engineers reviewing the CY8C4247FNI-BL473T datasheet, CY8C4247FNI-BL473T pinout, CY8C4247FNI-BL473T application, or CY8C4247FNI-BL473T equivalent, key selection criteria include integrated BLE PHY/link-layer coexistence with programmable analog/digital blocks, Deep Sleep current of 1.5 µA with WCO, and hardware-accelerated CAPSENSE™ with SmartSense tuning.
Technical Context
This device implements a tightly coupled dual-subsystem architecture: the Arm® Cortex®-M0 core executes firmware while the BLESS (Bluetooth® Low Energy Subsystem) handles RF baseband, link-layer state machine, and packet encryption independently. The BLESS includes a 2.4-GHz transceiver with 50-Ω antenna drive and digital PHY supporting both master and slave roles.
Analog resources include four opamps with Comparator mode and ADC input buffering, plus a 12-bit SAR ADC with channel sequencer and signal averaging. Digital flexibility comes from four UDBs (Universal Digital Blocks), each with eight macrocells and data path, enabling custom logic and state machines without external FPGA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0 @ 48 MHz with single-cycle multiply and DMA support for real-time control loops |
| Memory | 256 KB flash (with read accelerator) and 32 KB SRAM for complex BLE stack + application firmware |
| BLE Compliance | Bluetooth® LE 4.2 certified radio subsystem (BLESS) with hardware AES-128 encryption |
| RF Performance | –89 dBm RX sensitivity and +3 dBm max TX output power enables 10–30 m indoor range |
| ADC | 12-bit SAR ADC at 1 Msps with differential/single-ended modes and hardware-averaged sequencing |
| Low-Power Modes | 1.5 µA Deep Sleep (WCO active), 150 nA Hibernate (RAM retention), 60 nA Stop mode |
| CAPSENSE™ | Capacitive sigma-delta (CSD) engine with >5:1 SNR, liquid tolerance, and SmartSense auto-tuning |
Pinout & Package
Package: 7 mm × 7 mm, 56-pin QFN (exposed thermal pad), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.71–5.5 V I/O banks enable mixed-voltage interfacing (e.g., 1.8 V sensor + 3.3 V display) |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Programmable GPIO | All 36 pins support CAPSENSE™, LCD segment/common, analog input, or digital logic with configurable drive strength/slew |
| ANT | RF antenna interface | Dedicated 50-Ω RF output pin routed to internal matching network and PCB antenna |
| XRES | Active-low reset | Asynchronous reset input with internal pull-up; debounced externally for reliable power-on initialization |
| SWDCK/SWDIO | Debug interface | Two-pin Serial Wire Debug (SWD) for programming and real-time trace via MiniProg3 or KitProg |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE Radio + Link Layer | Eliminates external transceiver and host MCU coordination overhead; BLESS handles advertising, scanning, and connection management autonomously |
| Hardware CAPSENSE™ Engine | Offloads touch-button/slider processing from CPU; supports >100 electrodes with <10-ms scan time and automatic baseline compensation |
| Configurable SCBs | Two serial communication blocks dynamically reconfigurable as I²C, SPI, or UART-enabling concurrent sensor bus and BLE host interface |
| UDB-Based Custom Logic | Four universal digital blocks allow implementation of protocol accelerators (e.g., custom UART framing) or PWM timing engines without firmware intervention |
| Deep-Sleep Analog Operation | Opamps and comparators remain active in Deep Sleep mode, enabling wake-on-analog-event (e.g., voltage threshold breach) with 1.5 µA total current |
Applications
| Wireless Remote Control | Smart Home Sensor Node |
|---|---|
Use Scenario: Battery-powered wall-mounted remote with touch sliders, LED feedback, and BLE connectivity to hub. IC Role / Device Role / Timing Role: Single-chip controller handling CAPSENSE™ input, RGB LED PWM timing, and BLE advertisement/scan scheduling. Use Value: 60 nA Stop mode extends CR2032 battery life beyond 5 years; SmartSense eliminates manual calibration during mass production. | Use Scenario: Compact temperature/humidity/motion sensor node deployed in HVAC ducts with 10-year battery target. IC Role / Device Role / Timing Role: System-on-chip managing I²C sensor reads, low-power timer-based wake cycles, and BLE periodic data broadcast. Use Value: 1.5 µA Deep Sleep with WCO enables precise 1-s wake intervals; integrated ADC and opamp buffer reduce external component count by 40%. |
| BLE Beacon Transmitter | Industrial Button Panel |
Use Scenario: Fixed-location asset tracker beacon transmitting UUID/Major/Minor at 100-ms intervals. IC Role / Device Role / Timing Role: Standalone BLE advertiser with fixed payload; no host processor required. Use Value: BLESS hardware link-layer engine achieves 100% duty-cycle advertising at 15.6 mA TX current (0 dBm), eliminating CPU polling overhead. | Use Scenario: IP65-rated metal enclosure with 12 capacitive buttons, status LEDs, and RS-485 backhaul. IC Role / Device Role / Timing Role: Main controller executing CAPSENSE™ scan, LED PWM dimming, and RS-485 SCB configuration. Use Value: Overvoltage-tolerant (OVT) pins tolerate ±12 V ESD events on front-panel traces; CSD engine rejects water-film false triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE-enabled programmable MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52833 | Arm® Cortex®-M4F core, 512 KB flash, no integrated analog peripherals (ADC/opamp/CAPSENSE™) | Requires external analog front-end for sensor conditioning; better for compute-intensive BLE mesh nodes | Select when floating-point math or larger code footprint outweighs need for on-die analog configurability |
