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Infineon Technologies CY8C4248FNI-BL553T
- Part No.:
- CY8C4248FNI-BL553T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 76-UFBGA, WLCSP
- Datasheet:
-
CY8C4248FNI-BL553T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 76WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,842
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Product details
Overview
CY8C4248FNI-BL553T from Infineon is a PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU (48 MHz), 256 KB flash, 32 KB SRAM, and a fully embedded AIROC™ Bluetooth® LE 4.2 radio subsystem with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit 1-Msps SAR ADC, and up to 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package - deployed in wireless human interface devices and BLE-enabled sensor nodes.
For engineers reviewing the CY8C4248FNI-BL553T datasheet, CY8C4248FNI-BL553T pinout, CY8C4248FNI-BL553T application, or CY8C4248FNI-BL553T equivalent, key selection criteria include integrated BLE PHY compliance, Deep Sleep current (1.5 µA), programmable analog/digital UDB resources, and CAPSENSE™ SNR (>5:1) for robust touch in moisture-prone environments.
Technical Context
The device implements a dual-domain architecture: the Arm® Cortex®-M0 core manages firmware execution and peripheral orchestration, while the BLESS (Bluetooth® Low Energy Subsystem) handles link-layer operations independently via dedicated hardware engines - enabling concurrent BLE advertising/scanning and application processing. Its programmable analog blocks (opamps, comparators, IDACs) and digital UDBs support real-time signal conditioning and state-machine logic without CPU intervention.
RF performance is anchored by a 2.4-GHz transceiver with 50-Ω antenna drive capability, RSSI resolution of 1 dB, and configurable TX power (–18 to +3 dBm). Power management includes Hibernate mode (150 nA with RAM retention) and Stop mode (60 nA), validated for battery-powered wearable applications requiring multi-year operation on coin cells.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0 @ 48 MHz with single-cycle multiply and DMA - enables deterministic real-time control and efficient firmware execution. |
| Memory | 256 KB flash (with read accelerator) and 32 KB SRAM - supports complex BLE stack + application firmware with over-the-air updates. |
| BLE Compliance | Bluetooth® LE 4.2 certified radio subsystem (BLESS) - provides interoperability with smartphones, gateways, and BLE peripherals. |
| ADC | 12-bit SAR ADC, 1-Msps sampling rate with differential input and channel sequencer - suitable for high-fidelity sensor data acquisition. |
| Power Modes | Deep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA (RAM retained); Stop: 60 nA - extends battery life in intermittent-sensing applications. |
| CAPSENSE™ | Capacitive sigma-delta (CSD) with >5:1 SNR and SmartSense auto-tuning - delivers reliable touch detection under water or condensation. |
| GPIO Count | Up to 36 programmable I/Os, including two overvoltage-tolerant (OVT) pins - supports mixed-signal interfacing and direct connection to industrial sensors. |
Pinout & Package
Package: 7 mm × 7 mm, 56-pin QFN (exposed thermal pad), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 1.71–5.5 V input; powers digital logic, analog blocks, and BLE RF section. |
| GND | Ground reference | Dedicated analog/digital ground pins minimize noise coupling in mixed-signal operation. |
| P0[0]–P0[7] | Programmable GPIO | Support CAPSENSE™, LCD segment/common, analog input, or UART/SPI/I²C - reconfigurable per firmware. |
| P1[0]–P1[7] | Programmable GPIO | Include two OVT-capable pins (P1[0], P1[1]) for direct 5.5 V-tolerant sensor interfacing. |
| XTAL_IN / XTAL_OUT | BLE RF crystal interface | Connects to 24 MHz crystal for BLESS timing; requires external load capacitors per layout guidelines. |
| WCO_IN / WCO_OUT | Watch crystal oscillator | 32.768 kHz crystal input for low-power RTC and Deep Sleep timing accuracy. |
| SWDCLK / SWDIO | Debug interface | Two-pin Serial Wire Debug (SWD) for programming and real-time firmware debugging. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE Radio Subsystem (BLESS) | Dedicated hardware link-layer engine supporting master/slave roles - offloads BLE protocol handling from CPU, reducing latency and power. |
| Programmable Analog Blocks | Four opamps with Comparator mode and ADC input buffering - enable sensor signal conditioning and threshold detection in Deep Sleep. |
| Universal Digital Blocks (UDBs) | Four UDBs, each with eight macrocells and datapath - implement custom logic (e.g., PWM generators, encoders) without consuming CPU cycles. |
| CAPSENSE™ CSD Engine | Sigma-delta modulation with hardware-accelerated SmartSense tuning - eliminates manual calibration for production touch panels. |
| Flexible SCBs | Two serial communication blocks supporting runtime-reconfigurable I²C/SPI/UART - simplifies interface adaptation across sensor, display, and host connectivity. |
Applications
| Wireless Wearable Sensor Node | Smart Home Touch Control Panel |
|---|---|
Use Scenario: Compact BLE-enabled wristband measuring heart rate and motion using analog front-end and capacitive buttons. IC Role / Device Role / Timing Role: Single-chip controller managing sensor acquisition, CAPSENSE™ UI, BLE advertising, and ultra-low-power scheduling. Use Value: 1.5 µA Deep Sleep current and hardware-accelerated CSD enable >12-month coin-cell operation with daily sync. | Use Scenario: Wall-mounted thermostat with glass-touch interface, ambient temperature/humidity sensing, and smartphone pairing. IC Role / Device Role / Timing Role: Main MCU executing control algorithm, driving LCD segments, and maintaining persistent BLE connection for remote configuration. Use Value: Integrated opamps condition thermistor signals; 36 GPIOs route to all touch zones and sensor inputs without external components. |
