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Infineon Technologies CY8C4247LQI-BL463T

Part No.:
CY8C4247LQI-BL463T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4247LQI-BL463T.pdf
Description:
IC MCU 32BIT 128KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,365

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Product details

Overview

CY8C4247LQI-BL463T from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® LE 4.2 radio, 48 MHz CPU, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It delivers BLE connectivity with –89 dBm RX sensitivity, 15.6 mA TX current at 0 dBm, and supports capacitive sensing, LCD drive, and TCPWM for motor control in compact IoT edge nodes.

For engineers reviewing the CY8C4247LQI-BL463T datasheet, CY8C4247LQI-BL463T pinout, CY8C4247LQI-BL463T application, or CY8C4247LQI-BL463T equivalent, key selection criteria include integrated BLE subsystem performance, Deep Sleep power (1.5 µA), SAR ADC resolution (12-bit, 1-Msps), GPIO flexibility (36 pins, CAPSENSE™/LCD/analog/digital), and QFN-56 package compatibility.

Technical Context

The device implements a dual-domain architecture: an Arm® Cortex®-M0 core with DMA and flash accelerator coexists with a dedicated Bluetooth® LE subsystem (BLESS) containing digital PHY, link-layer engine, and RF transceiver. Clocking includes IMO (8–48 MHz), WCO (32.768 kHz), and ECO support for precise timing.

Analog resources comprise four opamps with Comparator mode and ADC input buffering, a 12-bit SAR ADC with channel sequencer and averaging, two IDACs, and two low-power comparators-all operable in Deep Sleep. Digital logic is reconfigurable via four UDBs with macrocell-based datapaths and Verilog support.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 48 MHz with single-cycle multiply and DMA for real-time firmware execution
Memory256 KB flash (with read accelerator) + 32 KB SRAM for complex BLE stack + application code storage
BLE ComplianceBluetooth® LE 4.2 with master/slave link-layer support and 1-dB RSSI resolution
RF Performance–89 dBm RX sensitivity and –18 to +3 dBm programmable TX output power for robust wireless range
ADC12-bit SAR, 1-Msps sampling rate, differential/single-ended modes, hardware-averaged channel sequencing
Power Modes1.7 mA active @ 3 MHz; 1.5 µA Deep Sleep w/ WCO; 150 nA Hibernate w/ RAM retention; 60 nA Stop mode
GPIO36 programmable pins supporting CAPSENSE™, LCD segment/common drive, analog input/output, and digital logic

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style exposed pad, RoHS-compliant, moisture-sensitive level 3).

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.71–5.5 V input; powers CPU, BLE subsystem, and all peripherals
VSSGround referenceDedicated analog/digital ground plane connection point
P0[0]–P0[7]Programmable GPIO bankSupport CAPSENSE™, analog input, UART/SPI/I2C, or PWM output; configurable slew rate and drive strength
P1[0]–P1[7]Programmable GPIO bankIncludes two overvoltage-tolerant (OVT) pins for direct 5.5 V interface without level shifters
XTAL_IN / XTAL_OUTExternal crystal oscillator interfaceConnects to 24 MHz ECO for high-accuracy system clock; required for BLE timing compliance
WCO_IN / WCO_OUTWatch crystal oscillator interfaceDrives 32.768 kHz WCO for ultra-low-power Deep Sleep timing and RTC functions
ANTRF antenna port50 Ω matched RF output; connects directly to PCB antenna or matching network per AN91445 guidelines

Key Features

FeatureDesign Value
Integrated BLE Subsystem (BLESS)Dedicated hardware link-layer engine and digital PHY offload BLE protocol stack processing from CPU, reducing firmware latency and memory footprint
Capacitive Sensing (CSD)Sigma-delta architecture with >5:1 SNR and liquid-tolerance; SmartSense auto-tuning eliminates manual calibration during production
Programmable Analog BlocksFour opamps usable as buffers, comparators, or ADC preamps-operational down to Deep Sleep mode for wake-on-event sensing
Reconfigurable Digital LogicFour UDBs with eight macrocells each enable custom state machines, glue logic, or peripheral extensions without FPGA-level complexity
LCD Segment DriveAll GPIOs support LCD common/segment drive with 4-bit per-pin memory; operates in Deep Sleep to maintain display while minimizing power

Applications

Smart Home Sensor NodeWireless Medical Patch

Use Scenario: Battery-powered temperature/humidity/motion sensor transmitting data every 30 seconds to a smartphone gateway.

IC Role / Device Role / Timing Role: Single-chip BLE endpoint with integrated ADC, CAPSENSE™ for touch interface, and Deep Sleep management for multi-year battery life.

Use Value: 1.5 µA Deep Sleep current and hardware-accelerated BLE advertising reduce average system current to <10 µA, enabling CR2032 operation for >2 years.

Use Scenario: Disposable wearable patch monitoring skin impedance and heart rate, syncing data via BLE to clinical cloud platform.

IC Role / Device Role / Timing Role: BLE-enabled MCU with analog front-end (opamp + 12-bit ADC), low-power comparators for R-peak detection, and RAM-retentive Hibernate mode.

