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Infineon Technologies CY8C4745FNI-S412T

Part No.:
CY8C4745FNI-S412T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
25-XFBGA, WLCSP
Datasheet:
AetrixCY8C4745FNI-S412T.pdf
Description:
IC MCU 32BIT 32KB FLASH 25WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,474

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Product details

Overview

CY8C4745FNI-S412T from Infineon Technologies (formerly Cypress) is a programmable 32-bit Arm Cortex-M0+ microcontroller with integrated MagSense™ inductive sensing and CapSense® capacitive sensing. It features 48 MHz CPU, 32 KB flash, 4 KB SRAM, up to 16 inductive sensors, and dual reconfigurable SCBs supporting I²C/SPI/UART. It targets metal/non-metal proximity detection in industrial HMI and smart appliance control.

For engineers reviewing the CY8C4745FNI-S412T datasheet, CY8C4745FNI-S412T pinout, CY8C4745FNI-S412T application, or CY8C4745FNI-S412T equivalent, key selection criteria include MagSense noise immunity (<190 nm metal deflection detection), CapSense Sigma-Delta SNR (>5:1), Deep Sleep current (2.5 µA), TCPWM kill-signal triggering for motor safety, and 1.71–5.5 V wide-voltage operation.

Technical Context

The device integrates a single-layer AHB interconnect linking the Cortex-M0+ core, flash accelerator, and SRAM controller with dedicated analog/digital routing matrices. Its clock system combines IMO (24–48 MHz, ±2%), ILO (40 kHz), and WCO (32 kHz) with eight dividers-including two fractional-enabling precise peripheral clocking and sub-35 µs Deep Sleep wake-up.

Analog subsystem includes one 10-bit single-slope ADC, two low-power comparators active in Deep Sleep, and two current DACs referenced to ±5% internal 1.2 V. Digital resources comprise five 16-bit TCPWM blocks with center-aligned/edge/pseudo-random modes and two SmartIO ports enabling Boolean logic on GPIOs without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M0+, 48 MHz max - enables real-time sensor fusion and deterministic interrupt response in resource-constrained embedded systems.
Flash / SRAM32 KB flash with Read Accelerator / 4 KB zero-wait-state SRAM - supports firmware updates and local data buffering without performance penalty at full speed.
Inductive SensingUp to 16 MagSense channels - detects sub-190 nm metal deflection with factory-calibrated noise immunity, eliminating external coils or shielding in proximity switches.
Capacitive SensingCapSense Sigma-Delta (CSD) with >5:1 SNR and water tolerance - enables reliable touch buttons and sliders in wet or contaminated environments.
Low-Power ModesDeep Sleep current = 2.5 µA with operational analog - sustains continuous metal/non-metal monitoring while extending battery life in portable devices.
CommunicationTwo reconfigurable SCBs - each dynamically switchable between I²C, SPI, or UART, reducing BOM count and PCB footprint in multi-interface designs.
GPIO Flexibility36 pins, any configurable as CapSense/MagSense/analog/digital - eliminates fixed-function pin constraints and simplifies layout for mixed-sensing applications.

Pinout & Package

Package: 48-pin TQFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture-sensitive level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDPrimary power supply inputAccepts 1.71–5.5 V; powers digital core, analog blocks, and I/O; requires local 100 nF decoupling.
VSSGround referenceDigital and analog common return; must be connected to low-impedance ground plane for MagSense/CapSense integrity.
XRESExternal reset inputActive-low asynchronous reset with internal pull-up; asserts hardware reset on falling edge, latching cause in Reset Cause register.
SWDIO / SWCLKDebug interface signalsTwo-wire Serial Wire Debug (SWD) for programming and real-time debugging; no JTAG TAP required.
P0[0]–P0[7]Programmable GPIO bankSupports MagSense coil drive, CapSense electrodes, analog inputs, or digital I/O; slew rate and drive strength configurable per pin.
SCB0_SDA / SCL / MOSI / MISO / TX / RXMulti-function serial interface pinsShared physical terminals for I²C/SPI/UART; function selected at runtime via PSoC Creator configuration, not hardware strapping.

Key Features

FeatureDesign Value
MagSense automatic calibrationSoftware component compensates for PCB trace variation and temperature drift, enabling production-ready inductive sensing without manual tuning.
SmartSense™ auto-tuningHardware-accelerated CapSense baseline tracking and threshold adjustment eliminates manual sensitivity calibration across humidity and contamination gradients.
TCPWM kill-signal triggeringComparator output directly gates PWM outputs within one clock cycle - meets functional safety requirements for motor overcurrent or thermal shutdown.
Deep Sleep analog retentionLow-power comparators and IDACs remain active during Deep Sleep, allowing continuous sensor polling without waking CPU - reduces average system power by >90%.
Programmable I/O matrixAny GPIO can route to any analog or digital peripheral block via hardware interconnect - avoids fixed signal routing limitations of traditional MCUs.

Applications

Industrial HMI PanelsSmart Appliance Controls

Use Scenario: Touchless metal proximity detection on control panels in dusty or oily factory environments.

IC Role / Device Role / Timing Role: MagSense performs real-time metal object detection; CapSense handles adjacent non-metal touch zones; TCPWM drives status LEDs with dimming.

