Infineon Technologies CY8C4247LQQ-BL483T
- Part No.:
- CY8C4247LQQ-BL483T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 56-UFQFN Exposed Pad
- Datasheet:
-
CY8C4247LQQ-BL483T.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 56QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4247LQQ-BL483T from Infineon is a PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU (48 MHz), 256 KB flash, 32 KB SRAM, and a fully embedded AIROC™ Bluetooth® LE 4.2 radio subsystem with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit 1-Msps SAR ADC, and up to 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package for compact wireless sensor node designs.
For engineers reviewing the CY8C4247LQQ-BL483T datasheet, CY8C4247LQQ-BL483T pinout, CY8C4247LQQ-BL483T application, or CY8C4247LQQ-BL483T equivalent, key selection criteria include integrated BLE PHY/link-layer coexistence with programmable analog/digital blocks, Deep Sleep current (1.5 µA), and hardware-accelerated CAPSENSE™ with SmartSense tuning.
Technical Context
This device implements a tightly coupled dual-subsystem architecture: the Arm® Cortex®-M0 core executes firmware while the dedicated BLESS (Bluetooth® Low Energy SubSystem) handles RF protocol stack offload, including Link Layer engine supporting both master and slave roles. The analog subsystem features four opamps with Comparator mode and ADC input buffering, all operable in Deep Sleep mode.
Digital flexibility stems from four Universal Digital Blocks (UDBs), each with eight macrocells and data path logic, enabling custom state machines or peripheral emulation. Serial communication is managed via two reconfigurable SCBs supporting I²C/SPI/UART, and timing control uses four 16-bit TCPWM blocks with comparator-triggered kill signals for motor drive safety.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0 @ 48 MHz with single-cycle multiply and DMA support for real-time control loops |
| Memory | 256 KB flash (with read accelerator) and 32 KB SRAM for BLE stack + application firmware co-residency |
| BLE Radio | AIROC™ Bluetooth® LE 4.2 compliant RF transceiver; –89 dBm RX sensitivity enables robust 10–30 m indoor link range |
| ADC | 12-bit SAR ADC at 1 Msps with differential/single-ended modes and hardware channel sequencer for multi-sensor polling |
| Power Modes | Deep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA with RAM retention - critical for battery-powered BLE endpoints |
| GPIO Count | Up to 36 programmable pins; any pin supports CAPSENSE™, LCD segment drive, analog input, or digital I/O |
| Package | 7 mm × 7 mm, 56-pin QFN (LQQ) with exposed thermal pad - optimized for space-constrained PCB layouts |
Pinout & Package
The CY8C4247LQQ-BL483T is housed in a 7 mm × 7 mm, 56-pin QFN package (suffix LQQ) with wettable flank leads and an exposed thermal pad for enhanced thermal dissipation in compact wireless modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power supply domains | Independent 1.71–5.5 V supplies per bank enable mixed-voltage interfacing (e.g., 1.8 V sensor + 3.3 V display) |
| P0.0–P9.7 | Programmable GPIOs | 36 total pins; configurable as CAPSENSE™ electrodes, analog inputs, UART/I²C/SPI signals, or PWM outputs |
| ANT | RF antenna interface | 50 Ω matched RF output port requiring external matching network for PCB or chip antenna integration |
| XRES | Active-low reset input | Asynchronous reset pin with internal pull-up; accepts 1.71–5.5 V logic levels independent of VDD |
| SWDCK/SWDIO | Debug interface | Two-pin SWD interface for programming and real-time debugging without dedicated JTAG header |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE Subsystem (BLESS) | Dedicated hardware Link Layer engine eliminates host CPU overhead for connection management, advertising, and scanning |
| Hardware CAPSENSE™ (CSD) | Sigma-delta modulator with >5:1 SNR and liquid-tolerant operation - enables touch buttons/knobs on wet or sealed surfaces |
| SmartSense Auto-Tuning | Firmware-independent hardware algorithm dynamically adjusts sensor parameters during operation to maintain stable baseline |
| Reconfigurable SCBs | Two serial blocks support runtime switching between I²C master/slave, SPI master/slave, or UART - simplifies multi-peripheral BOM |
| Deep Sleep Analog Operation | Opamps, comparators, and ADC input buffers remain active in Deep Sleep mode - enables low-power wake-on-event sensing |
Applications
| Wireless Sensor Node | Smart Home Touch Interface |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 2 seconds to a smartphone gateway via BLE. IC Role / Device Role / Timing Role: Single-chip controller handling sensor acquisition (via SAR ADC), CAPSENSE™ button wake, BLE advertising/connection, and ultra-low-power scheduling. Use Value: 1.5 µA Deep Sleep current extends CR2032 battery life beyond 2 years; integrated BLESS avoids external BLE SoC and associated RF layout complexity. | Use Scenario: Wall-mounted lighting control panel with capacitive sliders and status LEDs, communicating wirelessly with a central hub. IC Role / Device Role / Timing Role: Primary MCU executing touch decoding, LED PWM dimming, and BLE GATT service hosting for remote configuration. Use Value: Hardware CSD + SmartSense delivers consistent touch response across environmental variations; 36 GPIOs route all touch electrodes, LED drivers, and debug lines within one QFN package. |
