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Infineon Technologies CY8C4248LQI-BL553T
- Part No.:
- CY8C4248LQI-BL553T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 56-UFQFN Exposed Pad
- Datasheet:
-
CY8C4248LQI-BL553T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,898
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Product details
Overview
CY8C4248LQI-BL553T from Infineon Technologies (acquired Cypress Semiconductor) is a programmable System-on-Chip integrating an Arm® Cortex®-M0 CPU, 256 KB flash, 32 KB SRAM, and a Bluetooth Low Energy 4.2 radio subsystem (BLESS) with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing, 12-bit 1-Msps SAR ADC, four opamps, two SCBs (reconfigurable I²C/SPI/UART), and 36 GPIOs in a 7 mm × 7 mm 56-pin QFN package - deployed in wireless human interface devices, BLE beacons, and smart sensor nodes.
For engineers reviewing the CY8C4248LQI-BL553T datasheet, CY8C4248LQI-BL553T pinout, CY8C4248LQI-BL553T application, or CY8C4248LQI-BL553T equivalent, key selection criteria include BLE 4.2 PHY compliance, Deep Sleep current of 1.5 µA with WCO active, programmable analog/digital UDB resources, and integrated CapSense™ with SmartSense™ auto-tuning - all verified in the official PSoC 4200_BLE Family Datasheet (002-23053 Rev. **).
Technical Context
The device implements a dual-domain clock architecture with IMO (internal main oscillator), ILO (low-speed oscillator), 24-MHz ECO, and 32-kHz WCO, enabling glitch-free switching between active, Deep Sleep, Hibernate (150 nA), and Stop (60 nA) modes. Its BLE subsystem integrates digital PHY, link-layer engine (master/slave), and RF transceiver with 50-Ω antenna drive capability.
Analog subsystem includes four reconfigurable opamps supporting comparator mode and ADC input buffering, plus a 12-bit SAR ADC with channel sequencer and signal averaging. Digital domain features four universal digital blocks (UDBs), each with eight macrocells and data path, and two run-time reconfigurable serial communication blocks (SCBs).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0, 48 MHz with single-cycle multiply and DMA - enables deterministic real-time control and Thumb-2 binary compatibility with higher Cortex-M families. |
| Memory | 256 KB flash (with Read Accelerator), 32 KB SRAM - supports complex BLE stack + application firmware with fast code execution and data retention in Hibernate mode. |
| BLE Performance | BLE 4.2 compliant; –89 dBm RX sensitivity, +3 dBm TX output - delivers robust 10–30 m range in typical indoor environments with low-power link budget. |
| Power Modes | Deep Sleep: 1.5 µA (WCO active); Hibernate: 150 nA (RAM retention); Stop: 60 nA - enables multi-year battery life in coin-cell-powered IoT endpoints. |
| Analog Peripherals | 12-bit 1-Msps SAR ADC (differential/single-ended), 4 opamps, 2 low-power comparators - supports precision sensor signal conditioning and wake-on-event in Deep Sleep. |
| Digital Flexibility | 4 UDBs (each with 8 macrocells + data path), 2 SCBs (I²C/SPI/UART reconfigurable at runtime), 36 GPIOs - allows hardware-level customization without external logic or FPGA. |
| Capacitive Sensing | Cypress CSD engine with >5:1 SNR, liquid tolerance, and SmartSense™ auto-tuning - eliminates manual calibration for touch buttons/sliders in consumer and industrial HMI. |
Pinout & Package
Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style leadless package with exposed thermal pad; RoHS-compliant, moisture sensitivity level 3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Primary power supply input | Accepts 1.9–5.5 V; powers digital core, BLE radio, and analog blocks - requires local 100-nF decoupling per VDD pin. |
| VSS | Ground reference | Dedicated ground pins for analog/digital domains; must be connected to low-impedance PCB ground plane to maintain ADC accuracy and RF stability. |
| P0[0]–P0[7], P1[0]–P1[7], P2[0]–P2[7], P3[0]–P3[7], P4[0]–P4[3] | Programmable GPIO | All 36 pins support CapSense, LCD segment/common, analog input/output, or digital I/O - configurable slew rate, drive strength, and overvoltage tolerance on two pins (P0[0], P0[1]). |
| XRES | External reset input | Active-low asynchronous reset; internal pull-up enabled by default - used for system-level recovery or watchdog-triggered restart. |
| SWDCLK / SWDIO | ARM Serial Wire Debug interface | 2-pin debug port supporting full-chip programming, breakpoints, and real-time trace - no JTAG TAP required; compatible with MiniProg3 and industry-standard debug tools. |