| Texas Instruments CC2642R | Arm® Cortex®-M4F + dedicated sensor controller; 352 KB flash; no programmable digital logic (UDBs) | Lacks hardware-reconfigurable logic blocks; relies on firmware for custom timing/state machines | Select when ultra-low-power sensor controller offload is critical, but custom digital logic is not required |
Compared with nRF52833 and CC2642R, CY8C4247FNI-BL473T uniquely integrates programmable analog (opamp/ADC/CAPSENSE™) and digital (UDB) blocks alongside BLE, enabling full system consolidation without external ICs for HMI or sensor signal chain tasks.
Availability
CY8C4247FNI-BL473T is available at Aetrix Electronics and suitable for wireless remote controls, smart home sensor nodes, BLE beacons, and industrial button panels requiring stable component supply across multi-year production cycles.
Supply support for CY8C4247FNI-BL473T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.
CY8C42xx-BL belongs to the PSoC™ 4 family designed for highly integrated, low-power embedded systems where analog/digital reconfigurability and wireless connectivity must coexist on a single die-targeting human interface, IoT edge sensing, and battery-operated BLE endpoints.
FAQ
What development tools are officially supported for CY8C4247FNI-BL473T?
Infineon officially supports PSoC™ Creator IDE (Windows-only, legacy) and ModusToolbox™ (cross-platform, current). Both provide schematic-based design entry, pre-verified components for BLE, CAPSENSE™, and TCPWM, and integration with MiniProg3/KitProg debug probes. ModusToolbox uses Eclipse-based workflow and supports FreeRTOS and BLE middleware stacks.
Does CY8C4247FNI-BL473T require an external crystal for BLE operation?
Yes - a 24 MHz crystal is required for BLE RF clock accuracy (±20 ppm), and a 32.768 kHz watch crystal (WCO) is needed for Deep Sleep timing. The datasheet specifies load capacitance values (12 pF for 24 MHz, 12.5 pF for WCO) and recommends layout guidelines for matching network stability per AN91445.
Can all 36 GPIOs be used simultaneously for CAPSENSE™?
No - CAPSENSE™ supports up to 32 electrodes (sensors) per device, constrained by routing resources and mutual-capacitance scan matrix size. While all GPIOs are CAPSENSE™-capable, simultaneous use of all 36 pins requires splitting functionality (e.g., 24 for touch, 8 for LED drive, 4 for serial comms), as confirmed in the PSoC™ 4 TRM Section 1.8.2.
Is the BLE stack included in the device firmware or loaded externally?
The BLE link-layer and PHY are implemented in hardened silicon within the BLESS subsystem. The host-side BLE stack (GATT server/client, profiles) is provided as firmware libraries in PSoC™ Creator and ModusToolbox, compiled into the user application. No external stack licensing or runtime loading is required.
CY8C4247FNI-BL473T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 76-UFBGA, WLCSP
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, DMA, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 1x7b, 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4247FNI-BL473T FAQ
1.How can I place an order for CY8C4247FNI-BL473T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4247FNI-BL473T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4247FNI-BL473T reliable?
The price and inventory of CY8C4247FNI-BL473T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4247FNI-BL473T is usually 5 days.
3.What payment methods are accepted for CY8C4247FNI-BL473T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4247FNI-BL473T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4247FNI-BL473T?
CY8C4247FNI-BL473T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4247FNI-BL473T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4247FNI-BL473T?
For technical support, including CY8C4247FNI-BL473T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4247FNI-BL473T requirements.
6.How does Aetrix verify that CY8C4247FNI-BL473T is sourced from the original manufacturer or authorized distributors?
All CY8C4247FNI-BL473T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4247FNI-BL473T meets industry standards.
7.What is the process for return or replacement of CY8C4247FNI-BL473T?
All CY8C4247FNI-BL473T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4247FNI-BL473T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4247FNI-BL473T part is unused and in its original packaging.
Return procedure for CY8C4247FNI-BL473T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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