Infineon Technologies CY8C4248FNI-BL483T
- Part No.:
- CY8C4248FNI-BL483T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 76-UFBGA, WLCSP
- Datasheet:
-
CY8C4248FNI-BL483T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 76WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:4,594
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4248FNI-BL483T from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® LE 4.2 radio, 48 MHz CPU, 256 KB flash, and 32 KB SRAM. It delivers programmable analog (12-bit SAR ADC, opamps, comparators), digital logic (UDBs), capacitive sensing (CSD), and LCD drive in a single 7 mm × 7 mm 56-pin QFN package - deployed in wireless human interface devices, BLE sensor nodes, and smart home edge controllers.
For engineers reviewing the CY8C4248FNI-BL483T datasheet, CY8C4248FNI-BL483T pinout, CY8C4248FNI-BL483T application, or CY8C4248FNI-BL483T equivalent, key selection criteria include integrated BLE PHY performance (–89 dBm RX sensitivity, +3 dBm TX power), Deep Sleep current (1.5 µA with WCO), CAPSENSE™ SNR (>5:1), and GPIO flexibility (36 pins, OVT support, reconfigurable SCBs).
Technical Context
This MCU implements a tightly coupled dual-subsystem architecture: the Arm® Cortex®-M0 core executes firmware while the dedicated BLESS (Bluetooth® Low Energy Subsystem) handles link-layer operations autonomously, supporting both master and slave roles. The RF transceiver operates at 2.4 GHz with 50-Ω antenna drive and integrated digital PHY.
Analog resources include four opamps with Comparator mode and ADC input buffering, plus a 12-bit, 1-Msps SAR ADC with channel sequencer and signal averaging. Digital programmability is enabled via four UDBs - each with eight macrocells and data path - and two reconfigurable SCBs supporting I²C/SPI/UART on-the-fly.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0, 48 MHz - enables real-time BLE stack execution with single-cycle multiply and DMA acceleration |
| Memory | 256 KB flash + 32 KB SRAM - supports complex BLE profiles, OTA updates, and local sensor fusion without external memory |
| BLE Compliance | Bluetooth® LE 4.2 - ensures interoperability with smartphones, gateways, and certified peripherals |
| RF Performance | RX sensitivity –89 dBm, TX output –18 to +3 dBm - provides robust 10–30 m indoor range with low-power operation |
| Power Modes | Deep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA (RAM retention) - extends battery life in coin-cell-powered endpoints |
| Analog Peripherals | 12-bit 1-Msps SAR ADC, 4 opamps, 2 comparators - enables simultaneous analog sensing, signal conditioning, and threshold detection |
| Digital Flexibility | 4 UDBs + 2 reconfigurable SCBs - allows custom protocol implementation (e.g., proprietary UART variants) and hardware-accelerated state machines |
Pinout & Package
Package: 7 mm × 7 mm, 56-pin QFN (exposed thermal pad), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 1.71–5.5 V input; powers CPU, analog/digital blocks, and GPIOs - supports direct connection to Li-ion or 3.3 V rails |
| GND | Ground reference | Common return for analog/digital/RF sections; requires low-impedance PCB plane separation per layout guidelines |
| P0[0]–P0[7] | Programmable GPIO | Capacitive sensing, LCD segment/common, analog input, or digital I/O - configurable slew rate and drive strength |
| P1[0]–P1[7] | Programmable GPIO | Includes two overvoltage-tolerant (OVT) pins - safe for 5.5 V inputs in mixed-voltage systems |
| XTAL_IN / XTAL_OUT | External crystal oscillator | Supports 4–24 MHz crystals for precise timing; required for BLE radio accuracy and USB if enabled |
| WCO_IN / WCO_OUT | Watch crystal oscillator | 32.768 kHz crystal input for Deep Sleep timing and RTC - enables ultra-low-power wake-up intervals |
| ANT | RF antenna interface | 50-Ω differential RF output; connects directly to PCB trace antenna or matching network per AN91445 |
| XRES | Active-low reset | Asynchronous reset input; debounced internally, compatible with pushbutton or supervisor ICs |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLESS subsystem | Offloads BLE link-layer processing from CPU - preserves M0 cycles for application logic and reduces firmware complexity |
| SmartSense™ auto-tuning | Hardware-accelerated CAPSENSE™ calibration - eliminates manual tuning across temperature/humidity and enables production-line consistency |
| Reconfigurable SCBs | Single hardware block supports I²C, SPI, or UART at runtime - simplifies BOM by removing discrete protocol translators |
| Deep Sleep with WCO | 1.5 µA current with 32.768 kHz RTC running - enables multi-year battery life in periodic-sensing applications (e.g., every 5 s) |
| UDB-based logic | Four universal digital blocks with Verilog support - implements custom PWM generators, encoders, or glue logic without FPGA cost |
Applications
| Wireless Remote Control | BLE Sensor Node |
|---|---|
Use Scenario: Battery-powered TV remote with touchpad, button matrix, and motion wake-up. IC Role / Device Role / Timing Role: MCU executes HID profile, processes CAPSENSE™ touch data, manages BLE advertising intervals, and drives IR/LED feedback. Use Value: Integrated CSD SNR >5:1 ensures reliable gesture detection through plastic housing; Deep Sleep current <2 µA extends CR2032 life beyond 12 months. | Use Scenario: Compact environmental monitor (temp/humidity/pressure) transmitting data hourly to gateway. IC Role / Device Role / Timing Role: Host controller for sensors via I²C, performs local calibration, schedules BLE connection events, and manages power states. Use Value: On-chip 12-bit ADC with channel sequencer acquires all sensors in <1 ms; Hibernate mode (150 nA) minimizes idle drain between measurements. |
