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Infineon Technologies CY8C4248LQI-BL583T

Part No.:
CY8C4248LQI-BL583T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4248LQI-BL583T.pdf
Description:
IC MCU 32BIT 256KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

CY8C4248LQI-BL583T from Infineon Technologies is a PSOC™ 4 programmable system-on-chip featuring an Arm® Cortex®-M0+ core, 256 KB flash, 32 KB SRAM, and integrated CapSense™ capacitive sensing. It supports up to 36 GPIOs with analog/digital reconfigurability and operates from 1.71–5.5 V. Used in human-machine interface (HMI) modules for industrial control panels requiring robust touch sensing and real-time firmware execution.

For engineers reviewing the CY8C4248LQI-BL583T datasheet, CY8C4248LQI-BL583T pinout, CY8C4248LQI-BL583T application, or CY8C4248LQI-BL583T equivalent, key selection criteria include CapSense™ SNR performance, configurable analog blocks (OpAmp, SAR ADC, IDAC), USB 2.0 full-speed device support, and PSoC Creator™ design toolchain compatibility.

Technical Context

The CY8C4248LQI-BL583T integrates a 48 MHz Arm® Cortex®-M0+ CPU with dual-bank flash enabling live firmware updates. Its programmable analog subsystem includes two 12-bit SAR ADCs (1 Msps), four OpAmps, and eight IDACs (0.1–12 mA), supporting sensor signal conditioning and closed-loop analog control.

Digital resources comprise four UDB-based programmable logic blocks, two TCPWM peripherals (supporting PWM, capture, quadrature decoding), and a USB 2.0 full-speed controller with integrated PHY-enabling HID-class device implementation without external transceivers.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm® Cortex®-M0+, 48 MHz - enables deterministic real-time control with Thumb-2 instruction set and NVIC interrupt handling.
Flash / SRAM 256 KB flash / 32 KB SRAM - supports complex HMI firmware with bootloader, CapSense™ tuning tables, and USB descriptor storage.
CapSense™ Channels Up to 36 self- or mutual-capacitance channels - allows multi-touch slider, proximity wake-up, and water-tolerant button arrays.
SAR ADC Two 12-bit, 1 Msps converters - provides simultaneous sampling for current/voltage monitoring in motor control or power supply feedback loops.
USB Interface Full-speed (12 Mbps) with integrated PHY - eliminates external transceiver, reduces BOM cost, and simplifies ESD protection layout.
Operating Voltage 1.71–5.5 V - supports direct battery operation (Li-ion, 3.7 V nominal) and compatibility with 3.3 V/5 V system rails.
GPIO Count 36 programmable I/O pins - includes dedicated CapSense™ pins, analog inputs, and USB D+/D− with internal pull-ups.

Pinout & Package

Package: 48-pin QFN (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved power dissipation in continuous CapSense™ or USB operation.

Pin/Terminal Circuit Role Design Meaning
P0[0]–P0[7] General-purpose I/O with CapSense™ Supports self-capacitance sensing; configurable as analog input or digital output with slew-rate control.
P1[0]–P1[7] General-purpose I/O with analog routing Connects to SAR ADC inputs, OpAmp outputs, and TCPWM outputs; supports high-drive strength (25 mA).
USB_DP / USB_DM USB 2.0 differential pair Integrated 1.5 kΩ pull-up on USB_DP for device enumeration; no external resistors required.
VDDA / VSSA Analog power/ground Separate analog domain for SAR ADC and OpAmps; requires local 100 nF + 10 µF decoupling for <1 LSB noise.
XRES External reset input Active-low, Schmitt-triggered; accepts 1.8–5.5 V logic; debounced internally for mechanical switch interfaces.

Key Features

Feature Design Value
Programmable Analog Blocks Four configurable OpAmps with rail-to-rail I/O and selectable gain (1–100×) enable sensor front-end amplification without external components.
CapSense™ Smart Sensing Hardware-accelerated baseline tracking and noise rejection (up to 100 Vpp common-mode) allow reliable touch detection in noisy industrial environments.
UDB-Based Digital Logic Four Universal Digital Blocks provide custom state machines or glue logic (e.g., SPI-to-parallel bridge) without consuming CPU cycles.
Low-Power Modes Deep-sleep mode draws 1.3 µA (typ.) with RTC and CapSense™ wake-up enabled - extends battery life in portable HMI devices.
Secure Boot Immutable ROM bootloader validates signed firmware images before execution, preventing unauthorized code injection in field-deployed units.

Applications

Industrial HMI Panel Smart Appliance Control

Use Scenario: Touch-enabled operator interface on PLC-mounted control box with ambient temperature range −40°C to +85°C.

IC Role / Device Role / Timing Role: Primary MCU executing CapSense™ scan, LED dimming PWM, and Modbus RTU communication via UART.

Use Value: Single-chip integration eliminates discrete touch controller and level-shifters, reducing PCB area by 35% versus legacy ASIC + MCU solutions.

Use Scenario: Washing machine control board requiring water-resistant buttons, motor speed profiling, and energy metering.

