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Infineon Technologies CY8C4247LQI-BL463

Part No.:
CY8C4247LQI-BL463
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4247LQI-BL463.pdf
Description:
IC MCU 32BIT 128KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,092

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Product details

Overview

CY8C4247LQI-BL463 from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® LE 4.2 radio, 48 MHz CPU, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It delivers BLE connectivity with –89 dBm RX sensitivity and +3 dBm TX output in a 7 mm × 7 mm 56-pin QFN package, targeting compact wireless sensor nodes and battery-powered IoT endpoints.

For engineers reviewing the CY8C4247LQI-BL463 datasheet, CY8C4247LQI-BL463 pinout, CY8C4247LQI-BL463 application, or CY8C4247LQI-BL463 equivalent, key selection criteria include integrated BLE subsystem power efficiency (15.6 mA TX @ 0 dBm), Deep Sleep current (1.5 µA with WCO), SAR ADC performance (12-bit, 1-Msps), and GPIO flexibility (36 pins supporting CAPSENSE™, LCD, analog, or digital functions).

Technical Context

The device implements a dual-domain architecture: an Arm® Cortex®-M0 core with DMA and flash accelerator coexists with a dedicated Bluetooth® LE subsystem (BLESS) containing digital PHY, link-layer engine, and RF transceiver. Clocking includes IMO (internal main oscillator), ILO (low-power internal), ECO (external crystal), and WCO (watch crystal) sources for precise timing across operating modes.

Analog resources comprise four opamps with comparator mode and ADC input buffering, a 12-bit SAR ADC with channel sequencer and signal averaging, two IDACs, and two low-power comparators-all operable in Deep Sleep. Digital reconfigurability is enabled via four Universal Digital Blocks (UDBs), each with eight macrocells and data path, plus fixed-function TCPWM and SCB peripherals.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 48 MHz with single-cycle multiply and DMA support for real-time control tasks
Flash / SRAM256 KB flash with read accelerator; 32 KB SRAM - enables complex BLE stack + application firmware co-residence
BLE RadioBluetooth® LE 4.2 compliant; –89 dBm RX sensitivity and +3 dBm TX output for robust 10–30 m indoor range
ADC12-bit SAR, 1-Msps sampling rate with differential/single-ended modes and hardware channel sequencing
Power ModesDeep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA with RAM retention - extends coin-cell battery life to years
GPIO Count36 programmable pins; any pin supports CAPSENSE™, LCD segment drive, analog input, or digital I/O
Package7 mm × 7 mm, 56-pin QFN (LQFP-style leadless) with exposed thermal pad - optimized for space-constrained PCB layouts

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQI suffix), thermally enhanced with exposed pad. Pinout validated per Infineon datasheet Rev. *B (002-23053), Table 2 "Pin Assignments".

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]General-purpose I/O bank 0Supports CAPSENSE™, analog input, digital logic, or LCD segment drive; configurable slew rate and drive strength
P1[0]–P1[7]General-purpose I/O bank 1Includes two overvoltage-tolerant (OVT) pins; usable as reset, SWD debug, or BLE antenna matching network interface
P12[0]–P12[7]General-purpose I/O bank 12Directly interfaces with internal opamps, ADC inputs, and IDAC outputs; supports Deep Sleep wake-up
XRESActive-low reset inputAsynchronous external reset; debounced internally; compatible with pushbutton or supervisor IC assertion
VDDIOI/O supply rail1.71–5.5 V tolerant; powers all GPIO banks and digital peripherals independently of core voltage
VDDDDigital core supply1.71–5.5 V; supplies CPU, flash, SRAM, and UDBs - allows mixed-voltage system integration
VREFADC reference inputAccepts external reference or internal 1.024 V/2.048 V/4.096 V options for precision analog measurement

Key Features

FeatureDesign Value
Integrated BLE Subsystem (BLESS)Dedicated hardware link-layer engine and RF transceiver eliminate host CPU overhead for BLE advertising/connection management
Capacitive Sensing (CAPSENSE™)Sigma-delta CSD with >5:1 SNR and SmartSense auto-tuning - enables reliable touch buttons/sliders under moisture or glove use
Programmable Analog BlocksFour opamps with comparator mode and ADC input buffering - supports sensor signal conditioning without external components
Reconfigurable Digital LogicFour UDBs with Verilog-capable macrocells - permits custom state machines, protocol accelerators, or glue logic without FPGA
Low-Power TimingWatch crystal oscillator (WCO) operational in Deep Sleep at 1.5 µA - maintains real-time clock during extended battery sleep

Applications

Smart Home Sensor NodeWearable Health Monitor

Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting data via BLE to gateway.

IC Role / Device Role / Timing Role: MCU + BLE SoC handling sensor acquisition, local processing, and encrypted BLE advertisement/connection.

Use Value: Integrated 12-bit ADC and CAPSENSE™ reduce BOM count; 150 nA Hibernate mode enables multi-year operation on CR2032.

Use Scenario: Compact wrist-worn device measuring heart rate, SpO₂, and motion using optical and inertial sensors.

