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Infineon Technologies CY8C4248FLI-BL583T

Part No.:
CY8C4248FLI-BL583T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
76-XFBGA, WLCSP
Datasheet:
AetrixCY8C4248FLI-BL583T.pdf
Description:
IC MCU 32BIT 256KB FLASH 76WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,878

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Product details

Overview

CY8C4248FLI-BL583T from Infineon is a PSOC™ 4 programmable system-on-chip integrating an Arm® Cortex®-M0+ CPU, configurable analog and digital peripherals, 256 KB flash, 32 KB SRAM, and CapSense™ capacitive sensing capability. It operates at up to 48 MHz, supports USB 2.0 full-speed device interface, and includes hardware-based cryptographic acceleration (AES-128). It is used in human-interface devices such as touch-enabled industrial HMI panels.

For engineers reviewing the CY8C4248FLI-BL583T datasheet, CY8C4248FLI-BL583T pinout, CY8C4248FLI-BL583T application, or CY8C4248FLI-BL583T equivalent, key selection criteria include CapSense™ channel count, USB device stack support, flash retention over 100k cycles, and availability of hardware TRNG and CRC modules for secure firmware updates.

Technical Context

This device belongs to the PSOC™ 4200 family and implements a dual-bus architecture with separate AHB-Lite and APB buses for concurrent CPU and peripheral operation. It integrates a programmable analog block (PSoC™ Analog Coprocessor) supporting op-amps, comparators, and SAR ADCs up to 12-bit/1 Msps, alongside a programmable digital block (UDB) enabling custom logic, state machines, and communication protocols including I²C, SPI, and UART.

The chip features a dedicated CapSense™ subsystem with SmartSense™ auto-tuning, supporting up to 62 self-capacitive or 48 mutual-capacitive sensors. Its USB 2.0 PHY includes internal transceivers and supports suspend/resume, bus-powered operation, and endpoint FIFOs - eliminating need for external USB level-shifting or termination components.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0+ @ 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and low-latency interrupt handling.
Flash / SRAM256 KB flash (100k write/erase cycles, 20-year data retention) + 32 KB SRAM - sufficient for complex CapSense™ + USB + BLE host stack coexistence.
CapSense™ ChannelsUp to 62 self-cap or 48 mutual-cap sensors - supports multi-touch sliders, proximity wake-up, and noise-immune button arrays in EMI-prone environments.
USB InterfaceFull-speed (12 Mbps) device-only with integrated PHY and 512-byte endpoint buffer - eliminates external USB transceiver and simplifies PCB layout.
Analog Peripherals12-bit SAR ADC (1 Msps), 2 op-amps, 2 comparators, IDACs - enables sensor signal conditioning and closed-loop analog control without external ICs.
Security FeaturesAES-128 hardware accelerator, TRNG, CRC unit, flash protection bits - supports secure boot, encrypted firmware updates, and tamper-resistant HMI authentication.

Pinout & Package

Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad. RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]GPIO / CapSense™ CSD / UART0 RX/TXConfigurable digital I/O with CapSense™ shield and sense capability; supports hardware UART with automatic baud rate detection.
P1[0]–P1[7]GPIO / CapSense™ CSD / I²C SCL/SDADual-function pins supporting mutual-capacitive scanning and standard I²C master/slave operation with slew-rate control.
USB_DP / USB_DMUSB 2.0 differential pairIntegrated 1.5 kΩ pull-up on USB_DP for full-speed enumeration; no external resistors required.
VDDA / VDDDAnalog / Digital supplySeparate 1.71–5.5 V supplies allow independent noise filtering; internal LDO regulates core voltage from VDDD.
XTAL_IN / XTAL_OUTExternal crystal oscillator terminalsSupports 1–33 MHz crystals for precise timing; internal PLL enables 48 MHz system clock from 4 MHz crystal.

Key Features

FeatureDesign Value
Programmable UDB ArrayEnables custom digital logic (e.g., PWM generators, protocol engines) without FPGA or external glue logic - reduces BOM and board area.
SmartSense™ Auto-TuningAutomatically calibrates CapSense™ baseline and thresholds across temperature/humidity drift - eliminates manual tuning in production test.
Hardware AES-128 + TRNGAccelerates encryption/decryption by >10× vs software-only; TRNG meets NIST SP800-90B entropy requirements for secure key generation.
Low-Power Deep-Sleep ModeConsumes 1.3 µA typical with RTC running and 8 KB SRAM retained - extends battery life in portable touch interfaces.
USB Device Stack SupportIncludes certified USB HID and CDC class drivers in PSoC™ Creator IDE - reduces firmware development time by ~3 weeks vs bare-metal implementation.

Applications

Industrial HMI PanelMedical Patient Monitor

Use Scenario: Touchscreen overlay on sealed front panel of PLC operator terminal requiring ESD-hardened, glove-compatible input.

IC Role / Device Role / Timing Role: Primary MCU executing CapSense™ scan, USB HID report generation, and real-time status LED control with <10 ms response latency.

Use Value: Integrated CapSense™ eliminates external touch controller IC; USB device mode enables direct connection to host PC for configuration and diagnostics without additional USB-to-serial bridge.

Use Scenario: Bedside vital sign display with capacitive slider for volume adjustment and proximity wake-up to conserve power.

