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Infineon Technologies CY8C4248LQI-BL473

Part No.:
CY8C4248LQI-BL473
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4248LQI-BL473.pdf
Description:
IC MCU 32BIT 256KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,966

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Product details

Overview

CY8C4248LQI-BL473 from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® LE 4.2 radio, 48 MHz CPU, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It delivers BLE connectivity, capacitive sensing (CSD), LCD drive, and TCPWM for embedded wireless sensor nodes and smart peripherals.

For engineers reviewing the CY8C4248LQI-BL473 datasheet, CY8C4248LQI-BL473 pinout, CY8C4248LQI-BL473 application, or CY8C4248LQI-BL473 equivalent, key selection criteria include integrated BLE subsystem performance (–89 dBm RX sensitivity, +3 dBm TX power), low-power Deep Sleep (1.5 µA), and reconfigurable UDB-based digital logic for field-tunable firmware-defined peripherals.

Technical Context

This MCU implements a dual-domain architecture: an Arm® Cortex®-M0 core with DMA and flash accelerator coexists with a dedicated Bluetooth® LE subsystem (BLESS) containing digital PHY, link-layer engine, and RF transceiver. The BLESS operates independently of the CPU, enabling concurrent BLE advertising/scanning while the CPU executes application code in Deep Sleep.

Analog resources include four opamps supporting comparator mode and ADC input buffering, a 12-bit 1-Msps SAR ADC with channel sequencer and averaging, and two IDACs for CAPSENSE™. Digital flexibility stems from four Universal Digital Blocks (UDBs), each with eight macrocells and data path, enabling custom state machines or peripheral emulation without FPGA-level complexity.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 48 MHz with single-cycle multiply - enables real-time control loops and BLE stack execution within tight timing budgets
Memory256 KB flash (with read accelerator), 32 KB SRAM - supports complex BLE applications with OTA firmware updates and multi-sensor data buffering
BLE Performance–89 dBm RX sensitivity, –18 to +3 dBm TX output - ensures robust 10–30 m range in noisy 2.4 GHz environments with minimal external RF components
Power Consumption1.5 µA Deep Sleep (WCO active), 60 nA Stop mode - extends battery life to years in coin-cell-powered IoT endpoints
Analog Capability12-bit 1-Msps SAR ADC with differential mode and hardware averaging - delivers high-fidelity sensor acquisition with noise rejection for industrial or medical inputs
Digital Flexibility4 UDBs, each with 8 macrocells + data path - allows implementation of custom protocols (e.g., proprietary UART variants) or motor control PWM logic without fixed-function peripheral constraints
GPIO CountUp to 36 programmable pins, including 2 OVT - supports mixed-signal I/O routing for CAPSENSE™, LCD segments, analog inputs, and digital interfaces on shared pins

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style leadless, exposed thermal pad).

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.71–5.5 V operation; powers digital logic, analog blocks, and BLE subsystem - supports direct connection to single-cell Li-ion or coin-cell batteries via LDO
VSSGround referenceDedicated analog/digital ground pins minimize coupling noise between BLE RF and sensitive analog circuits
P0[0]–P0[7]Programmable GPIOSupport CAPSENSE™, LCD segment/common, analog input, or digital interface - configurable slew rate and drive strength per pin
P1[0]–P1[7]Programmable GPIOInclude two overvoltage-tolerant (OVT) pins - tolerate up to 5.5 V regardless of VDD, enabling direct interfacing with legacy 5 V systems
XTAL_IN / XTAL_OUTExternal crystal oscillatorDrive 24 MHz ECO for precise BLE timing and system clock stability - required for BLE compliance and low-jitter PWM generation
WCO_IN / WCO_OUTWatch crystal oscillatorConnect 32.768 kHz crystal for Deep Sleep timing - enables wake-up events every 10 ms to 1 s without CPU intervention
ANTRF antenna interface50 Ω matched RF output - connects directly to PCB trace antenna or matching network; no external balun needed for basic layouts

Key Features

FeatureDesign Value
Integrated BLE Subsystem (BLESS)Dedicated hardware link-layer engine supports simultaneous master/slave roles and handles BLE protocol overhead - frees >30% CPU bandwidth vs. software BLE stacks
Capacitive Sensing (CSD)Hardware-accelerated sigma-delta sensing with >5:1 SNR and liquid tolerance - enables reliable touch buttons/knobs in wet or condensing environments without firmware compensation
SmartSense Auto-TuningFirmware-transparent hardware algorithm adjusts sensor parameters in real time - eliminates manual calibration during production and compensates for environmental drift
Reconfigurable UDBsFour independent logic blocks with macrocell+data path architecture - implement custom serial protocols, encoder interfaces, or safety-monitored PWM generators without external ICs
Low-Power AnalogOpamps and comparators functional in Deep Sleep mode - allows continuous sensor monitoring (e.g., door-open detection) at sub-µA current draw

Applications

Wireless Sensor NodeSmart Home Remote

Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 2 seconds to a gateway via BLE.

IC Role / Device Role / Timing Role: MCU + BLE transceiver + SAR ADC + CAPSENSE™ button - performs sensor acquisition, local processing, BLE advertising, and user interaction.

Use Value: 1.5 µA Deep Sleep + SmartSense reduces average current to <10 µA, enabling 5-year operation on CR2032.

Use Scenario: IR-to-BLE universal remote controlling TVs, AC units, and lights via smartphone app.

IC Role / Device Role / Timing Role: BLE host controller + IR emitter driver + LCD segment driver + GPIO matrix scanner - manages protocol translation, display, and button input.

Use Value: Integrated LCD drive (Deep Sleep capable) and 36 GPIOs eliminate external display driver and I/O expander, reducing BOM count by 3 parts.

Industrial Control PanelWearable Health Monitor

Use Scenario: Panel-mounted HMI with touch sliders, status LEDs, and BLE diagnostics port.

IC Role / Device Role / Timing Role: CAPSENSE™ controller + TCPWM LED dimmer + SCB UART bridge - handles human interface, visual feedback, and service communication.

Use Value: Hardware TCPWM with comparator-triggered kill signals ensures safe LED current limiting and prevents thermal runaway during fault conditions.

Use Scenario: Chest strap measuring heart rate via photoplethysmography (PPG) and streaming raw data to phone.

IC Role / Device Role / Timing Role: Analog front-end (opamp + ADC) + BLE transmitter + CAPSENSE™ strap contact detection - acquires biometric signal, validates wear, and transmits securely.

Use Value: Opamp buffer + 12-bit ADC with hardware averaging achieves <10 µV RMS noise floor, meeting clinical-grade PPG SNR requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, no integrated analog peripherals (ADC/opamp) - requires external signal conditioning for sensor interfacesBetter suited for compute-intensive BLE mesh or audio streaming; lacks native CAPSENSE™ or LCD driveSelect when floating-point math or Bluetooth mesh support is required, and analog integration is handled externally
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, integrated 12-bit ADC (200 kSPS), but no programmable analog blocks or UDBsStrong RF performance (–101 dBm RX), optimized for long-range BLE beacons; limited digital reconfigurabilitySelect for ultra-low-power beaconing or where TI's BLE stack maturity outweighs need for field-programmable logic

Compared with nRF52833 and CC2642R, CY8C4248LQI-BL473 uniquely combines BLE radio, reconfigurable analog/digital fabric, and capacitive sensing in one die - reducing system-level component count and enabling hardware-level customization of sensor interface and control logic without additional ICs.

Availability

CY8C4248LQI-BL473 is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home remotes, industrial HMIs, and wearable health monitors requiring stable component supply across multi-year production cycles.

Supply support for CY8C4248LQI-BL473 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.

CY8C4248LQI-BL473 belongs to the PSoC™ 4 CY8C4xxx-BL family, designed specifically for cost-sensitive, battery-powered IoT endpoints requiring integrated BLE, programmable analog front-ends, and field-upgradable hardware functionality.

FAQ

Does CY8C4248LQI-BL473 support Bluetooth® LE 5.0?

No. This device implements Bluetooth® LE 4.2 only, as confirmed in the official Infineon datasheet (Rev. *B, Section 1.3). It does not support LE 5.0 features such as Long Range (Coded PHY), higher throughput (2 Mbps PHY), or enhanced privacy. Firmware updates cannot add these capabilities due to hardware limitations in the BLESS subsystem.

Can the internal opamps drive a 100 kΩ load at 1 MHz?

Yes - the opamps support high-bandwidth internal drive mode with >10 MHz gain-bandwidth product and 50 mA short-circuit current. Driving a 100 kΩ resistive load at 1 MHz is within specification, provided layout minimizes parasitic capacitance and supply decoupling meets datasheet recommendations (e.g., 100 nF + 10 µF per VDD pin).

Is the 56-pin QFN package RoHS-compliant and halogen-free?

Yes. Infineon certifies CY8C4248LQI-BL473 as RoHS-compliant (2011/65/EU) and halogen-free per IEC 61249-2-21. The package uses matte tin lead finish and green molding compound, with full material declarations available in Infineon's Eco Reports portal under document number 002-23053.

What development tools are required to program this MCU?

Programming requires Infineon's ModusToolbox™ IDE (free download) and a compatible debugger: MiniProg3, KitProg3, or any CMSIS-DAP-compliant probe. The device supports SWD interface; no external programmer is needed for kits like CY8CKIT-042-BLE-A, which integrate KitProg3 onboard.

CY8C4248LQI-BL473 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248LQI-BL473 FAQ

1.How can I place an order for CY8C4248LQI-BL473 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL473 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248LQI-BL473 reliable?

The price and inventory of CY8C4248LQI-BL473 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL473 is usually 5 days.

3.What payment methods are accepted for CY8C4248LQI-BL473?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL473 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4248LQI-BL473?

CY8C4248LQI-BL473 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4248LQI-BL473 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248LQI-BL473?

For technical support, including CY8C4248LQI-BL473 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL473 requirements.

6.How does Aetrix verify that CY8C4248LQI-BL473 is sourced from the original manufacturer or authorized distributors?

All CY8C4248LQI-BL473 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL473 meets industry standards.

7.What is the process for return or replacement of CY8C4248LQI-BL473?

All CY8C4248LQI-BL473 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL473, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248LQI-BL473 part is unused and in its original packaging.

Return procedure for CY8C4248LQI-BL473:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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