Use Value: 150 nA Hibernate with RAM retention preserves session state across battery replacement; CSD SNR >5:1 ensures reliable electrode contact detection under sweat.

Industrial Asset TagBluetooth Beacon for Retail

Use Scenario: Ruggedized tag attached to machinery, reporting vibration, temperature, and uptime via periodic BLE broadcast packets.

IC Role / Device Role / Timing Role: Self-contained telemetry node using TCPWM-triggered analog acquisition, BLE advertising, and watchdog-managed fault recovery.

Use Value: Hardware-triggered ADC sampling synchronized to TCPWM kill signals enables precise time-domain vibration analysis without CPU intervention.

Use Scenario: Small-format indoor beacon emitting iBeacon/Eddystone frames to trigger location-aware promotions on shopper smartphones.

IC Role / Device Role / Timing Role: Low-cost, high-integration BLE broadcaster with programmable TX power (–18 to +3 dBm) and adjustable advertising interval.

Use Value: Adjustable RF output power allows precise coverage tuning (1–10 m) without external PA or matching changes, reducing BOM cost and layout area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, 128 KB RAM; no integrated analog peripherals (ADC/opamp/CAPSENSE™)Requires external analog front-end for sensor interfacing; better suited for compute-intensive BLE mesh or audio streamingSelect when higher CPU performance and larger memory are critical, and analog integration is handled externally
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, 80 KB RAM; integrated 12-bit ADC (200 kSps), but no programmable analog blocks or CAPSENSE™Lacks reconfigurable analog/digital logic; optimized for long-range BLE and concurrent multi-protocol (BLE + IEEE 802.15.4)Select for extended BLE range (>100 m) or dual-protocol requirements where analog configurability is secondary

Compared with nRF52833 and CC2642R, CY8C4247LQI-BL463T uniquely combines BLE 4.2, Arm® Cortex®-M0 efficiency, and field-reconfigurable analog/digital blocks-enabling single-chip sensor fusion, touch UI, and LCD display without external components.

Availability

CY8C4247LQI-BL463T is available at Aetrix Electronics and suitable for smart home sensor nodes, wireless medical patches, industrial asset tags, and Bluetooth beacons requiring stable component supply and long-term lifecycle assurance.

Supply support for CY8C4247LQI-BL463T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

CY8C42xx-BL belongs to Infineon's PSoC™ 4 family-designed specifically for highly integrated, low-power, mixed-signal IoT endpoints requiring both wireless connectivity and configurable analog/digital logic in a single chip.

FAQ

What development tools are officially supported for CY8C4247LQI-BL463T?

Infineon officially supports PSoC™ Creator IDE (Windows-only, free download) for schematic-based hardware configuration and firmware development. The device is also compatible with Arm®-based toolchains including Keil MDK, GCC ARM Embedded, and IAR Embedded Workbench after initial project setup. Debugging requires MiniProg3 or KitProg2/3 programmers.

Does CY8C4247LQI-BL463T support Bluetooth® LE 5.0 or later?

No-CY8C4247LQI-BL463T implements Bluetooth® LE 4.2 only, as confirmed in the official datasheet (Rev. *B). It does not support LE 5.0 features such as Long Range (Coded PHY), Higher Throughput (2 Mbps PHY), or Advertising Extensions. For LE 5.0, consider Infineon's later-generation AIROC™ modules like CYW20829.

Can the on-chip opamps be used for driving external loads like piezoelectric elements?

Yes-the four opamps support high-drive external mode with up to ±25 mA output current and rail-to-rail swing, validated for driving piezo buzzers and small ultrasonic transducers. Each opamp includes programmable gain, bandwidth, and shutdown control, and remains functional in Deep Sleep mode for wake-on-event actuation.

Is the 7 mm × 7 mm QFN package lead-free and RoHS-compliant?

Yes-CY8C4247LQI-BL463T uses a lead-free, halogen-free, RoHS-compliant 56-pin QFN package (package code LQI), qualified to JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), and rated for industrial temperature range (–40 °C to +85 °C).

CY8C4247LQI-BL463T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4247LQI-BL463T FAQ

1.How can I place an order for CY8C4247LQI-BL463T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4247LQI-BL463T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4247LQI-BL463T reliable?

The price and inventory of CY8C4247LQI-BL463T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4247LQI-BL463T is usually 5 days.

3.What payment methods are accepted for CY8C4247LQI-BL463T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4247LQI-BL463T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4247LQI-BL463T?

CY8C4247LQI-BL463T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4247LQI-BL463T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4247LQI-BL463T?

For technical support, including CY8C4247LQI-BL463T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4247LQI-BL463T requirements.

6.How does Aetrix verify that CY8C4247LQI-BL463T is sourced from the original manufacturer or authorized distributors?

All CY8C4247LQI-BL463T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4247LQI-BL463T meets industry standards.

7.What is the process for return or replacement of CY8C4247LQI-BL463T?

All CY8C4247LQI-BL463T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4247LQI-BL463T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4247LQI-BL463T part is unused and in its original packaging.

Return procedure for CY8C4247LQI-BL463T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4247LQI-BL463T Tags

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