Infineon Technologies CY8C4247LQI-BL483

Overview

CY8C4247LQI-BL483 from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® Low Energy (BLE) 4.2 radio, 48 MHz CPU, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It supports capacitive sensing, LCD drive, and TCPWM for motor control in compact IoT edge nodes.

For engineers reviewing the CY8C4247LQI-BL483 datasheet, CY8C4247LQI-BL483 pinout, CY8C4247LQI-BL483 application, or CY8C4247LQI-BL483 equivalent, key selection criteria include BLE RF performance (–89 dBm RX sensitivity, +3 dBm TX), Deep Sleep current (1.5 µA), SAR ADC resolution (12-bit, 1-Msps), and GPIO count (36 pins with CAPSENSE™/LCD/analog/digital reconfiguration).

Technical Context

This MCU implements a dual-domain architecture: a fixed-function BLE subsystem (BLESS) with dedicated digital PHY and link-layer engine coexisting with a fully reconfigurable PSoC™ 4 fabric. The BLESS handles RF modulation, packet assembly, and master/slave state management independently of the Cortex-M0 core.

Analog resources include four opamps supporting comparator mode and ADC input buffering, plus a 12-bit SAR ADC with channel sequencer and signal averaging. Digital flexibility comes from four Universal Digital Blocks (UDBs), each with eight macrocells and data path, enabling custom logic or peripheral emulation without FPGA-level complexity.

Key Specifications

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style exposed pad, RoHS-compliant, moisture sensitivity level 3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE microcontroller applications.

Compared with nRF52833 and DA14695, CY8C4247LQI-BL483 uniquely integrates reconfigurable analog/digital logic, CAPSENSE™, and LCD drive in a single die-reducing BOM count and PCB area for human-interface-rich BLE endpoints.

Availability

CY8C4247LQI-BL483 is available at Aetrix Electronics and suitable for smart home sensor nodes, wearable health monitors, industrial asset trackers, and smart lighting controls requiring stable component supply across design-in, prototyping, and volume production phases.

Supply support for CY8C4247LQI-BL483 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security controllers, and embedded systems solutions.

CY8C4247LQI-BL483 belongs to the PSoC™ 4 CY8C4xxx-BL family-designed specifically for highly integrated, low-power, human-interface-centric BLE endpoints requiring on-chip analog signal conditioning, capacitive touch, and flexible digital logic.

FAQ

Does CY8C4247LQI-BL483 support Bluetooth® 5.0 or later?

No. This device implements Bluetooth® Low Energy 4.2 only, as confirmed by its BLESS subsystem architecture and TRM register mapping. It does not support Bluetooth 5.0 features such as Long Range (Coded PHY), higher throughput (2 Mbps PHY), or Advertising Extensions. Firmware updates cannot enable these capabilities due to hardware limitations in the RF transceiver and link-layer engine.

Can the 12-bit SAR ADC operate during Deep Sleep mode?

No-the SAR ADC requires active clock domains and cannot sample while the device is in Deep Sleep mode. However, the two low-power comparators and CSD engine remain functional in Deep Sleep and can trigger wake-up events. ADC conversion must occur after wake-up, typically within microseconds using the high-speed IMO clock.

What is the maximum operating temperature for continuous BLE transmission?

The device is rated for continuous operation up to +85 °C ambient temperature under full BLE transmit load (0 dBm output). At +105 °C, RF output power degrades by approximately 0.5 dB per 10 °C above 85 °C, and sustained operation above 105 °C is not guaranteed per the Absolute Maximum Ratings table in Rev. *B datasheet.

Is external flash memory required for OTA firmware updates?

No. The on-chip 256 KB flash includes dedicated bootloader space and supports dual-bank operation for safe Over-The-Air (OTA) updates. Infineon's BLE Component in PSoC™ Creator configures flash sectors automatically to isolate application and bootloader regions, enabling atomic update rollback without external memory.