My Inquiry
My Account
Infineon Technologies CY8C4248LQI-BL563T
- Part No.:
- CY8C4248LQI-BL563T
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 56-UFQFN Exposed Pad
- Datasheet:
-
CY8C4248LQI-BL563T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,614
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C4248LQI-BL563T from Infineon is a 32-bit PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU, Bluetooth® Low Energy 4.2 radio (BLESS), 256 KB flash, 32 KB SRAM, and reconfigurable analog/digital peripherals. It operates at up to 24 MHz, supports capacitive sensing (CSD) with >5:1 SNR, and delivers –89 dBm RX sensitivity in a 7 mm × 7 mm 56-pin QFN package for wireless sensor node applications.
For engineers reviewing the CY8C4248LQI-BL563T datasheet, CY8C4248LQI-BL563T pinout, CY8C4248LQI-BL563T application, or CY8C4248LQI-BL563T equivalent, key selection criteria include BLE 4.2 compliance, Deep-Sleep current of 1.3 µA with WCO, 12-bit 806 ksps SAR ADC, programmable GPIO drive strength, and integrated LCD segment drive capability.
Technical Context
The device implements a dual-subsystem architecture: a 24-MHz Arm® Cortex®-M0 core with flash accelerator and a dedicated AIROC™ Bluetooth® LE subsystem (BLESS) featuring digital PHY, link-layer engine, and RF transceiver compliant with Bluetooth® 4.2. The BLESS handles packet assembly, encryption, and connection management independently of the CPU.
Analog resources include two opamps supporting comparator mode and ADC input buffering, a 12-bit SAR ADC with channel sequencer and signal averaging, and two low-power comparators operational in Deep-Sleep mode. Digital flexibility is enabled by four TCPWM blocks and two reconfigurable SCBs supporting I²C/SPI/UART.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0, 24 MHz max, single-cycle multiply - enables deterministic real-time control with minimal latency. |
| Memory | 256 KB flash (with read accelerator), 32 KB SRAM - supports complex BLE stack + application firmware with fast code execution. |
| BLE Compliance | Bluetooth® 4.2, BLESS subsystem - provides certified low-energy wireless connectivity without external RF components. |
| ADC | 12-bit SAR, 806 ksps, differential/single-ended, channel sequencer - captures high-fidelity sensor data with hardware-automated sampling sequences. |
| Power Modes | Deep-Sleep: 1.3 µA (WCO active); Hibernate: 150 nA (RAM retention); Stop: 60 nA - enables multi-year battery life in coin-cell-powered IoT endpoints. |
| Capacitive Sensing | CSD with SmartSense auto-tuning, >5:1 SNR, liquid-tolerant - delivers robust touch interface operation under wet or noisy environmental conditions. |
| GPIO | Up to 36 programmable pins, including 2 OVT pins, configurable drive strength/slew rate - supports mixed-signal interfacing, LCD segment drive, and CAPSENSE™ on any pin. |
Pinout & Package
Package: 7 mm × 7 mm, 56-pin QFN (LQFP-style exposed pad, RoHS-compliant, moisture sensitivity level 3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 1.71–5.5 V input; powers digital logic, analog blocks, and BLE subsystem - supports direct connection to single-cell Li-ion or 3.3 V rails. |
| VSS | Digital/analog ground | Common reference for all circuits; separate analog/digital ground routing recommended for noise-sensitive ADC/CSD operation. |
| P0[0]–P0[7] | Programmable GPIO | Support CAPSENSE™, LCD segment/common, analog input/output, or digital communication - full reconfiguration via firmware. |
| P1[0]–P1[7] | Programmable GPIO | Includes two overvoltage-tolerant (OVT) pins - safe for interfacing with 5 V systems without level shifters. |
| XRES | Active-low reset | Asynchronous reset input; internal pull-up; compatible with pushbutton or microcontroller-driven reset sequencing. |
| SWDCK / SWDIO | Debug interface | Two-pin Serial Wire Debug (SWD) port - enables programming, breakpoint debugging, and real-time trace without dedicated JTAG pins. |
| ANT | RF antenna output | 50 Ω matched RF output; requires external matching network and PCB antenna or RF connector - no external PA/LNA needed. |
Key Features
| Feature | Design Value |
|---|---|
| Reconfigurable Analog Blocks | Two opamps with comparator mode and ADC buffering - enable sensor signal conditioning, zero-crossing detection, and low-power wake-on-event without CPU intervention. |
| SmartSense Auto-Tuning | Hardware-accelerated CSD calibration - eliminates manual tuning across temperature/humidity variations and reduces firmware development time by >70%. |
| Segment LCD Drive | Direct drive on all GPIOs with Deep-Sleep support and 4-bit per-pin memory - allows persistent display updates during ultra-low-power sleep without RAM refresh. |
| BLE Subsystem Offload | Dedicated BLESS with link-layer engine - frees Cortex®-M0 to handle application logic while maintaining BLE connections, advertising, and security operations autonomously. |
| Runtime Reconfigurable SCBs | Two serial blocks supporting I²C/SPI/UART simultaneously - permits dynamic peripheral assignment (e.g., SPI to sensor, UART to host) without hardware redesign. |
Applications
| Wireless Sensor Node | Smart Home Touch Interface |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data every 2 seconds via BLE to a gateway. IC Role / Device Role / Timing Role: MCU + BLE transceiver + SAR ADC + CSD - performs sensor acquisition, local processing, encrypted BLE advertising, and ultra-low-power sleep scheduling. Use Value: 1.3 µA Deep-Sleep current with WCO enables >5-year CR2032 battery life; integrated BLESS eliminates external BLE module BOM and layout complexity. | Use Scenario: Wall-mounted thermostat with capacitive touch buttons and segmented LCD display operating in humid indoor environments. IC Role / Device Role / Timing Role: CAPSENSE™ controller + LCD driver + Cortex®-M0 application processor - manages wet-tolerant touch response, display update, and HVAC control logic. Use Value: SmartSense auto-tuning maintains button reliability across condensation; LCD drive in Deep-Sleep extends battery runtime while preserving display state. |