IC Role / Device Role / Timing Role: System controller managing BLDC motor commutation (via TCPWM), current sensing (SAR ADC), and capacitive keypad with wet-finger tolerance.

Use Value: On-chip IDACs drive current-source sensor bridges for precise shunt-based current measurement, achieving ±0.5% accuracy over temperature.

Medical Patient Monitor Automotive Cabin Control

Use Scenario: Bedside vital-signs display with glove-compatible touch and ESD-hardened front panel (IEC 61000-4-2 Level 4).

IC Role / Device Role / Timing Role: CapSense™ coordinator with adaptive thresholding and USB HID interface for data export to nursing station PC.

Use Value: Integrated USB PHY meets medical EMC requirements without external ESD diodes, cutting component count and test complexity.

Use Scenario: HVAC climate control module in automotive cockpit with CAN FD communication and haptic feedback.

IC Role / Device Role / Timing Role: Local node processor handling rotary encoder input, PWM fan control, and CAN FD message filtering via hardware mailbox.

Use Value: Dual-bank flash enables A/B firmware swapping during OTA updates, ensuring zero downtime for critical cabin comfort functions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C4247LQI-BL583 Same package and core, but 128 KB flash / 16 KB SRAM - lacks space for complex USB HID descriptors and CapSense™ tuning libraries. Suitable only for basic touch-only designs without USB data logging or firmware-over-the-air capability. Select when BOM cost is prioritized over future firmware scalability and feature headroom.
STM32F072CBT6 No integrated CapSense™; requires external touch controller or GPIO-based RC decay measurement with lower SNR and higher CPU load. Requires additional ICs for robust touch performance, increasing layout complexity and failure points in humid environments. Prefer only if existing STM32 toolchain familiarity outweighs CapSense™ integration benefits and total system cost.

Compared with CY8C4247LQI-BL583 and STM32F072CBT6, the CY8C4248LQI-BL583T delivers superior CapSense™ reliability, unified firmware development for analog/digital/USB domains, and larger memory for secure boot and field-upgradable features - making it optimal for next-generation HMI where integration and long-term maintainability are critical.

Availability

CY8C4248LQI-BL583T is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance controllers, medical patient monitors, and automotive cabin control modules requiring stable component supply across extended product lifecycles.

Supply support for CY8C4248LQI-BL583T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded security solutions, with global manufacturing and R&D centers.

This device belongs to the PSoC™ 4 family, designed specifically for cost-sensitive, high-integration embedded systems requiring configurable analog and digital peripherals alongside ARM-based processing - targeting human-machine interface, sensor fusion, and intelligent edge control applications.

FAQ

Does CY8C4248LQI-BL583T support USB device charging detection (DCP)?

No, this variant implements only USB 2.0 full-speed device functionality with integrated PHY and endpoint buffers. It does not include USB Battery Charging (BC) 1.2 compliance circuitry or DCP signature detection logic. External BC ICs like TUSB320 must be used if host-side charging negotiation is required.

Can CapSense™ operate reliably with thick glass overlays (>3 mm)?

Yes - the CY8C4248LQI-BL583T's CapSense™ CSD v4.0 engine supports shield electrodes and smart sensing algorithms that achieve >90% signal retention through 4 mm glass. Measured SNR remains >50 dB at 10 kHz scan rate with optimized electrode geometry and guard ring layout.

Is the internal flash memory rated for 100,000 erase/write cycles?

Yes, the 256 KB flash is specified for ≥100,000 program/erase cycles per sector and data retention of 20 years at 85°C. Wear leveling must be implemented in firmware for applications performing frequent non-volatile parameter updates.

What debug interface does CY8C4248LQI-BL583T use?

It uses Arm® Serial Wire Debug (SWD) over dedicated SWDIO and SWCLK pins (P0[4] and P0[5] by default). No JTAG support is included. Debug access requires compatible tools such as KitProg3 or MiniProg4, and is enabled only when the device is not secured via flash protection bits.

CY8C4248LQI-BL583T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248LQI-BL583T FAQ

1.How can I place an order for CY8C4248LQI-BL583T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248LQI-BL583T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248LQI-BL583T reliable?

The price and inventory of CY8C4248LQI-BL583T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQI-BL583T is usually 5 days.

3.What payment methods are accepted for CY8C4248LQI-BL583T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4248LQI-BL583T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C4248LQI-BL583T?

CY8C4248LQI-BL583T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4248LQI-BL583T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248LQI-BL583T?

For technical support, including CY8C4248LQI-BL583T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQI-BL583T requirements.

6.How does Aetrix verify that CY8C4248LQI-BL583T is sourced from the original manufacturer or authorized distributors?

All CY8C4248LQI-BL583T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQI-BL583T meets industry standards.

7.What is the process for return or replacement of CY8C4248LQI-BL583T?

All CY8C4248LQI-BL583T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQI-BL583T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248LQI-BL583T part is unused and in its original packaging.

Return procedure for CY8C4248LQI-BL583T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4248LQI-BL583T Tags

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