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Infineon Technologies CY8C4248LQQ-BL583

Part No.:
CY8C4248LQQ-BL583
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
56-UFQFN Exposed Pad
Datasheet:
AetrixCY8C4248LQQ-BL583.pdf
Description:
IC MCU 32BIT 256KB FLASH 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,906

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Product details

Overview

CY8C4248LQQ-BL583 from Infineon is a PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU, AIROC™ Bluetooth® LE 4.2 radio subsystem (BLESS), 256 KB flash, 32 KB SRAM, and reconfigurable analog/digital peripherals. It operates at up to 24 MHz, supports capacitive sensing (CSD) with >5:1 SNR, and delivers –89 dBm RX sensitivity and +3 dBm TX output in a 7 mm × 7 mm 56-pin QFN package for wireless sensor node applications.

For engineers reviewing the CY8C4248LQQ-BL583 datasheet, CY8C4248LQQ-BL583 pinout, CY8C4248LQQ-BL583 application, or CY8C4248LQQ-BL583 equivalent, key selection criteria include BLE 4.2 compliance, Deep-Sleep current of 1.3 µA with WCO active, 12-bit 806 ksps SAR ADC with sequencer, programmable GPIO drive modes, and integrated LCD segment driver supporting operation in low-power modes.

Technical Context

This device implements a tightly coupled dual-subsystem architecture: the Arm® Cortex®-M0 core executes firmware while the dedicated BLESS (Bluetooth® Low Energy Subsystem) handles link-layer operations autonomously, enabling concurrent application and radio processing. The BLESS includes a 2.4-GHz RF transceiver with 50-Ω antenna interface, digital PHY, and hardware-accelerated AES encryption.

Analog resources include two opamps supporting comparator mode and ADC input buffering, plus a 12-bit SAR ADC with differential/single-ended inputs, channel sequencer, and signal averaging - all operable in Deep-Sleep mode. Digital flexibility is delivered via four TCPWM blocks, two reconfigurable SCBs (I²C/SPI/UART), and programmable interconnect routing.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M0, 24 MHz max, single-cycle multiply for real-time control loops
Memory256 KB flash (with read accelerator), 32 KB SRAM - sufficient for BLE stack + application firmware
BLE ComplianceBluetooth® 4.2, including LE Secure Connections and Data Length Extension support
RF Performance–89 dBm RX sensitivity, +3 dBm TX output, 1-dB RSSI resolution for robust link budgeting
Power Modes1.3 µA Deep-Sleep (WCO active), 150 nA Hibernate (RAM retention), 60 nA Stop mode
ADC12-bit SAR, 806 ksps, hardware sequencer with averaging - enables multi-channel sensor acquisition without CPU load
Capacitive SensingCSD block with SmartSense auto-tuning, >5:1 SNR, liquid-tolerant - validated for touch buttons/sliders in consumer HMI

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQQ), RoHS-compliant, exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore & I/O supply1.71–5.5 V operation; supports single-supply battery-powered designs
GNDGround referenceDedicated analog/digital ground pins with separate return paths for noise isolation
P0[0]–P0[7]Programmable GPIOSupport CAPSENSE™, analog input, LCD segment/common, or digital I/O with configurable slew rate
P1[0]–P1[7]Programmable GPIOInclude two overvoltage-tolerant (OVT) pins for direct connection to 5-V buses
SWDCLK / SWDIODebug interfaceTwo-pin Serial Wire Debug for programming and real-time trace without halting CPU
XRESReset inputActive-low, Schmitt-triggered, supports external reset button or supervisor IC
XTAL_IN / XTAL_OUTCrystal oscillatorDrive 24 MHz crystal for main clock; optional 32.768 kHz WCO for RTC/Deep-Sleep timing

Key Features

FeatureDesign Value
Reconfigurable Analog BlocksTwo opamps with comparator mode and ADC buffering - enable sensor signal conditioning without external components
Hardware-Accelerated BLE StackBLESS subsystem offloads link-layer tasks (advertising, scanning, connection management) from CPU - preserves MCU cycles for application logic
SmartSense Auto-TuningFully automatic CSD calibration during runtime - eliminates manual tuning across temperature/humidity variations
Segment LCD DriverDrives up to 320 segments on any GPIO; operates in Deep-Sleep mode with 4-bit memory per pin - extends battery life in display-based IoT devices
Runtime-Reconfigurable SCBsTwo serial blocks independently configurable as I²C, SPI, or UART - simplifies peripheral interface changes without PCB revision

Applications

Wireless Sensor NodeSmart Home Touch Interface

Use Scenario: Battery-powered temperature/humidity sensor transmitting data via BLE to gateway.

IC Role / Device Role / Timing Role: Primary MCU + BLE radio controller; manages sensor acquisition, data encryption, and advertising interval timing (e.g., 100 ms).

Use Value: 1.3 µA Deep-Sleep current with WCO enables >2-year CR2032 battery life; integrated ADC and opamp reduce BOM count by 3 components.

Use Scenario: Wall-mounted thermostat with capacitive touch slider and LCD display.

IC Role / Device Role / Timing Role: Single-chip HMI controller handling CAPSENSE™ touch detection, LCD segment driving, and local temperature regulation.

