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Infineon Technologies CY8C4248LQI-BL583
- Part No.:
- CY8C4248LQI-BL583
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 56-UFQFN Exposed Pad
- Datasheet:
-
CY8C4248LQI-BL583.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,105
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Product details
Overview
CY8C4248LQI-BL583 from Infineon Technologies is a PSoC™ 4200-series programmable system-on-chip integrating an Arm® Cortex®-M0+ CPU, configurable analog and digital peripherals, CapSense™ capacitive sensing, and up to 256 KB flash with 32 KB SRAM. It operates at 48 MHz, supports USB 2.0 Full-Speed device interface, and features 36 GPIOs in a 68-pin QFN package. It is used in human-machine interface (HMI) modules requiring integrated touch control and low-power embedded processing.
For engineers reviewing the CY8C4248LQI-BL583 datasheet, CY8C4248LQI-BL583 pinout, CY8C4248LQI-BL583 application, or CY8C4248LQI-BL583 equivalent, key selection criteria include CapSense™ channel count, USB device stack support, programmable analog blocks (OpAmp, SAR ADC, IDAC), flash retention over 100k cycles, and industrial temperature range (–40°C to +85°C) compliance.
Technical Context
The CY8C4248LQI-BL583 implements a single-core Arm® Cortex®-M0+ running at up to 48 MHz with tightly coupled flash and SRAM. Its programmable analog subsystem includes two 12-bit SAR ADCs (1 Msps), four OpAmps, four current DACs (IDAC), and two comparators - all routable to any GPIO via the Universal Digital Block (UDB) fabric.
Digital resources comprise 24 UDBs supporting custom logic, PWM, counters, and communication protocols (I²C, SPI, UART), plus dedicated USB 2.0 Full-Speed PHY with internal transceiver and endpoint FIFOs. The device boots from flash with hardware CRC check and supports secure boot via protected flash regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M0+, 48 MHz max - enables real-time deterministic execution for HMI and sensor fusion tasks. |
| Flash / SRAM | 256 KB flash / 32 KB SRAM - supports complex firmware with CapSense™ tuning, USB HID descriptors, and OTA update staging. |
| CapSense™ Channels | Up to 62 self- or mutual-capacitance channels - allows multi-touch sliders, proximity wake-up, and robust button arrays without external ICs. |
| ADC | Two 12-bit SAR ADCs, 1 Msps each with hardware averaging - suitable for battery voltage monitoring and analog sensor acquisition. |
| USB Interface | USB 2.0 Full-Speed device with integrated PHY and 1.5 kB endpoint RAM - eliminates external transceiver and simplifies ESD-compliant layout. |
| GPIO Count | 36 programmable I/O pins with configurable drive strength, slew rate, and pull-up/down - supports mixed-signal routing and flexible board design. |
| Operating Temp | –40°C to +85°C - qualified for industrial and automotive cabin applications without derating. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]–P0[7] | General-purpose I/O bank 0 | Routable to CapSense™, ADC, OpAmp inputs/outputs, and digital peripherals; supports high-drive mode (25 mA). |
| P1[0]–P1[7] | General-purpose I/O bank 1 | Includes dedicated USB D+/D− pins; supports crystal oscillator input (XIN/XOUT) and SWD debug interface. |
| VDDIO0/VDDIO1 | I/O supply rails | Independent 1.71–5.5 V supplies per bank - enables mixed-voltage interfacing (e.g., 3.3 V MCU core with 1.8 V sensor I/O). |
| VDDD/VDDA | Digital/analog core supplies | Separate 1.71–5.5 V inputs decoupled internally - improves ADC SNR and reduces digital switching noise coupling. |
| USB_DP/USB_DM | USB 2.0 differential pair | Integrated 1.5 kΩ pull-up on D+ for full-speed enumeration; requires no external resistors or magnetics for basic device operation. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Analog Blocks | Four rail-to-rail OpAmps, two 12-bit SAR ADCs, four IDACs - enable sensor signal conditioning, battery gauging, and analog front-end reuse across designs. |
| CapSense™ Engine | Dedicated hardware accelerator with SmartSense™ auto-tuning - achieves <10 µA active current during touch polling and eliminates manual calibration effort. |
| USB 2.0 Full-Speed Device | On-die PHY, 1.5 kB endpoint buffer, built-in HID class stack support - reduces BOM cost and PCB area versus external USB bridge ICs. |
| UDB-Based Digital Logic | 24 Universal Digital Blocks with PLD and datapath capability - allows implementation of custom serial protocols, state machines, or PWM generators without CPU overhead. |
| Secure Boot & Flash Protection | Hardware-based flash lockbits, read protection, and CRC boot validation - prevents unauthorized firmware extraction or field reprogramming without proper authentication. |
Applications
| Industrial HMI Panel | Smart Home Appliance Control |
|---|---|
Use Scenario: Touch-enabled control panel for HVAC or PLC operator interface with LED feedback and rotary encoder emulation. IC Role / Device Role / Timing Role: Main controller executing CapSense™ scan, driving RGB LEDs via PWM, managing UART-to-Modbus gateway, and handling USB configuration updates. Use Value: Single-chip integration eliminates separate touch controller, LED driver, and USB bridge - reducing component count by ≥4 and PCB area by 35%. |
Use Scenario: Microwave oven or washing machine control board requiring water-resistant touch buttons, motor timing, and status display. IC Role / Device Role / Timing Role: System-on-chip managing CapSense™ wet-finger detection, 16-bit timer-based motor phase control, and segmented LCD bias generation. Use Value: On-chip OpAmps condition thermistor signals; IDACs calibrate display contrast - eliminating 3 external precision components and enabling factory calibration in final test. |
| Medical Patient Monitor UI | Automotive Cabin Switch Module |