| BLE Beacon Transmitter | Industrial Asset Tag |
Use Scenario: Small-form-factor beacon broadcasting Eddystone UID frames at 100 ms intervals in retail or logistics settings. IC Role / Device Role / Timing Role: BLE subsystem + timer/PWM + flash memory - generates precise advertising intervals, manages frame payload, and retains configuration across power cycles. Use Value: –89 dBm RX sensitivity ensures reliable connection during OTA firmware updates; +3 dBm TX power extends broadcast range to ≥50 m in open air. | Use Scenario: Ruggedized equipment tag monitoring vibration and temperature, logging data locally and syncing via BLE when near a reader. IC Role / Device Role / Timing Role: Data logger + BLE endpoint + analog front-end - acquires sensor data via SAR ADC, stores in flash, and initiates secure BLE connection upon proximity detection. Use Value: 256 KB flash accommodates firmware, BLE stack, and multi-day sensor logs; programmable GPIO drive strength interfaces directly with piezoelectric and thermistor sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar BLE-enabled MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52833 | 64 MHz Arm® Cortex®-M4F, 512 KB flash, 128 KB RAM, BLE 5.1, no integrated analog peripherals | Requires external ADC/opamp for sensor signal chain; higher compute headroom but larger BOM and power budget | Preferred when floating-point math or BLE 5.1 features (e.g., long-range, mesh) are required and analog integration is handled externally. |
| Texas Instruments CC2642R | 48 MHz Arm® Cortex®-M4F, 352 KB flash, 80 KB RAM, BLE 5.0, integrated 12-bit ADC and opamps | Higher RF output (+5 dBm), lower RX sensitivity (–92 dBm), no CAPSENSE™ or LCD drive | Chosen for longer-range BLE links and higher analog channel count, but lacks Infineon's CSD and segment LCD capabilities. |
Compared with nRF52833 and CC2642R, CY8C4248LQI-BL563T uniquely combines BLE 4.2, capacitive sensing with SmartSense, segment LCD drive, and Deep-Sleep power efficiency in a single chip-reducing component count and firmware complexity for compact, battery-constrained human-interface and sensor-edge devices.
Availability
CY8C4248LQI-BL563T is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home interfaces, BLE beacons, and industrial asset tags requiring stable component supply, long-term lifecycle support, and qualified automotive-grade traceability.
Supply support for CY8C4248LQI-BL563T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and connectivity solutions for automotive, industrial, and IoT markets.
CY8C4248LQI-BL563T belongs to the PSoC™ 4 CY8C4xxx-BL family, designed specifically for ultra-low-power, integrated BLE edge devices requiring programmable analog/digital logic, capacitive sensing, and human-machine interface capabilities.
FAQ
Does CY8C4248LQI-BL563T support Bluetooth® 5.0 or later?
No. This device implements Bluetooth® Low Energy 4.2 only, as confirmed by its BLESS subsystem architecture and official Infineon documentation. It does not support BLE 5.0 features such as long-range mode, higher throughput, or mesh networking. Firmware-level upgrades cannot extend compliance beyond the hardware-defined specification.
Can the integrated opamps operate in Deep-Sleep mode?
Yes. Both opamps support Deep-Sleep operation with comparator mode enabled, allowing wake-on-analog-event functionality. They retain bias settings and can drive comparators or buffer ADC inputs while the CPU and most digital blocks remain powered down, consuming <1 µA additional current.
What is the maximum clock frequency for the SAR ADC?
The SAR ADC achieves 806 ksps maximum sample rate at 12-bit resolution, corresponding to a 9.85 MHz conversion clock derived from the internal IMO or external clock source. Oversampling and averaging reduce effective noise but do not increase the base sampling rate beyond this limit.
Is external crystal required for BLE operation?
A 24 MHz external crystal is required for BLE RF accuracy and timing compliance. The internal IMO cannot meet Bluetooth® 4.2 frequency tolerance requirements. However, the 32.768 kHz watch crystal (WCO) is optional and used only for Deep-Sleep timing; BLE operation relies on the 24 MHz ECO.
CY8C4248LQI-BL563T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 56-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR; D/A 2xIDAC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4248LQI-BL563T FAQ
1.How can I place an order for CY8C4248LQI-BL563T through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL563T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4248LQI-BL563T reliable?
The price and inventory of CY8C4248LQI-BL563T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL563T is usually 5 days.
3.What payment methods are accepted for CY8C4248LQI-BL563T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL563T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4248LQI-BL563T?
CY8C4248LQI-BL563T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4248LQI-BL563T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4248LQI-BL563T?
For technical support, including CY8C4248LQI-BL563T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL563T requirements.
6.How does Aetrix verify that CY8C4248LQI-BL563T is sourced from the original manufacturer or authorized distributors?
All CY8C4248LQI-BL563T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL563T meets industry standards.
7.What is the process for return or replacement of CY8C4248LQI-BL563T?
All CY8C4248LQI-BL563T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL563T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4248LQI-BL563T part is unused and in its original packaging.
Return procedure for CY8C4248LQI-BL563T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C4248LQI-BL563T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