IC Role / Device Role / Timing Role: System-on-chip managing sensor data aggregation, local UI rendering, and USB CDC interface for clinical data export.

Use Value: Hardware TRNG and AES enable HIPAA-compliant encrypted data logging; deep-sleep current <1.5 µA extends battery runtime beyond 72 hours during standby.

Smart Home ThermostatAutomotive Cabin Control

Use Scenario: Wall-mounted HVAC controller with ambient light adaptive backlight and multi-finger gesture recognition.

IC Role / Device Role / Timing Role: Central controller performing ambient light sensing (via IDAC + photodiode), CapSense™ gesture decoding, and Zigbee/Thread co-processor interface via UART.

Use Value: Programmable analog blocks condition photodiode signal without external op-amp; mutual-capacitive scanning rejects false triggers from condensation or dust.

Use Scenario: Center console climate control module with haptic feedback and CAN bus integration for vehicle network communication.

IC Role / Device Role / Timing Role: Dedicated UI processor offloading touch processing from main body controller; communicates via isolated CAN transceiver connected to P0[6]/P0[7].

Use Value: Dual-supply architecture (VDDA/VDDD) isolates analog CapSense™ noise from digital CAN signaling; flash protection prevents unauthorized firmware modification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY8C4247LQI-BL483Same core and memory, but 48-pin QFN, no USB PHY, reduced CapSense™ channels (32 self-cap)Lacks USB connectivity; suitable only for UART/I²C-based HMI where host-side USB bridge is acceptableSelect when board space is constrained and USB is not required - saves ~$0.35/unit at 10k volume
STM32F072CBT6Arm® Cortex®-M0, 128 KB flash, 16 KB SRAM, USB 2.0 device, but no integrated CapSense™ or programmable analog/digital blocksRequires external touch controller and op-amp circuitry for comparable analog functionalitySelect when leveraging existing STM32 ecosystem tools and prefer vendor-agnostic HAL libraries over PSoC™ Creator's component-based design flow

Compared with CY8C4248FLI-BL583T, CY8C4247LQI-BL483 trades USB and CapSense™ scalability for smaller footprint and cost, while STM32F072CBT6 offers broader toolchain support but increases BOM count and analog design effort for touch applications.

Availability

CY8C4248FLI-BL583T is available at Aetrix Electronics and suitable for industrial HMI panels, medical patient monitors, smart home thermostats, and automotive cabin controls requiring stable component supply and long-term manufacturability.

Supply support for CY8C4248FLI-BL583T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and microcontrollers, with global R&D and manufacturing infrastructure.

This part belongs to the PSOC™ 4 product line, designed specifically for cost-sensitive, highly integrated embedded systems requiring flexible analog/digital signal processing, capacitive touch, and USB connectivity in a single chip.

FAQ

Does CY8C4248FLI-BL583T support Bluetooth Low Energy?

No, this device does not integrate a Bluetooth radio or baseband. It lacks the RF transceiver, matching network, and antenna interface required for BLE. However, it can interface with external BLE modules (e.g., CYBLE-416045-02) via UART or SPI, and its hardware AES engine accelerates BLE pairing and encryption operations.

What debug interface does CY8C4248FLI-BL583T use?

It uses ARM Serial Wire Debug (SWD) over two dedicated pins (SWDIO and SWCLK), compatible with standard J-Link, CMSIS-DAP, and MiniProg4 debug probes. The device supports full run-control debugging, flash programming, and real-time variable monitoring without requiring additional debug headers or trace pins.

Can the CapSense™ subsystem operate during deep-sleep mode?

Yes, CapSense™ can perform low-power scanning in deep-sleep mode using the dedicated CapSense™ interrupt controller and hardware sequencer. It consumes 1.8 µA typical while scanning up to 8 buttons at 10 Hz, with automatic wake-up triggered by touch event to resume full CPU operation.

Is there a qualified automotive-grade version of this part?

No, CY8C4248FLI-BL583T is rated for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 qualified. For automotive cabin applications, Infineon recommends the PSOC™ Automotive 4 series (e.g., CY8C4045LQI-S412), which includes AEC-Q100 Grade 2 qualification, extended temperature support (–40°C to +105°C), and enhanced ESD robustness (±15 kV HBM).

CY8C4248FLI-BL583T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
76-XFBGA, WLCSP
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248FLI-BL583T FAQ

1.How can I place an order for CY8C4248FLI-BL583T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248FLI-BL583T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248FLI-BL583T reliable?

The price and inventory of CY8C4248FLI-BL583T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248FLI-BL583T is usually 5 days.

3.What payment methods are accepted for CY8C4248FLI-BL583T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248FLI-BL583T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4248FLI-BL583T?

CY8C4248FLI-BL583T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4248FLI-BL583T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248FLI-BL583T?

For technical support, including CY8C4248FLI-BL583T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248FLI-BL583T requirements.

6.How does Aetrix verify that CY8C4248FLI-BL583T is sourced from the original manufacturer or authorized distributors?

All CY8C4248FLI-BL583T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248FLI-BL583T meets industry standards.

7.What is the process for return or replacement of CY8C4248FLI-BL583T?

All CY8C4248FLI-BL583T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248FLI-BL583T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248FLI-BL583T part is unused and in its original packaging.

Return procedure for CY8C4248FLI-BL583T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4248FLI-BL583T Tags

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