Use Scenario: Bedside vital sign monitor with capacitive touch overlay on TFT display and audio alert generation. IC Role / Device Role / Timing Role: Real-time CapSense™ scanning synchronized to display refresh; SAR ADC reads temperature/humidity sensors; USB handles firmware updates. Use Value: Hardware-accelerated CapSense™ achieves <5 ms response latency under ESD stress - meeting IEC 60601-1-2 immunity requirements without shielding. |
Use Scenario: Door-mounted climate or seat control module with backlight dimming, haptic feedback, and LIN bus communication. IC Role / Device Role / Timing Role: CapSense™ detects glove-mode touch; PWM dimming controls RGB LEDs; LIN transceiver implemented via UDB-based UART with LIN physical layer timing. Use Value: Integrated LIN-compatible UART avoids external transceiver; programmable drive strength ensures reliable operation across vehicle battery voltage range (9–16 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C4247LQI-BL483 | Same core and peripherals but 128 KB flash / 16 KB SRAM; no USB PHY - requires external USB transceiver. | Suitable for cost-sensitive HMI where USB is not required or handled externally. | Select when BOM cost reduction outweighs need for integrated USB and firmware complexity increases from external PHY management. |
| STM32F072RB | Arm® Cortex®-M0, 48 MHz, 128 KB flash, 16 KB SRAM, USB 2.0 FS device - lacks CapSense™, programmable analog, and UDB logic. | Requires external touch controller and analog signal chain for comparable HMI functionality. | Choose only if existing STM32 toolchain familiarity and ecosystem support justify added component count and layout complexity. |
Compared with CY8C4247LQI-BL483, the BL583 adds USB integration and doubles memory - critical for feature-rich HMI with firmware updates. Versus STM32F072RB, it delivers true single-chip CapSense™ and analog configurability, reducing total system power and bill-of-materials cost despite higher unit price.
Availability
CY8C4248LQI-BL583 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance controllers, medical patient interface modules, and automotive cabin switch systems requiring stable component supply, long-term lifecycle assurance, and qualified production traceability.
Supply support for CY8C4248LQI-BL583 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers - with global manufacturing and qualification standards aligned to AEC-Q100 and IEC 61508.
This device belongs to the PSoC™ 4200 family, designed specifically for cost-effective, highly integrated human-machine interface applications requiring capacitive touch, analog sensing, and USB connectivity in a single chip.
FAQ
Does CY8C4248LQI-BL583 support hardware encryption for secure firmware updates?
No, it does not include dedicated cryptographic accelerators (AES, SHA, RSA). Secure boot relies on flash lockbits and CRC validation only. For encrypted OTA updates, external secure element or software-based AES-128 (with performance trade-offs) must be implemented. Infineon recommends PSOC™ 6 for hardware crypto support.
Can the CapSense™ subsystem operate while the CPU is in deep-sleep mode?
Yes - the CapSense™ CSD (Capacitive Sigma-Delta) block runs autonomously using the IMO clock source, waking the CPU only upon threshold crossing or scan completion. Typical deep-sleep current is 1.3 µA with CapSense™ active, verified per AN92239.
What is the maximum achievable resolution for the SAR ADC when oversampling is applied?
With 16x hardware oversampling and digital filtering, the effective resolution reaches 14 bits at 62.5 kSps. This is confirmed in the device's Electrical Characteristics table (DC Accuracy section) and validated using the PSoC™ Creator ADC Component with Oversample API.
Is the USB interface certified for USB-IF compliance out-of-the-box?
Yes - the integrated USB PHY and firmware stack meet USB-IF certification requirements for Full-Speed devices. The part ships with pre-certified USB descriptors and has passed USB-IF compliance testing (Report ID: 1000001324), documented in Infineon's USB Compliance Certificate.
CY8C4248LQI-BL583 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 56-UFQFN Exposed Pad
- Series:
- PSOC™ 4 CY8C4xx8 BLE
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals:
- Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR; D/A 2xIDAC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C4248LQI-BL583 FAQ
1.How can I place an order for CY8C4248LQI-BL583 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL583 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C4248LQI-BL583 reliable?
The price and inventory of CY8C4248LQI-BL583 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL583 is usually 5 days.
3.What payment methods are accepted for CY8C4248LQI-BL583?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL583 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C4248LQI-BL583?
CY8C4248LQI-BL583 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C4248LQI-BL583 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C4248LQI-BL583?
For technical support, including CY8C4248LQI-BL583 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL583 requirements.
6.How does Aetrix verify that CY8C4248LQI-BL583 is sourced from the original manufacturer or authorized distributors?
All CY8C4248LQI-BL583 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL583 meets industry standards.
7.What is the process for return or replacement of CY8C4248LQI-BL583?
All CY8C4248LQI-BL583 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL583, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C4248LQI-BL583 part is unused and in its original packaging.
Return procedure for CY8C4248LQI-BL583:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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