| BLE Beacon Transmitter | Industrial Asset Tracker |
Use Scenario: Small-form-factor iBeacon/Eddystone transmitter mounted on retail shelves or museum exhibits. IC Role / Device Role / Timing Role: Standalone BLE advertiser generating periodic packets with configurable UUID, major/minor values, and TX power level. Use Value: +3 dBm TX output improves beacon detection reliability in obstructed environments; no external crystal needed - WCO provides sufficient BLE timing accuracy. | Use Scenario: Ruggedized equipment tag monitoring location (via BLE scan RSSI), temperature, and tamper status in factory settings. IC Role / Device Role / Timing Role: Edge intelligence node performing local sensor fusion, event-triggered BLE alerts, and low-duty-cycle wake/sleep cycling. Use Value: Programmable UDBs implement custom tamper-detection logic; 150 nA Hibernate mode preserves RAM state during long idle periods between maintenance checks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE-integrated microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52833 | 64 MHz Arm® Cortex®-M4F core; 512 KB flash; higher TX power (+8 dBm); no integrated CAPSENSE™ or programmable analog | Requires external ADC/opamp for analog sensing; better suited for compute-intensive BLE mesh or audio streaming | Select when floating-point math, larger code footprint, or higher RF range outweighs need for on-die analog reconfigurability |
| Dialog DA14695 | Arm® Cortex®-M33 core; 2 MB flash; dual-band 2.4 GHz/802.15.4; no programmable UDBs or hardware CSD | Lacks analog/digital reconfigurability; targets high-security BLE + Thread/Zigbee gateways | Prefer for secure over-the-air updates and multi-protocol coexistence where PSoC™ 4's analog flexibility is secondary |
Compared with nRF52833 and DA14695, CY8C4247LQQ-BL483T uniquely combines BLE radio, programmable analog (opamps, ADC, CSD), and digital logic (UDBs) in one die - reducing component count and layout risk for cost-sensitive, sensor-rich BLE endpoints.
Availability
CY8C4247LQQ-BL483T is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home interfaces, BLE beacons, and industrial asset trackers requiring stable component supply and long-term manufacturability.
Supply support for CY8C4247LQQ-BL483T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded security solutions, with global manufacturing and R&D infrastructure.
The PSoC™ 4 CY8C4xxx-BL product line was designed to deliver programmable analog + digital + BLE integration in a single chip for rapid development of intelligent, low-power IoT edge devices.
FAQ
Does CY8C4247LQQ-BL483T require an external crystal for BLE operation?
No. The device integrates a Watch Crystal Oscillator (WCO) that meets Bluetooth® LE timing accuracy requirements (±50 ppm) for advertising and connection intervals. An external 32 kHz crystal is optional for higher precision or ultra-low-jitter timing in non-BLE functions.
Can the SAR ADC operate while the device is in Deep Sleep mode?
Yes - the 12-bit SAR ADC can perform conversions in Deep Sleep mode using the WCO clock source. Channel sequencing and averaging are supported, enabling autonomous multi-sensor polling without waking the CPU.
What is the maximum allowed voltage on GPIO pins configured as analog inputs?
GPIO pins used as analog inputs must not exceed the corresponding VDDIO supply voltage (1.71–5.5 V). Overvoltage-tolerant (OVT) pins P0.0 and P0.1 support up to 5.5 V regardless of VDDIO, but standard GPIOs clamp at VDDIO + 0.3 V per absolute maximum ratings.
Is the AIROC™ BLE subsystem certified for regulatory compliance?
Yes - the integrated AIROC™ BLE radio subsystem carries FCC, IC, CE, and MIC certifications. Final system-level certification requires validation of the host PCB layout, antenna design, and enclosure per AN91445 and AN95089 guidelines.
CY8C4247LQQ-BL483T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 56-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4247LQQ-BL483T FAQ
1.How can I place an order for CY8C4247LQQ-BL483T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4247LQQ-BL483T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4247LQQ-BL483T reliable?
The price and inventory of CY8C4247LQQ-BL483T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4247LQQ-BL483T is usually 5 days.
3.What payment methods are accepted for CY8C4247LQQ-BL483T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4247LQQ-BL483T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4247LQQ-BL483T?
CY8C4247LQQ-BL483T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4247LQQ-BL483T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4247LQQ-BL483T?
For technical support, including CY8C4247LQQ-BL483T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4247LQQ-BL483T requirements.
6.How does Aetrix verify that CY8C4247LQQ-BL483T is sourced from the original manufacturer or authorized distributors?
All CY8C4247LQQ-BL483T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4247LQQ-BL483T meets industry standards.
7.What is the process for return or replacement of CY8C4247LQQ-BL483T?
All CY8C4247LQQ-BL483T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4247LQQ-BL483T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4247LQQ-BL483T part is unused and in its original packaging.
Return procedure for CY8C4247LQQ-BL483T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4247LQQ-BL483T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