Use Value: SmartSense auto-tuning ensures consistent touch response across humidity levels; LCD driver retains display content in Deep-Sleep mode.

BLE Beacon TransmitterIndustrial Asset Tracker

Use Scenario: Fixed-location beacon broadcasting UUID/Major/Minor for proximity detection in retail or logistics.

IC Role / Device Role / Timing Role: Standalone BLE advertiser; uses hardware BLESS timer for precise 200-ms advertising interval.

Use Value: +3 dBm TX output improves range to 50+ meters in open air; no external PA required.

Use Scenario: Ruggedized tracker logging GPS coordinates and motion events, then uploading via BLE to handheld reader.

IC Role / Device Role / Timing Role: Edge-processing node performing motion-triggered wake-up, sensor fusion, and burst BLE transmission.

Use Value: TCPWM blocks generate precise PWM for motion sensor biasing; 150 nA Hibernate mode preserves battery during idle periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE-enabled MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Nordic nRF5283364 MHz Arm® Cortex®-M4F, 512 KB flash, -96 dBm RX sensitivity, no integrated analog peripheralsHigher compute throughput for complex BLE mesh or audio processing; requires external ADC/opamp for sensor front-endSelect when prioritizing RF performance and computational headroom over analog integration and ultra-low Deep-Sleep current
Texas Instruments CC2642R48 MHz Arm® Cortex®-M4F, 352 KB flash, -101 dBm RX sensitivity, integrated RF balun but no programmable analog blocksSuperior RF link budget for long-range industrial telemetry; lacks CAPSENSE™ and LCD driverSelect for extended-range BLE applications where external analog components are acceptable and RF robustness is critical

Compared with nRF52833 and CC2642R, CY8C4248LQQ-BL583 uniquely integrates reconfigurable analog (opamps, ADC, CSD) and digital (LCD, TCPWM) peripherals alongside BLE - reducing system-level component count and simplifying layout for compact, cost-sensitive HMI and sensor nodes.

Availability

CY8C4248LQQ-BL583 is available at Aetrix Electronics and suitable for wireless sensor nodes, smart home interfaces, BLE beacons, and industrial asset trackers requiring stable component supply, full lifecycle support, and verified production-grade firmware compatibility.

Supply support for CY8C4248LQQ-BL583 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

CY8C4248LQQ-BL583 belongs to the PSoC™ 4 CY8C4xxx-BL product line, designed specifically for ultra-low-power, highly integrated Bluetooth® LE edge devices requiring mixed-signal programmability and rapid prototyping via PSoC™ Creator.

FAQ

Does CY8C4248LQQ-BL583 support Bluetooth® 5.0 or later?

No. CY8C4248LQQ-BL583 implements Bluetooth® 4.2 specifications only, including LE Secure Connections and Data Length Extension. It does not support Bluetooth® 5.0 features such as 2× data rate, 4× range extension, or Advertising Extensions. Firmware updates cannot add 5.0 capability due to hardware limitations in the BLESS subsystem.

Can the integrated opamps be used in unity-gain buffer configuration with rail-to-rail output?

Yes. Each opamp supports unity-gain buffer mode with rail-to-rail output swing (VDD to GND) when powered from the same supply as the I/O domain. Input common-mode range extends to VDD, and typical output impedance is <1 Ω at DC, enabling direct ADC input buffering without external passive networks.

What is the maximum achievable BLE advertising interval using hardware timers?

The BLESS subsystem supports advertising intervals from 20 ms to 10.24 seconds in hardware, with precision ±10 ppm using the internal IMO or external crystal. Intervals beyond 10.24 s require CPU intervention and are subject to software timing jitter; hardware-only intervals are guaranteed deterministic and low-power.

Is the 7 mm × 7 mm QFN package compatible with standard reflow profiles for lead-free assembly?

Yes. The LQQ package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260°C for 30 seconds. Recommended profile follows IPC-7531 guidelines with ramp rates ≤3°C/s and time above liquidus (TAL) of 60–90 seconds.

CY8C4248LQQ-BL583 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
56-UFQFN Exposed Pad
Series:
PSOC™ 4 CY8C4xx8 BLE
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 2xIDAC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4248LQQ-BL583 FAQ

1.How can I place an order for CY8C4248LQQ-BL583 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4248LQQ-BL583 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4248LQQ-BL583 reliable?

The price and inventory of CY8C4248LQQ-BL583 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4248LQQ-BL583 is usually 5 days.

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CY8C4248LQQ-BL583 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4248LQQ-BL583?

For technical support, including CY8C4248LQQ-BL583 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4248LQQ-BL583 requirements.

6.How does Aetrix verify that CY8C4248LQQ-BL583 is sourced from the original manufacturer or authorized distributors?

All CY8C4248LQQ-BL583 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4248LQQ-BL583 meets industry standards.

7.What is the process for return or replacement of CY8C4248LQQ-BL583?

All CY8C4248LQQ-BL583 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4248LQQ-BL583, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4248LQQ-BL583 part is unused and in its original packaging.

Return procedure for CY8C4248LQQ-BL583:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C4248LQQ-BL583 Tags

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