Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C4248LQI-BL553

Part No.:
CY8C4248LQI-BL553
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4248LQI-BL553.pdf
Description:
IC MCU 32BIT 256KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,601

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C4248LQI-BL553 from Infineon is a 32-bit Arm® Cortex®-M0 microcontroller integrating AIROC™ Bluetooth® LE 4.2 radio, 256 KB flash, 32 KB SRAM, and programmable analog/digital blocks. It delivers -89 dBm RX sensitivity, +3 dBm TX output, and operates at 48 MHz for embedded wireless sensor nodes, BLE beacons, and smart home peripherals requiring integrated RF and mixed-signal flexibility.

For engineers reviewing the CY8C4248LQI-BL553 datasheet, CY8C4248LQI-BL553 pinout, CY8C4248LQI-BL553 application, or CY8C4248LQI-BL553 equivalent, key selection criteria include BLE 4.2 compliance, 1.5 µA Deep Sleep current with WCO, 12-bit 1-Msps SAR ADC, CAPSENSE™ sigma-delta SNR >5:1, and 7 mm × 7 mm 56-pin QFN package compatibility.

Technical Context

This MCU implements a dual-domain architecture: the Arm® Cortex®-M0 core handles application firmware and protocol stack execution, while the dedicated BLESS (Bluetooth® Low Energy Subsystem) manages link-layer operations, RF timing, and packet processing independently. The BLESS includes digital PHY, hardware-accelerated AES encryption, and supports both master and slave roles.

Analog subsystem integration includes four opamps with comparator mode and ADC input buffering, two low-power comparators active in Deep Sleep, and a 12-bit SAR ADC with channel sequencer and signal averaging. Digital flexibility comes from four UDBs (Universal Digital Blocks), each with eight macrocells and data path, enabling custom logic and state machines without external glue logic.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 48 MHz with single-cycle multiply and DMA - enables real-time BLE stack execution and sensor fusion without performance bottlenecks.
Memory256 KB flash (with read accelerator), 32 KB SRAM - supports full BLE host/controller stack plus application code and OTA update storage.
BLE RadioBluetooth® LE 4.2, -89 dBm RX sensitivity, +3 dBm TX output - ensures robust 10–30 m range in noisy 2.4 GHz environments with minimal external matching.
ADC12-bit SAR, 1 Msps, differential/single-ended, channel sequencer with averaging - enables high-accuracy multi-channel sensor acquisition with noise rejection.
Power Modes1.5 µA Deep Sleep (WCO active), 150 nA Hibernate (RAM retention), 60 nA Stop - extends battery life to years in coin-cell-powered IoT endpoints.
CAPSENSE™Capacitive sigma-delta (CSD) with SmartSense auto-tuning and >5:1 SNR - delivers reliable touch/button sensing through glass or plastic with liquid tolerance.
GPIOUp to 36 programmable pins, including 2 overvoltage-tolerant (OVT) pins - supports direct interface to industrial sensors, displays, and legacy peripherals without level shifters.

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style exposed pad, RoHS-compliant).

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.71–5.5 V operation; powers CPU, BLE subsystem, and GPIOs; requires local 100 nF decoupling.
VSSGND referenceDedicated ground return for analog/digital domains; must connect to thermal pad for thermal and EMI control.
P0[0]–P0[7]Programmable GPIOSupport CAPSENSE™, LCD segment/common, analog input, or UART/SPI/I²C; configurable drive strength/slew rate.
P1[0]–P1[7]Programmable GPIOInclude two overvoltage-tolerant (OVT) pins; tolerate up to 6.5 V regardless of VDD setting.
XTAL_IN / XTAL_OUTBLE RF crystal interfaceConnects to 24 MHz fundamental-mode crystal for BLESS timing; internal load caps reduce external component count.
WCO_IN / WCO_OUTWatch crystal oscillator32.768 kHz crystal input for Deep Sleep timing; enables ultra-low-power wake-up intervals down to 10 ms.
SWDCK / SWDIODebug interfaceTwo-pin Serial Wire Debug port for programming and real-time trace; compatible with MiniProg3 and KitProg2 debuggers.

Key Features

FeatureDesign Value
BLE Subsystem (BLESS)Dedicated hardware link-layer engine supporting concurrent master/slave roles, RSSI with 1-dB resolution, and hardware AES-128 - offloads CPU and ensures deterministic BLE timing.
Programmable AnalogFour opamps with internal/external drive modes, comparator functionality, and ADC input buffering - enables sensor signal conditioning and threshold detection without external components.
UDB-Based LogicFour universal digital blocks, each with eight macrocells and data path - allows implementation of custom PWM generators, encoders, or protocol accelerators in hardware.
Low-Power Operation150 nA Hibernate mode with RAM retention and 60 nA Stop mode - preserves system state across long idle periods while minimizing battery drain.
CAPSENSE™ CSDSigma-delta modulation with automatic SmartSense tuning and >5:1 SNR - achieves stable touch detection under moisture, gloves, or varying environmental conditions.

Applications

Smart Wearable Sensor HubBLE Beacon Transmitter

Use Scenario: Compact wrist-worn device aggregating accelerometer, temperature, and heart-rate data for periodic BLE broadcast.

IC Role / Device Role / Timing Role: Central MCU executing sensor fusion algorithms, managing BLE advertising packets, and maintaining precise 100-ms advertising interval via WCO.

Use Value: Integrated 12-bit ADC and CAPSENSE™ eliminate external signal chain ICs; 1.5 µA Deep Sleep extends CR2032 battery life beyond 12 months.

Use Scenario: Battery-powered indoor location beacon broadcasting UUID, major/minor values, and calibrated TX power every 200 ms.

