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Infineon Technologies CY8C4247LQI-BL473T

Part No.:
CY8C4247LQI-BL473T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4247LQI-BL473T.pdf
Description:
IC MCU 32BIT 128KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,701

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Product details

Overview

CY8C4247LQI-BL473T from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® Low Energy (BLE) 4.2 radio, 48 MHz CPU, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It delivers BLE connectivity with –89 dBm RX sensitivity and +3 dBm TX output in a 7 mm × 7 mm 56-pin QFN package, targeting wireless sensor nodes and portable BLE peripherals.

For engineers reviewing the CY8C4247LQI-BL473T datasheet, CY8C4247LQI-BL473T pinout, CY8C4247LQI-BL473T application, or CY8C4247LQI-BL473T equivalent, key selection criteria include integrated BLE subsystem power efficiency (15.6 mA TX at 0 dBm), Deep Sleep current (1.5 µA), SAR ADC performance (12-bit, 1-Msps), and GPIO flexibility (36 programmable pins with CAPSENSE™/LCD/analog support).

Technical Context

This MCU implements a dual-domain architecture: the Arm® Cortex®-M0 core handles application firmware and protocol stack execution, while the dedicated BLESS (Bluetooth® Low Energy Subsystem) manages RF PHY, link-layer state machine, and packet processing independently. The BLESS supports concurrent master/slave roles and includes hardware RSSI (1-dB resolution) and automatic antenna tuning support.

Analog subsystem integration includes four opamps with comparator mode and Deep Sleep operation, a 12-bit SAR ADC with channel sequencer and signal averaging, and two IDACs for capacitive sensing. Digital reconfigurability is enabled via four UDBs (Universal Digital Blocks), each containing eight macrocells and a data path, supporting custom logic and state machines without FPGA-level complexity.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 48 MHz with single-cycle multiply and DMA - enables real-time BLE stack execution and sensor fusion at low latency
Memory256 KB flash (with read accelerator), 32 KB SRAM - sufficient for BLE host stack, application code, and OTA update staging
BLE RadioBluetooth® LE 4.2, –89 dBm RX sensitivity, +3 dBm max TX output - meets Class 1.5 range requirements for indoor IoT endpoints
ADC12-bit SAR, 1-Msps, differential/single-ended modes with channel sequencer - supports multi-sensor acquisition with hardware averaging for noise reduction
Power ModesDeep Sleep: 1.5 µA (WCO active), Hibernate: 150 nA (RAM retention) - enables multi-year battery life in coin-cell–powered BLE sensors
GPIO36 programmable pins, including 2 OVT pins; all support CAPSENSE™, LCD, analog, or digital functions - eliminates external level shifters and reduces BOM count
Package7 mm × 7 mm, 56-pin QFN (LQI) - surface-mount compatible with automated assembly and compact PCB layouts

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQI) with exposed thermal pad. Pin mapping follows Infineon's standard CY8C42xx-BL pinout layout, optimized for RF isolation and mixed-signal routing.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO0–VDDIO3I/O power domainsIndependent 1.71–5.5 V supplies per port group enable mixed-voltage interfacing (e.g., 3.3 V MCU + 1.8 V sensor)
P0.0–P0.7, P1.0–P1.7, etc.Programmable GPIOEach pin configurable as digital I/O, analog input/output, CAPSENSE™ electrode, or LCD segment/common - no fixed-function pin constraints
ANTRF antenna interface50-Ω matched RF output requiring external matching network; internal PA and LNA integrated
XRESActive-low resetAsynchronous reset input with internal pull-up; debounced externally for robust system recovery
SWDCK/SWDIODebug interfaceTwo-pin Serial Wire Debug (SWD) for programming and real-time trace - no JTAG overhead or pin count penalty

Key Features

FeatureDesign Value
Integrated BLESS subsystemDedicated hardware link-layer engine offloads BLE protocol handling from CPU, reducing firmware overhead and enabling concurrent application + radio operation
SmartSense™ auto-tuningHardware-accelerated capacitive sensing calibration adjusts baseline and sensitivity dynamically - eliminates manual threshold tuning across temperature/humidity
UDB-based programmable logicFour universal digital blocks allow implementation of custom counters, encoders, or protocol translators without external logic ICs or FPGA resources
Segment LCD driveAll GPIOs support LCD segment/common drive with Deep Sleep operation - enables ultra-low-power display interfaces in wearables and medical devices
Reconfigurable SCBsTwo serial communication blocks support runtime switching between I²C, SPI, and UART - simplifies peripheral integration and reduces pin count conflicts

Applications

Wireless Sensor NodeSmart Wearable

Use Scenario: Battery-powered environmental monitor transmitting temperature, humidity, and motion data via BLE to smartphone gateway.

IC Role / Device Role / Timing Role: Central MCU + BLE transceiver + analog front-end controller - performs sensor acquisition, local processing, and secure BLE advertising/connection.

Use Value: 150 nA Hibernate mode extends CR2032 battery life beyond 3 years; integrated ADC and IDACs eliminate external signal conditioning components.

Use Scenario: Fitness tracker with touch-sensitive UI, heart-rate monitoring, and vibration feedback.

IC Role / Device Role / Timing Role: System-on-chip managing CAPSENSE™ buttons, optical sensor interface, PWM-driven haptic motor, and BLE connection management.

Use Value: SmartSense™ enables reliable touch detection through sweat and moisture; Deep Sleep current of 1.5 µA preserves battery during idle periods.

BLE Remote ControlIndustrial Asset Tag

Use Scenario: IR-to-BLE bridge remote controlling TVs and AV equipment using smartphone app.

IC Role / Device Role / Timing Role: Dual-role BLE device acting as peripheral (advertising button events) and central (scanning IR codes from legacy remotes).

Use Value: Concurrent master/slave BLESS operation enables seamless protocol translation; 36 GPIOs support IR receiver, LED indicators, and tactile buttons.

Use Scenario: Ruggedized tag tracking location, orientation, and shock events on factory equipment.

IC Role / Device Role / Timing Role: Edge intelligence node performing accelerometer data preprocessing, event-triggered BLE broadcast, and tamper detection.

Use Value: Programmable UDBs implement custom motion-detection logic in hardware; overvoltage-tolerant pins withstand industrial ESD environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, -96 dBm RX sensitivity, no integrated opamps or CAPSENSE™Higher compute throughput for complex BLE mesh or audio; lacks analog front-end for direct sensor interfacingSelect when floating-point math or mesh networking is required; add external ADC/opamp if analog sensing needed
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, -101 dBm RX sensitivity, integrated RF balun but no programmable analog blocksSuperior RF range and lower power in RX; requires external components for precision analog measurementPrefer for long-range beaconing or high-reliability industrial BLE links where analog integration is secondary

Compared with nRF52833 and CC2642R, CY8C4247LQI-BL473T uniquely combines BLE 4.2 radio, programmable analog (opamps, ADC, IDACs), and digital logic (UDBs) in one die - reducing system component count and enabling field-tunable sensor interfaces without external ICs.

Availability

CY8C4247LQI-BL473T is available at Aetrix Electronics and suitable for wireless sensor nodes, smart wearables, BLE remote controls, and industrial asset tags requiring stable component supply, full production traceability, and long-term lifecycle support.

Supply support for CY8C4247LQI-BL473T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.

CY8C42xx-BL belongs to Infineon's PSoC™ 4 family - designed specifically for cost-sensitive, battery-powered IoT endpoints requiring integrated BLE, configurable analog/digital peripherals, and rapid prototyping via PSoC™ Creator IDE.

FAQ

Does CY8C4247LQI-BL473T support Bluetooth® LE 5.0 or later?

No. This device implements Bluetooth® LE 4.2 only, as confirmed in the official Infineon datasheet (Rev. *B). It does not support LE 5.0 features such as Long Range (Coded PHY), higher throughput (2 Mbps PHY), or Advertising Extensions. Firmware updates cannot extend physical layer capabilities beyond hardware design.

What development tools are officially supported for CY8C4247LQI-BL473T?

Infineon officially supports PSoC™ Creator IDE (Windows-only) for schematic-based design and component configuration. Debug and programming use MiniProg3 or KitProg2 programmers. Arm® GCC and Keil MDK toolchains are supported for firmware development after project generation, but PSoC™ Creator remains mandatory for analog/digital block configuration and BLE stack integration.

Can the integrated opamps operate during Deep Sleep mode?

Yes. All four opamps support Deep Sleep operation with configurable power modes (low-power or high-speed), enabling continuous analog signal conditioning (e.g., sensor biasing or comparator monitoring) while consuming <1 µA per opamp - critical for wake-on-event architectures in battery-powered systems.

Is the 7 mm × 7 mm QFN package RoHS-compliant and lead-free?

Yes. The CY8C4247LQI-BL473T uses a lead-free, RoHS-compliant 56-pin QFN package (LQI suffix), with matte tin finish on terminals and halogen-free molding compound, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and IPC/JEDEC J-STD-033 handling requirements.

CY8C4247LQI-BL473T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4247LQI-BL473T FAQ

1.How can I place an order for CY8C4247LQI-BL473T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4247LQI-BL473T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4247LQI-BL473T reliable?

The price and inventory of CY8C4247LQI-BL473T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4247LQI-BL473T is usually 5 days.

3.What payment methods are accepted for CY8C4247LQI-BL473T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4247LQI-BL473T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4247LQI-BL473T?

CY8C4247LQI-BL473T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4247LQI-BL473T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4247LQI-BL473T?

For technical support, including CY8C4247LQI-BL473T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4247LQI-BL473T requirements.

6.How does Aetrix verify that CY8C4247LQI-BL473T is sourced from the original manufacturer or authorized distributors?

All CY8C4247LQI-BL473T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4247LQI-BL473T meets industry standards.

7.What is the process for return or replacement of CY8C4247LQI-BL473T?

All CY8C4247LQI-BL473T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4247LQI-BL473T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4247LQI-BL473T part is unused and in its original packaging.

Return procedure for CY8C4247LQI-BL473T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4247LQI-BL473T Tags

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