Use Value: Eliminates mechanical button wear and ingress protection complexity while maintaining <190 nm detection resolution under contamination.

Use Scenario: Water-resistant touch interface on washing machine door controls exposed to splashes and detergent residue.

IC Role / Device Role / Timing Role: CapSense CSD provides >5:1 SNR and water rejection; IDACs bias sensing electrodes; SCBs communicate status to main MCU via I²C.

Use Value: Maintains reliable actuation through conductive films and surface moisture without recalibration or false triggers.

Automotive Interior SensorsMedical Device Interfaces

Use Scenario: Glove-compatible proximity activation of seat/mirror controls in vehicles with varying cabin temperatures.

IC Role / Device Role / Timing Role: MagSense detects hand presence near metal trim; WCO-driven timers maintain accurate sleep/wake cycles; comparators monitor battery voltage.

Use Value: Achieves consistent 35 µs wake-up latency and ±2% IMO accuracy across –40°C to +105°C ambient range.

Use Scenario: Sterilizable touchless interface on infusion pump housings requiring ESD-safe, glove-operable controls.

IC Role / Device Role / Timing Role: Dual-sensing mode toggles between MagSense (metal probe detection) and CapSense (plastic housing touch); SRAM retains calibration data during power cycling.

Use Value: Supports IP65-rated enclosures with no exposed conductive traces and maintains FDA-compliant calibration stability over 10,000 sterilization cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable mixed-signal MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY8C4745FNI-S411TSame die, 24 MHz max CPU clock (vs. 48 MHz); reduced flash read accelerator bandwidthSuitable for lower-throughput sensor polling where timing-critical PWM or high-speed communication is not requiredSelect when cost sensitivity outweighs need for full 48 MHz performance or high-bandwidth flash access
STM32G071KBT6No integrated MagSense or CapSense; requires external ICs or RC networks for proximity/touch; higher active current (80 µA/MHz)Applicable where only basic capacitive touch is needed and inductive sensing is omittedChoose only if design already uses STM32 toolchain and external sensing components are acceptable for BOM and layout complexity

Compared with CY8C4745FNI-S412T, the S411T variant trades clock speed for cost in static-sensing applications, while the STM32G071 requires added components and firmware overhead to replicate MagSense/CapSense integration - increasing total system size, power, and validation effort.

Availability

CY8C4745FNI-S412T is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance controls, automotive interior sensors, and medical device interfaces requiring stable component supply, long-term lifecycle support, and qualified reflow profiles.

Supply support for CY8C4745FNI-S412T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the PSoC portfolio, delivering high-reliability semiconductor solutions for automotive, industrial, and IoT markets.

The PSoC 4700S product line was designed specifically to unify inductive and capacitive sensing in a single low-power MCU, targeting next-generation human-machine interfaces where metal and non-metal interaction must coexist reliably in harsh environments.

FAQ

What development tools are required to program CY8C4745FNI-S412T?

PSoC Creator IDE (free Windows-based tool) is mandatory for schematic-based hardware configuration and component API generation. Programming uses standard SWD interface via MiniProg3 or KitProg2 debug probes. ARM GCC toolchain integration is supported, but PSoC Creator-generated startup code and peripheral drivers are required for MagSense/CapSense functionality.

Does CY8C4745FNI-S412T support hardware encryption or secure boot?

No. This device lacks dedicated cryptographic accelerators, TRNG, or secure boot ROM. It does not support AES, SHA, or public-key operations in hardware. Secure firmware updates require external secure element or software-only implementations with verified checksums and signature checking in application code.

Can all 36 GPIOs be used simultaneously for MagSense sensing?

No. Only up to 16 GPIOs can be assigned to MagSense channels due to internal routing and oscillator resource limits. The remaining pins support CapSense, analog, or digital functions. Pin assignment is constrained by port grouping (e.g., P0[0]–P0[7]) and shared analog mux resources per bank.

Is the 2.5 µA Deep Sleep current measured with MagSense active?

Yes. The 2.5 µA specification includes active MagSense comparators and IDACs operating in Deep Sleep mode, with CPU, flash, and SRAM powered down. This value is measured per datasheet conditions (VDD = 3.3 V, T = 25°C) using the internal ILO clock and excludes external circuit leakage.

CY8C4745FNI-S412T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
25-XFBGA, WLCSP
Series:
PSOC™ 4 CY8C4700S
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C4745FNI-S412T FAQ

1.How can I place an order for CY8C4745FNI-S412T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C4745FNI-S412T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C4745FNI-S412T reliable?

The price and inventory of CY8C4745FNI-S412T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C4745FNI-S412T is usually 5 days.

3.What payment methods are accepted for CY8C4745FNI-S412T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C4745FNI-S412T transactions.

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CY8C4745FNI-S412T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C4745FNI-S412T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C4745FNI-S412T?

For technical support, including CY8C4745FNI-S412T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C4745FNI-S412T requirements.

6.How does Aetrix verify that CY8C4745FNI-S412T is sourced from the original manufacturer or authorized distributors?

All CY8C4745FNI-S412T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C4745FNI-S412T meets industry standards.

7.What is the process for return or replacement of CY8C4745FNI-S412T?

All CY8C4745FNI-S412T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C4745FNI-S412T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C4745FNI-S412T part is unused and in its original packaging.

Return procedure for CY8C4745FNI-S412T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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