| XTAL_IN / XTAL_OUT | 24-MHz crystal oscillator connection | Drives BLE RF timing and high-accuracy system clocks; requires 24-MHz ±20 ppm crystal with load capacitance matching per AN95089. |
| WCO_IN / WCO_OUT | 32.768-kHz watch crystal oscillator | Enables ultra-low-power RTC and Deep Sleep wake-up intervals - essential for periodic BLE advertising or sensor sampling without waking CPU. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated BLE 4.2 Radio Subsystem (BLESS) | Eliminates external RF front-end and baseband ICs - reduces BOM count, PCB area, and RF layout complexity while maintaining certified BLE compliance. |
| Programmable Analog Blocks (CTBm) | Four opamps with comparator mode and ADC buffering - enable sensor signal chain integration (e.g., bridge amplification + filtering + digitization) without external components. |
| Universal Digital Blocks (UDBs) | Hardware-reconfigurable logic with Verilog support - allows custom PWM generators, state machines, or protocol accelerators implemented in silicon, not firmware. |
| SmartSense™ Auto-Tuning | Fully hardware-accelerated CapSense calibration - dynamically adjusts IDACs and scanning parameters to compensate for environmental drift, eliminating host MCU intervention. |
| Low-Power Deep Sleep with WCO | 1.5 µA current draw while maintaining 32.768-kHz timebase - enables precise, battery-efficient wake-up scheduling for BLE advertising intervals or sensor polling. |
Applications
| Wireless Human Interface Devices | BLE Asset Tracking Tags |
|---|---|
|
Use Scenario: Battery-powered touch-enabled remote controls, smart pens, and ergonomic keyboards using capacitive sliders and buttons. IC Role / Device Role / Timing Role: Central SoC managing CapSense input, BLE advertising/connection, and low-latency HID profile reporting. Use Value: Single-chip solution replaces MCU + BLE module + touch controller - reduces bill-of-materials cost by 35% and PCB footprint by 40% versus discrete approach. |
Use Scenario: Small-form-factor tags attached to equipment, tools, or inventory items for location monitoring via BLE proximity scanning. IC Role / Device Role / Timing Role: Autonomous sensor node performing periodic temperature/humidity reads and broadcasting iBeacon/Eddystone packets. Use Value: Hibernate mode (150 nA) + SmartSense™-tuned CapSense enables >3-year operation on CR2032 - validated per AN92584 battery life estimation model. |
| Smart Sensor Nodes | Industrial BLE Gateway Edge Controllers |
|
Use Scenario: Environmental monitoring nodes in HVAC, lighting, or building automation systems measuring ambient light, motion, and air quality. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog (ADC), digital (I²C), and capacitive inputs, then transmitting via BLE to central gateway. Use Value: On-chip 12-bit SAR ADC with sequencer and averaging achieves ±0.5% measurement accuracy across temperature - no external precision references needed. |
Use Scenario: DIN-rail mounted edge controllers collecting Modbus RTU data from legacy sensors and relaying via BLE to cloud-connected gateways. IC Role / Device Role / Timing Role: Protocol translator and BLE endpoint with dual SCBs configured as UART (Modbus) and BLE GATT server. Use Value: Runtime-reconfigurable SCBs allow field-upgradable interface mapping - avoids hardware redesign when adding new sensor types or communication protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE-integrated microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | Arm Cortex-M4F @ 64 MHz, 1 MB flash, 256 KB RAM, USB 2.0, Thread/Matter support - no integrated CapSense or programmable analog blocks. | Better for compute-intensive BLE mesh or Matter-over-Thread applications; lacks on-chip analog front-end for direct sensor interfacing. | Select when requiring USB connectivity, higher floating-point performance, or multi-protocol support - not for analog-sensor-dominant designs. |
| Texas Instruments CC2642R1F | Arm Cortex-M4F @ 48 MHz, 352 KB flash, 80 KB RAM, integrated RF balun - no UDBs or CapSense engine; uses external ADC/opamps. | Optimized for long-range BLE and concurrent multi-role operation (e.g., central + peripheral); requires external analog components for sensor signal chain. | Select for high-throughput BLE audio streaming or multi-role network topologies - avoid when minimizing external analog BOM is critical. |
Compared with nRF52840-QIAA and CC2642R1F, CY8C4248LQI-BL553T uniquely combines BLE 4.2, programmable analog/digital hardware, and CapSense in one die - reducing component count and layout risk for sensor-rich, cost-sensitive BLE endpoints where analog integration outweighs raw CPU throughput needs.
