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Infineon Technologies CY8C4248LQI-BL483T

Part No.:
CY8C4248LQI-BL483T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4248LQI-BL483T.pdf
Description:
IC MCU 32BIT 256KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,976

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Product details

Overview

CY8C4248LQI-BL483T from Infineon is a 32-bit PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU (48 MHz), 256 KB flash, 32 KB SRAM, and a fully embedded AIROC™ Bluetooth® LE 4.2 radio subsystem with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit 1-Msps SAR ADC, and up to 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package - deployed in wireless human interface devices and BLE-enabled sensor nodes.

For engineers reviewing the CY8C4248LQI-BL483T datasheet, CY8C4248LQI-BL483T pinout, CY8C4248LQI-BL483T application, or CY8C4248LQI-BL483T equivalent, key selection criteria include integrated BLE PHY/link-layer coexistence with programmable analog/digital blocks, Deep Sleep current (1.5 µA), and hardware-accelerated CAPSENSE™ with SmartSense tuning.

Technical Context

This device implements a tightly coupled dual-subsystem architecture: the Arm® Cortex®-M0 core executes firmware while the dedicated BLESS (Bluetooth® Low Energy SubSystem) handles RF baseband, link-layer state machine, and packet encryption/decryption independently. The BLESS includes a 2.4-GHz transceiver with 50-Ω antenna drive and digital PHY supporting both master and slave roles.

Analog resources include four opamps with Comparator mode and ADC input buffering, plus a 12-bit SAR ADC with channel sequencer and signal averaging. Digital flexibility comes from four UDBs (Universal Digital Blocks), each with eight macrocells and data path, enabling custom logic and state machines without external glue logic.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0 @ 48 MHz with single-cycle multiply and DMA - enables real-time sensor fusion and BLE stack execution within tight timing budgets.
Memory256 KB flash (with read accelerator) + 32 KB SRAM - sufficient for BLE host stack, application firmware, and OTA update staging.
BLE PerformanceRX sensitivity –89 dBm; TX output –18 to +3 dBm - supports robust 10–30 m indoor range with standard PCB antenna.
ADC12-bit SAR, 1-Msps, differential/single-ended, with channel sequencer and averaging - suitable for multi-channel battery voltage, temperature, and analog sensor acquisition.
Power ModesDeep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA (RAM retention); Stop: 60 nA - enables multi-year operation on coin-cell batteries.
CAPSENSE™Capacitive sigma-delta (CSD) with >5:1 SNR and liquid-tolerant operation - delivers reliable touch button/slider performance under moisture or glove use.
GPIOUp to 36 programmable pins; any pin supports CAPSENSE™, LCD, analog, or digital functions; two OVT pins - simplifies board layout and reduces external ESD protection components.

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style exposed pad, RoHS-compliant, moisture sensitivity level 3).

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.71–5.5 V input; powers digital logic, analog blocks, and BLE radio; requires local 100-nF decoupling.
VSSDigital/analog groundCommon reference for all domains; must be low-impedance connection to thermal pad.
P0[0]–P0[7]Programmable GPIOSupport CAPSENSE™, analog input, SCB (I²C/SPI/UART), TCPWM, or LCD segment - configurable per pin in firmware.
P1[0]–P1[7]Programmable GPIOSame functionality as P0; includes two overvoltage-tolerant (OVT) pins for direct 5.5-V tolerant interface.
XTAL_IN / XTAL_OUTBLE RF crystal oscillatorDrives 24 MHz fundamental-mode crystal for BLESS timing; requires matched load capacitance per AN95089.
WCO_IN / WCO_OUTWatch crystal oscillatorConnects 32.768 kHz crystal for Deep Sleep timing and RTC; operates during ultra-low-power modes.
SWD_CLK / SWD_IODebug interfaceTwo-pin Serial Wire Debug port for programming and real-time debugging via MiniProg3 or KitProg2.

Key Features

FeatureDesign Value
Integrated BLE Subsystem (BLESS)Dedicated hardware link-layer engine offloads CPU, enabling concurrent application and BLE processing without RTOS overhead.
Hardware CAPSENSE™ CSDOn-die sigma-delta modulator with automatic SmartSense tuning eliminates manual calibration and improves production yield.
Programmable Analog BlocksFour opamps support simultaneous ADC buffering, comparator latching, and active filtering - no external opamp required for sensor front-end.
UDB-Based Digital LogicFour Universal Digital Blocks enable custom PWM generators, encoders, or protocol engines - avoids FPGA or discrete logic ICs.
Low-Power FlexibilityMultiple retention modes (Hibernate/Stop) with selective peripheral wake-up - extends battery life in intermittent-sensing applications.

Applications

Smart Wearable Sensor HubBLE Remote Control

Use Scenario: Compact wrist-worn device aggregating accelerometer, temperature, and heart-rate data, transmitting securely to smartphone.

IC Role / Device Role / Timing Role: Central MCU + BLE radio + analog sensor interface + CAPSENSE™ for touch controls.

Use Value: Single-chip integration reduces BOM count by ≥7 components; Deep Sleep current (1.5 µA) enables 6+ month battery life on CR2032.

Use Scenario: Battery-powered TV remote with touchpad, button matrix, and proximity wake-up.

IC Role / Device Role / Timing Role: System controller with CAPSENSE™ touchpad, BLE advertising beacon, and low-power wake-on-touch.

Use Value: Hardware SmartSense tuning ensures consistent touch response across production units; OVT pins simplify IR LED driver interface.

Industrial Wireless NodeSmart Home Thermostat

Use Scenario: DIN-rail mounted environmental monitor measuring humidity, CO₂, and ambient light, reporting via BLE mesh gateway.

IC Role / Device Role / Timing Role: Sensor fusion processor with 12-bit ADC sequencing, BLE advertisement/data transmission, and watchdog supervision.

Use Value: Channel sequencer + signal averaging enables accurate multi-sensor sampling at <10 µA average current per measurement cycle.

Use Scenario: Wall-mounted thermostat with capacitive touch buttons, LCD display, and BLE connectivity for HVAC control.

IC Role / Device Role / Timing Role: MCU + LCD segment driver + CAPSENSE™ + BLE - all in one die with Deep Sleep LCD operation.

Use Value: LCD drive on all GPIOs allows flexible segment/common assignment; 4-bit memory per pin retains display content during 1.5 µA Deep Sleep.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, 128 KB RAM; higher compute headroom but no integrated CAPSENSE™ or programmable analog.Requires external touch controller and signal conditioning for analog sensors - increases BOM and layout complexity.Preferred when floating-point math or advanced audio processing is needed; less optimal for cost-sensitive touch+sensor+BLE integration.
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, 80 KB RAM; integrated RF but fixed-function analog (no opamp reconfiguration or UDBs).Lacks hardware CAPSENSE™ and programmable digital logic - mandates external components for complex HMI or custom timing logic.Better suited for pure BLE data concentrators; inferior for mixed-signal, field-reconfigurable designs requiring analog/digital co-design.

Compared with nRF52833 and CC2642R, CY8C4248LQI-BL483T uniquely combines BLE radio, programmable analog (opamps, ADC, IDAC), and digital logic (UDBs) in one die - reducing component count and enabling in-field tuning of sensor interfaces and timing behavior without firmware changes.

Availability

CY8C4248LQI-BL483T is available at Aetrix Electronics and suitable for smart wearables, industrial wireless nodes, BLE remote controls, and smart home thermostats requiring stable component supply and long-term lifecycle support.

Supply support for CY8C4248LQI-BL483T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and R&D infrastructure.

CY8C4248LQI-BL483T belongs to the PSoC™ 4 CY8C4xxx-BL family - designed specifically for ultra-low-power, mixed-signal IoT edge devices requiring integrated BLE, capacitive sensing, and field-reconfigurable analog/digital peripherals.

FAQ

What development tools are supported for CY8C4248LQI-BL483T?

PSoC™ Creator IDE (free Windows-based tool) provides schematic-driven design, pre-verified components, and automatic routing for analog/digital blocks. It supports code generation for Arm® Cortex®-M0 and integrates with industry-standard Arm® GCC and Keil MDK. Debugging uses SWD via MiniProg3 or KitProg2 programmers.

Does CY8C4248LQI-BL483T require external crystals for BLE operation?

Yes - a 24 MHz fundamental-mode crystal is mandatory for the BLESS RF subsystem (XTAL_IN/XTAL_OUT pins), and a 32.768 kHz watch crystal (WCO_IN/WCO_OUT) is required for Deep Sleep timing and RTC. Layout must follow AN95089 guidelines for matching network and grounding.

Can all 36 GPIOs be used simultaneously for CAPSENSE™ and analog functions?

No - while any GPIO can be assigned to CAPSENSE™ or analog input, shared analog routing resources (e.g., SAR ADC input mux, opamp outputs) limit concurrent high-speed analog acquisition and full-capacitance scanning. Up to 20 electrodes can be scanned at >100 Hz with SmartSense enabled.

Is the BLE stack included in the device firmware or loaded externally?

The BLE link-layer and PHY are implemented in dedicated BLESS hardware; the host stack (e.g., BLE profiles, GATT server) resides in flash and is provided as part of Infineon's PSoC™ Component Library. No external BLE stack license or external memory is required - full BLE 4.2 functionality is self-contained.

CY8C4248LQI-BL483T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248LQI-BL483T FAQ

1.How can I place an order for CY8C4248LQI-BL483T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL483T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248LQI-BL483T reliable?

The price and inventory of CY8C4248LQI-BL483T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL483T is usually 5 days.

3.What payment methods are accepted for CY8C4248LQI-BL483T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL483T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4248LQI-BL483T?

CY8C4248LQI-BL483T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4248LQI-BL483T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248LQI-BL483T?

For technical support, including CY8C4248LQI-BL483T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL483T requirements.

6.How does Aetrix verify that CY8C4248LQI-BL483T is sourced from the original manufacturer or authorized distributors?

All CY8C4248LQI-BL483T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL483T meets industry standards.

7.What is the process for return or replacement of CY8C4248LQI-BL483T?

All CY8C4248LQI-BL483T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL483T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248LQI-BL483T part is unused and in its original packaging.

Return procedure for CY8C4248LQI-BL483T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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