| Industrial BLE Gateway Endpoint | Portable Medical Diagnostic Device |
Use Scenario: Battery-powered field sensor aggregator collecting Modbus RTU data from legacy equipment and relaying via BLE to edge gateway. IC Role / Device Role / Timing Role: Protocol translator and BLE bridge with isolated UART interface and adaptive TX power control. Use Value: Programmable UDBs implement Modbus CRC and framing logic; +3 dBm TX output ensures reliable 10-m indoor range despite metal enclosure. | Use Scenario: Handheld pulse oximeter with optical analog front-end, OLED display, and BLE health-data streaming to iOS/Android apps. IC Role / Device Role / Timing Role: Signal processor (ADC oversampling), display driver (LCD segment), and BLE GATT server for FDA-compliant data export. Use Value: 12-bit 1-Msps SAR ADC captures photodiode waveforms at clinical-grade resolution; hardware RSSI monitoring validates connection integrity during measurement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | ARM Cortex-M4F core, 1 MB flash, no integrated analog peripherals (requires external ADC/opamp), higher TX power (+8 dBm). | Better for compute-intensive BLE mesh or audio streaming; lacks native CAPSENSE™ or programmable analog blocks. | Select when floating-point math or larger code footprint is required, and analog integration is handled externally. |
| Texas Instruments CC2642R1F | ARM Cortex-M4F + dedicated sensor controller, 352 KB flash, lower Deep Sleep current (0.9 µA), no programmable digital logic (UDBs). | Optimized for long-life sensor endpoints; lacks reconfigurable digital fabric and LCD drive capability. | Prefer for ultra-low-power periodic sensing where fixed-function peripherals suffice and no custom logic is needed. |
Compared with nRF52840-QIAA and CC2642R1F, CY8C4248FNI-BL553T uniquely combines BLE 4.2, programmable analog/digital fabric, and CAPSENSE™ in one die - reducing BOM count and enabling field-tunable behavior without hardware revision.
Availability
CY8C4248FNI-BL553T is available at Aetrix Electronics and suitable for wireless medical devices, smart home controllers, industrial sensor nodes, and portable BLE peripherals requiring stable component supply and long-term lifecycle assurance.
Supply support for CY8C4248FNI-BL553T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
CY8C42xx-BL belongs to the PSoC™ 4 family designed for highly integrated, low-power embedded systems requiring both wireless connectivity and configurable analog/digital logic - targeting human interface, sensing, and edge-node applications.
FAQ
Does CY8C4248FNI-BL553T require an external crystal for BLE operation?
Yes - it requires a 24 MHz crystal connected to XTAL_IN/XTAL_OUT pins for BLESS RF timing. The device also supports a 32.768 kHz watch crystal (WCO) for low-power RTC and Deep Sleep timing, but BLE radio operation is not functional without the 24 MHz source.
Can the onboard opamps operate during Deep Sleep mode?
Yes - all four opamps can remain active in Deep Sleep mode when configured for comparator operation or ADC input buffering. This allows continuous analog monitoring (e.g., voltage threshold detection) while consuming only 1.5 µA total system current.
What development tools are officially supported for firmware and hardware design?
Infineon's PSoC™ Creator IDE (Windows-only) is the primary tool, offering schematic-based hardware configuration, API-driven firmware generation, and automatic routing. ARM GCC and Keil MDK are supported for advanced C/C++ development after initial hardware definition.
Is the 56-pin QFN package lead-free and RoHS-compliant?
Yes - the CY8C4248FNI-BL553T uses a lead-free, RoHS-compliant 7 mm × 7 mm QFN package with exposed thermal pad. Moisture sensitivity level is MSL3, requiring bake-before-reflow if stored beyond floor life per J-STD-020.
CY8C4248FNI-BL553T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 76-UFBGA, WLCSP
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 1x7b, 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4248FNI-BL553T FAQ
1.How can I place an order for CY8C4248FNI-BL553T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4248FNI-BL553T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4248FNI-BL553T reliable?
The price and inventory of CY8C4248FNI-BL553T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248FNI-BL553T is usually 5 days.
3.What payment methods are accepted for CY8C4248FNI-BL553T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248FNI-BL553T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4248FNI-BL553T?
CY8C4248FNI-BL553T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4248FNI-BL553T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4248FNI-BL553T?
For technical support, including CY8C4248FNI-BL553T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248FNI-BL553T requirements.
6.How does Aetrix verify that CY8C4248FNI-BL553T is sourced from the original manufacturer or authorized distributors?
All CY8C4248FNI-BL553T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248FNI-BL553T meets industry standards.
7.What is the process for return or replacement of CY8C4248FNI-BL553T?
All CY8C4248FNI-BL553T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248FNI-BL553T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4248FNI-BL553T part is unused and in its original packaging.
Return procedure for CY8C4248FNI-BL553T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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