Infineon Technologies CY8C4247LQI-BL493T

Overview

CY8C4247LQI-BL493T from Infineon is a PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU (48 MHz), 256 KB flash, 32 KB SRAM, and a fully embedded AIROC™ Bluetooth® LE 4.2 radio subsystem with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit 1-Msps SAR ADC, and up to 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package. Used in battery-powered BLE sensor nodes requiring integrated RF, analog sensing, and low-power operation.

For engineers reviewing the CY8C4247LQI-BL493T datasheet, CY8C4247LQI-BL493T pinout, CY8C4247LQI-BL493T application, or CY8C4247LQI-BL493T equivalent, key selection criteria include BLE link-layer engine support for master/slave modes, Deep Sleep current of 1.5 µA with WCO active, programmable UDB-based digital logic, and hardware-accelerated CAPSENSE™ with SmartSense tuning.

Technical Context

This device implements a dual-domain architecture: a fixed-function Arm® Cortex®-M0 core with cache-assisted flash execution and a reconfigurable analog/digital fabric comprising Universal Digital Blocks (UDBs), CTBm opamps, and CSD sensing blocks. The BLESS subsystem integrates RF transceiver, digital PHY, and link-layer engine on-die - eliminating external RF components.

Power management includes four low-power states: Active (1.7 mA @ 3 MHz), Deep Sleep (1.5 µA w/ WCO), Hibernate (150 nA w/ RAM retention), and Stop (60 nA). All analog peripherals - including opamps, comparators, and ADC - retain functionality in Deep Sleep mode, enabling wake-on-event sensing.

Key Specifications

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQI suffix), thermally enhanced, RoHS-compliant, with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE microcontroller applications.

Compared with nRF52840-QIAA and CC2642R1F, CY8C4247LQI-BL493T uniquely combines BLE 4.2 radio, reconfigurable analog/digital fabric, and production-ready CAPSENSE™ - reducing BOM count and enabling field-tunable sensor behavior without firmware changes.

Availability

CY8C4247LQI-BL493T is available at Aetrix Electronics and suitable for smart home sensor nodes, wearable health monitors, industrial asset trackers, and smart lighting controls requiring stable component supply and long-term lifecycle assurance.

Supply support for CY8C4247LQI-BL493T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D and manufacturing infrastructure.

CY8C4247LQI-BL493T belongs to the PSoC™ 4 CY8C4xxx-BL family, designed specifically for highly integrated, low-power Bluetooth® LE endpoint devices that require concurrent analog sensing, digital logic customization, and certified wireless connectivity in a single die.

FAQ

Does CY8C4247LQI-BL493T support Bluetooth® LE 5.0?

No. This device implements Bluetooth® LE 4.2 only, as confirmed in the official Infineon datasheet (Rev. *B, p.1). It does not support LE 5.0 features such as Long Range (Coded PHY), Higher Throughput (2 Mbps PHY), or Advertising Extensions. Firmware-level upgrades cannot enable these capabilities due to hardware limitations in the BLESS subsystem.

Can the on-chip opamps drive external loads directly?

Yes - each of the four CTBm opamps supports high-drive external mode with up to 25 mA short-circuit current and rail-to-rail output swing. They can directly drive resistive loads (e.g., thermistor biasing), capacitive loads up to 100 pF, or buffer ADC inputs. Internal high-bandwidth mode is reserved for on-die signal routing and cannot be accessed externally.

Is the 56-pin QFN package lead-free and RoHS-compliant?

Yes. The LQI package variant (CY8C4247LQI-BL493T) uses lead-free matte tin plating and complies with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3). The thermal pad must be soldered to a solid copper pour connected to GND for thermal dissipation and EMI suppression.

What development tools are required to program this MCU?

Programming requires Infineon's PSoC™ Creator IDE (free, Windows-only) for schematic-based design and code generation, plus a MiniProg3 or KitProg2 programmer/debugger. ARM GCC toolchain support is available via ModusToolbox™ for advanced users, but PSoC Creator remains the primary environment for leveraging UDBs, CAPSENSE™, and BLESS configuration wizards.