| Smart Home Keypad | Wearable Health Band |
Use Scenario: Wall-mounted access keypad with backlit LCD, tamper detection, and encrypted BLE pairing. IC Role / Device Role / Timing Role: Manages LCD segments in Deep Sleep, validates PIN entries, runs AES crypto engine, and maintains secure BLE connections. Use Value: Segment LCD drive on all GPIOs enables custom icon layout; OVT pins tolerate 5 V door-lock interface signals without level shifters. | Use Scenario: Fitness band measuring heart rate via PPG, storing session data, and syncing via BLE. IC Role / Device Role / Timing Role: Controls LED/photodiode timing, digitizes analog PPG signal, runs motion compensation algorithm, and batches BLE notifications. Use Value: Opamp comparator mode triggers ADC sampling on pulse edges; 1-Msps SAR captures transient PPG waveforms with minimal aliasing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth® LE microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52833 | 64 MHz Arm® Cortex®-M4F, 512 KB flash, no integrated analog ADC or opamps - requires external signal conditioning | Better for compute-intensive BLE mesh or audio streaming; less suitable for analog sensor front-end integration | Select when floating-point math or larger code footprint dominates over analog integration needs |
| Texas Instruments CC2642R | 48 MHz Arm® Cortex®-M4F, 352 KB flash, integrated 12-bit ADC but only 2 opamps and no CAPSENSE™ hardware acceleration | Strong RF coexistence (multi-protocol), weaker capacitive sensing SNR and no SmartSense™ auto-tuning | Select for industrial environments requiring concurrent BLE + IEEE 802.15.4, not for high-reliability touch interfaces |
Compared with nRF52833 and CC2642R, CY8C4248FNI-BL483T uniquely combines BLE 4.2, high-SNR CAPSENSE™, analog front-end programmability, and LCD drive in one die - reducing component count and PCB area for human-interface-centric BLE endpoints.
Availability
CY8C4248FNI-BL483T is available at Aetrix Electronics and suitable for wireless remote controls, BLE sensor nodes, smart home keypads, and wearable health bands requiring stable component supply, long-term lifecycle assurance, and qualified automotive/industrial-grade sourcing.
Supply support for CY8C4248FNI-BL483T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and microcontroller solutions for automotive, industrial, and IoT markets.
CY8C42xx-BL belongs to the PSoC™ 4 family - designed specifically to unify programmable analog/digital logic, BLE connectivity, and low-power operation for intelligent edge devices in resource-constrained wireless applications.
FAQ
Does CY8C4248FNI-BL483T support Bluetooth® LE 5.0?
No. This device implements Bluetooth® LE 4.2 as specified in its BLESS subsystem. It does not support LE 5.0 features such as Long Range (Coded PHY), higher throughput (2 Mbps PHY), or enhanced privacy. Firmware updates cannot extend PHY capability beyond hardware design.
What is the maximum operating temperature for continuous BLE transmission?
The device is rated for industrial temperature range (–40 °C to +85 °C). At +85 °C ambient, sustained TX operation at +3 dBm requires thermal derating per datasheet Section 3 - junction temperature must remain below 125 °C, achievable with proper PCB copper pour under the exposed pad.
Can the on-chip opamps drive a 100 Ω load directly?
No. Each opamp supports up to 25 mA output current with rail-to-rail swing, but driving 100 Ω continuously exceeds thermal limits and violates recommended load conditions in the TRM. For such loads, use external buffer stages or configure opamp in unity-gain follower with appropriate external compensation.
Is the 56-pin QFN package lead-free and RoHS-compliant?
Yes. The CY8C4248FNI-BL483T uses a lead-free, halogen-free, RoHS-compliant 7 mm × 7 mm QFN package with NiPdAu terminal finish, meeting JEDEC J-STD-020D moisture sensitivity level 3 requirements for standard SMT assembly.
CY8C4248FNI-BL483T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 76-UFBGA, WLCSP
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR; D/A 2xIDAC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4248FNI-BL483T FAQ
1.How can I place an order for CY8C4248FNI-BL483T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4248FNI-BL483T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4248FNI-BL483T reliable?
The price and inventory of CY8C4248FNI-BL483T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248FNI-BL483T is usually 5 days.
3.What payment methods are accepted for CY8C4248FNI-BL483T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248FNI-BL483T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4248FNI-BL483T?
CY8C4248FNI-BL483T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4248FNI-BL483T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4248FNI-BL483T?
For technical support, including CY8C4248FNI-BL483T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248FNI-BL483T requirements.
6.How does Aetrix verify that CY8C4248FNI-BL483T is sourced from the original manufacturer or authorized distributors?
All CY8C4248FNI-BL483T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248FNI-BL483T meets industry standards.
7.What is the process for return or replacement of CY8C4248FNI-BL483T?
All CY8C4248FNI-BL483T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248FNI-BL483T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4248FNI-BL483T part is unused and in its original packaging.
Return procedure for CY8C4248FNI-BL483T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4248FNI-BL483T Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