IC Role / Device Role / Timing Role: Central controller managing analog front-end, motion fusion, and BLE GATT-based health service reporting.

Use Value: Four opamps condition photodiode signals; Deep Sleep current (1.5 µA) preserves battery during idle periods between measurements.

Industrial Wireless ControllerInteractive Consumer Remote

Use Scenario: DIN-rail mounted BLE node controlling relays, reading analog process signals, and reporting to SCADA via edge gateway.

IC Role / Device Role / Timing Role: Real-time embedded controller with TCPWM for PWM-driven actuators and SCBs for Modbus RTU over UART.

Use Value: 36 GPIOs support isolated analog inputs, relay drivers, and status LEDs; 48 MHz CPU handles deterministic control loops.

Use Scenario: Touch-enabled universal remote with gesture recognition and multi-protocol IR/RF/BLE output.

IC Role / Device Role / Timing Role: CAPSENSE™-based touch interface processor with BLE HID profile for smartphone pairing and IR code generation.

Use Value: Programmable UDBs implement IR carrier modulation logic; LCD drive capability supports segmented display without external driver.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF52833 DK64 MHz Arm® Cortex®-M4F, 512 KB flash, no integrated analog peripherals (ADC/opamp), requires external components for sensor interfaceBetter computational throughput but higher BOM cost and layout complexity for analog-sensing designsPrefer when floating-point math or audio processing dominates; avoid when CAPSENSE™ or opamp-based signal chain is required
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, integrated 12-bit ADC (1 Msps), but only two opamps and no CAPSENSE™ engineLimited capacitive sensing capability; lacks SmartSense auto-tuning and sigma-delta architectureSelect for high-precision ADC-only applications; not suitable for robust touch interfaces in humid environments

Compared with nRF52833 DK and CC2642R, CY8C4247LQI-BL463 uniquely integrates programmable analog (four opamps + CSD), digital logic (UDBs), and BLE in one die - reducing component count and enabling field-reconfigurable sensor interfaces without redesign.

Availability

CY8C4247LQI-BL463 is available at Aetrix Electronics and suitable for smart home sensor nodes, wearable health monitors, industrial wireless controllers, and interactive consumer remotes requiring stable component supply and long-term lifecycle assurance.

Supply support for CY8C4247LQI-BL463 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.

CY8C42xx-BL belongs to Infineon's PSoC™ 4 family - designed specifically for highly integrated, low-power, mixed-signal IoT endpoints where programmable analog/digital fabric and certified BLE connectivity must coexist on a single chip.

FAQ

What development tools are supported for CY8C4247LQI-BL463?

Infineon's PSoC™ Creator IDE (Windows-only, free) provides schematic-based design entry, automatic analog/digital routing, and pre-verified API components. Post-design, Arm®-compliant toolchains (GCC, Keil, IAR) support firmware compilation and debugging via SWD interface. The MiniProg3 programmer/debugger is required for flash programming and JTAG/SWD access.

Does CY8C4247LQI-BL463 support Bluetooth® LE 5.0 or later?

No - the device implements Bluetooth® LE 4.2 as specified in its BLESS subsystem. It does not support LE 5.0 features such as Long Range (Coded PHY), Higher Throughput (2 Mbps PHY), or Advertising Extensions. Firmware updates cannot extend PHY capabilities beyond hardware implementation.

Can the internal opamps drive external loads directly?

Yes - each opamp supports high-drive external mode (up to 25 mA sink/source) and can directly drive resistive or capacitive loads including LCD segments and small piezoelectric elements. Internal high-bandwidth mode is optimized for ADC buffering and comparator feedback paths.

Is the 7 mm × 7 mm QFN package RoHS and REACH compliant?

Yes - CY8C4247LQI-BL463 conforms to EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Material declarations and test reports are available through Infineon's Product Change Notification (PCN) portal and authorized distributor portals (e.g., Digi-Key, Mouser).

CY8C4247LQI-BL463 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4247LQI-BL463 FAQ

1.How can I place an order for CY8C4247LQI-BL463 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4247LQI-BL463 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4247LQI-BL463 reliable?

The price and inventory of CY8C4247LQI-BL463 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4247LQI-BL463 is usually 5 days.

3.What payment methods are accepted for CY8C4247LQI-BL463?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4247LQI-BL463 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4247LQI-BL463?

CY8C4247LQI-BL463 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4247LQI-BL463 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4247LQI-BL463?

For technical support, including CY8C4247LQI-BL463 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4247LQI-BL463 requirements.

6.How does Aetrix verify that CY8C4247LQI-BL463 is sourced from the original manufacturer or authorized distributors?

All CY8C4247LQI-BL463 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4247LQI-BL463 meets industry standards.

7.What is the process for return or replacement of CY8C4247LQI-BL463?

All CY8C4247LQI-BL463 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4247LQI-BL463, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4247LQI-BL463 part is unused and in its original packaging.

Return procedure for CY8C4247LQI-BL463:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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