Infineon Technologies CY8C4248LQQ-BL583T

Overview

CY8C4248LQQ-BL583T from Infineon is a 32-bit PSoC™ 4 programmable system-on-chip MCU integrating an Arm® Cortex®-M0 CPU, 256 KB flash, 32 KB SRAM, and a fully compliant Bluetooth® Low Energy 4.2 radio subsystem (BLESS) with –89 dBm RX sensitivity and +3 dBm TX output. It supports capacitive sensing (CSD), 12-bit SAR ADC (806 ksps), and segment LCD drive, targeting compact wireless sensor nodes and BLE-enabled human interface devices.

For engineers reviewing the CY8C4248LQQ-BL583T datasheet, CY8C4248LQQ-BL583T pinout, CY8C4248LQQ-BL583T application, or CY8C4248LQQ-BL583T equivalent, key selection criteria include integrated BLE PHY/link-layer coexistence, Deep-Sleep power (1.3 µA with WCO), programmable analog/digital routing, and 36 GPIOs with CAPSENSE™/LCD/analog/digital reconfiguration capability.

Technical Context

The device implements a dual-domain architecture: the Arm® Cortex®-M0 core executes firmware while the BLESS subsystem handles BLE protocol stack offload, including link-layer state machine, packet encryption, and RF timing synchronization. Its programmable analog blocks include two opamps supporting comparator mode and ADC input buffering, both operational in Deep-Sleep mode.

Digital flexibility is enabled by four TCPWM blocks (supporting center-aligned PWM and kill-signal triggering), two reconfigurable SCBs (I²C/SPI/UART), and hardware-accelerated CSD with SmartSense auto-tuning - all routed via Cypress's automatic digital/analog interconnect fabric without fixed signal paths.

Key Specifications

Pinout & Package

Package: 7 mm × 7 mm, 56-pin QFN (LQQ) with exposed thermal pad. Pin mapping validated per Infineon datasheet 002-23052 Rev. *B, Table 2 (Pin Assignments), pages 16–19.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar BLE-capable microcontroller applications.

Compared with nRF52833 and CC2642R, CY8C4248LQQ-BL583T uniquely integrates programmable analog (opamps, CSD, SAR ADC) and digital logic (TCPWM, SCB) alongside BLE - enabling full signal-chain-to-radio consolidation in one die without performance trade-offs in touch fidelity or low-power timing.

Availability

CY8C4248LQQ-BL583T is available at Aetrix Electronics and suitable for wireless human interface devices, BLE sensor nodes, smart home keypads, and portable medical monitors requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY8C4248LQQ-BL583T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure connectivity solutions, with global R&D centers and ISO/TS 16949-certified production.

CY8C4248LQQ-BL583T belongs to the PSoC™ 4 CY8C4xxx-BL family, designed specifically for highly integrated, low-power BLE edge devices where analog signal conditioning, capacitive touch, and radio coexistence must be resolved in silicon - not on PCB.

FAQ

Does CY8C4248LQQ-BL583T support over-the-air (OTA) firmware updates?

Yes. The device supports OTA DFU via BLE using the Infineon-provided Bootloader Component in PSoC™ Creator. It reserves dedicated flash sectors for dual-bank operation, enabling fail-safe updates with rollback capability. Application firmware must allocate ≥8 KB for bootloader code and define memory sections per AN97060 guidelines.

What is the maximum clock frequency of the internal main oscillator (IMO)?

The IMO is factory-trimmed to 48 MHz with ±2% accuracy across voltage and temperature. It can be divided down to 24 MHz for CPU operation, matching the maximum rated frequency of the Arm® Cortex®-M0 core. For BLE timing-critical functions, the IMO is phase-locked to the 32.768 kHz WCO to maintain radio timing accuracy.

Can all 36 GPIOs be used simultaneously for CAPSENSE™ electrodes?

No. While any GPIO supports CAPSENSE™, the CSD block has hardware limits: up to 32 electrodes with mutual-capacitance scanning or 64 with self-capacitance, constrained by scan time and SNR. Using all 36 pins as electrodes degrades SNR below usable levels; Infineon recommends ≤24 electrodes for production designs per AN85951.

Is an external crystal required for BLE operation?

Yes. BLE RF timing requires a 24 MHz crystal for the RF subsystem and a 32.768 kHz crystal for the WCO. The 24 MHz crystal connects to XTAL_IN/XTAL_OUT pins and must meet ±20 ppm stability; the WCO crystal connects to WCO_IN/WCO_OUT and enables Deep-Sleep timing. Both are mandatory per Bluetooth® 4.2 PHY specifications.