Availability
CY8C4248LQI-BL553T is available at Aetrix Electronics and suitable for wireless human interface devices, BLE asset tracking tags, and smart sensor nodes requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade variants (CY8C4248LQI-BL553T is industrial-qualified; automotive-grade CY8C4248LQI-BL553A also available).
Supply support for CY8C4248LQI-BL553T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the PSoC® portfolio. Infineon is a global semiconductor leader focused on power systems, automotive, industrial, and IoT solutions with manufacturing in Germany, Malaysia, and Austria.
CY8C4248LQI-BL553T belongs to the PSoC 4200_BLE family - designed specifically for ultra-low-power, sensor-integrated Bluetooth Low Energy endpoints where hardware programmability replaces multiple discrete ICs in space-constrained, battery-operated applications.
FAQ
Does CY8C4248LQI-BL553T support Bluetooth 5.0 or later?
No. CY8C4248LQI-BL553T implements Bluetooth Low Energy 4.2 only, as confirmed in the PSoC 4200_BLE Family Datasheet (002-23053 Rev. **). It does not support Bluetooth 5.0 features such as LE Long Range, LE Advertising Extensions, or increased data throughput. For Bluetooth 5.x support, consider Infineon's later-generation PSoC 6 series devices like CY8C6247FDI-D52.
Can the on-chip opamps operate in Deep Sleep mode?
Yes. All four opamps in CY8C4248LQI-BL553T retain functionality in Deep Sleep mode when powered by the low-power analog rail (VDDD), enabling continuous sensor signal conditioning and comparator-based wake-up events without CPU intervention - verified in Section 7 (Analog Blocks) of the datasheet.
What development tools are required to program and debug this device?
PSoC Creator™ IDE (free, Windows-only) is the primary tool for schematic-based design, component configuration, and firmware generation. Programming and debugging use the MiniProg3 programmer/debugger via SWD interface. Third-party Arm-compatible tools (e.g., Keil MDK, IAR Embedded Workbench) can be used post-design export, but PSoC Creator is required for analog/digital block configuration and CapSense tuning.
Is external flash memory required for OTA firmware updates?
No. CY8C4248LQI-BL553T supports Over-The-Air (OTA) DFU using its internal 256 KB flash with dedicated bootloader space. The device implements a dual-bank flash layout managed by Cypress-provided Bootloadable and Bootloader components in PSoC Creator - enabling safe, atomic firmware swaps without external memory, as documented in AN97060.
CY8C4248LQI-BL553T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 56-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR; D/A 2xIDAC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4248LQI-BL553T FAQ
1.How can I place an order for CY8C4248LQI-BL553T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL553T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4248LQI-BL553T reliable?
The price and inventory of CY8C4248LQI-BL553T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL553T is usually 5 days.
3.What payment methods are accepted for CY8C4248LQI-BL553T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL553T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4248LQI-BL553T?
CY8C4248LQI-BL553T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4248LQI-BL553T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4248LQI-BL553T?
For technical support, including CY8C4248LQI-BL553T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL553T requirements.
6.How does Aetrix verify that CY8C4248LQI-BL553T is sourced from the original manufacturer or authorized distributors?
All CY8C4248LQI-BL553T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL553T meets industry standards.
7.What is the process for return or replacement of CY8C4248LQI-BL553T?
All CY8C4248LQI-BL553T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL553T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4248LQI-BL553T part is unused and in its original packaging.
Return procedure for CY8C4248LQI-BL553T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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