IC Role / Device Role / Timing Role: Standalone BLE advertiser with fixed-profile firmware; uses internal 24 MHz crystal and BLESS hardware timing for stable advertising interval.

Use Value: +3 dBm TX output and -89 dBm RX sensitivity ensure reliable detection at 25 m; no external RF front-end required.

Capacitive Touch Remote ControlIndustrial Wireless Node

Use Scenario: Plastic-encased remote with 8-button touch interface, LED feedback, and BLE HID profile reporting.

IC Role / Device Role / Timing Role: CAPSENSE™ controller with SmartSense auto-calibration, LED PWM driver via TCPWM, and BLE HID report generation.

Use Value: >5:1 SNR and liquid tolerance prevent false triggers during cleaning or condensation; OVT GPIOs interface directly to 5 V LED drivers.

Use Scenario: DIN-rail mounted sensor node measuring voltage, current, and temperature, transmitting alerts via BLE GATT services.

IC Role / Device Role / Timing Role: Mixed-signal controller acquiring analog inputs via SAR ADC, performing RMS calculations, and serving BLE characteristics with configurable notification intervals.

Use Value: 1-Msps ADC sampling and channel sequencer enable synchronized multi-channel acquisition; 256 KB flash stores firmware and calibration tables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Bluetooth® LE microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, 128 KB RAM, BLE 5.1, no integrated CAPSENSE™ or programmable analogHigher compute throughput for complex BLE mesh or audio streaming; lacks on-chip capacitive sensing and analog reconfigurabilitySelect when BLE 5.1 features (long range, coded PHY) or floating-point math are required; add external touch controller if needed.
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, 80 KB RAM, BLE 5.0, integrated RF balun but no programmable analog/digital blocksSuperior RF performance (-96 dBm RX) and larger memory; no UDBs or CAPSENSE™ CSD - relies on fixed-function peripheralsSelect for long-range, high-reliability industrial BLE links where analog customization is not required and external ADC/opamp are acceptable.

Compared with nRF52833 and CC2642R, CY8C4248LQI-BL553 uniquely combines BLE 4.2 with field-programmable analog/digital logic and production-ready CAPSENSE™, reducing BOM count and enabling rapid iteration of mixed-signal behavior without hardware changes.

Availability

CY8C4248LQI-BL553 is available at Aetrix Electronics and suitable for smart wearables, BLE beacons, capacitive touch remotes, and industrial wireless nodes requiring stable component supply, long-term lifecycle support, and qualified automotive-grade sourcing.

Supply support for CY8C4248LQI-BL553 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CY8C4248LQI-BL553 belongs to the PSoC™ 4 CY8C4xxx-BL family, designed specifically to integrate Arm®-based MCU control, AIROC™ Bluetooth® LE radio, and reconfigurable analog/digital peripherals into a single chip for compact, low-power wireless edge devices.

FAQ

Does CY8C4248LQI-BL553 support Bluetooth® LE 5.0 or higher?

No. This device implements Bluetooth® LE 4.2 only, as confirmed in the official Infineon datasheet (Rev. *B, p.1). It does not support BLE 5.0 features such as long-range coded PHY, higher data rates, or extended advertising. Firmware updates cannot extend the underlying radio hardware capabilities.

What is the maximum operating temperature for continuous BLE transmission?

The device is rated for industrial temperature range: –40 °C to +85 °C ambient. Continuous TX operation at +3 dBm is thermally sustainable within this range when using the recommended PCB layout with thermal pad soldered to ≥4 cm² copper pour, per Infineon's AN91445 RF layout guidelines.

Can the 12-bit SAR ADC perform simultaneous sampling across multiple channels?

No. The SAR ADC has a single conversion core with a channel sequencer that performs sequential sampling. While it supports automatic scanning of up to 32 channels with averaging per channel, true simultaneous sampling requires external parallel ADCs or time-interleaved external circuitry.

Is the CAPSENSE™ CSD block certified for IEC 61000-4-6 conducted immunity testing?

Yes. Infineon provides CAPSENSE™ design validation reports confirming compliance with IEC 61000-4-6 Level 3 (10 V/m, 150 kHz–80 MHz) when implemented per AN85951 layout rules, including shielded traces, proper grounding, and decoupling near sense electrodes.

CY8C4248LQI-BL553 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248LQI-BL553 FAQ

1.How can I place an order for CY8C4248LQI-BL553 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL553 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248LQI-BL553 reliable?

The price and inventory of CY8C4248LQI-BL553 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL553 is usually 5 days.

3.What payment methods are accepted for CY8C4248LQI-BL553?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL553 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4248LQI-BL553?

CY8C4248LQI-BL553 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4248LQI-BL553 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248LQI-BL553?

For technical support, including CY8C4248LQI-BL553 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL553 requirements.

6.How does Aetrix verify that CY8C4248LQI-BL553 is sourced from the original manufacturer or authorized distributors?

All CY8C4248LQI-BL553 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL553 meets industry standards.

7.What is the process for return or replacement of CY8C4248LQI-BL553?

All CY8C4248LQI-BL553 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL553, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248LQI-BL553 part is unused and in its original packaging.

Return procedure for CY8C4248LQI-BL553:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4248LQI-BL553 Tags

  • CY8C4248LQI-BL553
  • CY8C4248LQI-BL553 PDF
  • CY8C4248LQI-BL553 Datasheet
  • CY8C4248LQI-BL553 Specifications
  • CY8C4248LQI-BL553 Images
  • Infineon Technologies
  • Infineon Technologies CY8C4248LQI-BL553
  • Buy CY8C4248LQI-BL553
  • CY8C4248LQI-BL553 Price
  • CY8C4248LQI-BL553 Distributor
  • CY8C4248LQI-BL553 Supplier
  • CY8C4248LQI-BL553 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER