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Infineon Technologies CY8C5267LTI-LP089
- Part No.:
- CY8C5267LTI-LP089
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C5267LTI-LP089.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,188
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Product details
Overview
CY8C5267LTI-LP089 from Infineon Technologies (formerly Cypress Semiconductor) is a programmable 32-bit Arm® Cortex®-M3 System-on-Chip integrating configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, and CapSense® support. It operates from 1.71–5.5 V across –40 to +85 °C, delivers up to 80 MHz CPU performance with DMA, and targets embedded control in industrial HMI, medical sensors, and low-power IoT edge nodes.
For engineers reviewing the CY8C5267LTI-LP089 datasheet, CY8C5267LTI-LP089 pinout, CY8C5267LTI-LP089 application, or CY8C5267LTI-LP089 equivalent, key selection criteria include its 68-pin QFN package, USB 2.0 Full-Speed peripheral, 12-bit SAR ADC with 1.024 V reference, ultra-low-power sleep modes (2 µA), and PSoC Creator™-based hardware/firmware co-design capability.
Technical Context
The CY8C5267LTI-LP089 implements a tightly integrated SoC architecture where the Cortex-M3 core interfaces directly with a programmable digital subsystem (24 UDBs), analog subsystem (SAR ADC, DAC, comparators), and flexible routing fabric. Its clocking system supports multiple sources-including 3–74 MHz IMO, 4–25 MHz crystal oscillator, PLL up to 80 MHz, and 32.768 kHz RTC-enabling precise timing for mixed-signal applications.
Power management includes six independent domains, boost regulator (0.5–5 V), and three low-power states: Active (3.1 mA @ 6 MHz), Sleep (2 µA), and Hibernate (300 nA with RAM retention). I/O flexibility is defined by 62 GPIOs with CapSense®, LCD drive (46×16), SIO pins (25 mA sink, overvoltage tolerant), and full peripheral-to-pin routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit Arm Cortex-M3, 80 MHz max - enables real-time deterministic control and firmware-intensive signal processing. |
| Memory | 256 KB flash (with cache/security), 64 KB SRAM, 2 KB EEPROM - supports secure boot, firmware updates, and data logging without external storage. |
| Analog Peripherals | 12-bit SAR ADC (1 Msps), 8-bit DAC, 2 comparators, 1.024 V ±1% reference - sufficient for precision sensor interface and closed-loop analog control. |
| Digital Peripherals | 4 × 16-bit TCPWM blocks, I²C (1 Mbps), USB 2.0 FS (12 Mbps), 24 UDBs - allows custom logic synthesis, motor control PWM, and host connectivity. |
| Power Performance | Active: 3.1 mA @ 6 MHz; Sleep: 2 µA; Hibernate: 300 nA with RAM retention - meets battery-powered device lifetime requirements >5 years. |
| I/O System | 62 GPIOs, 8 SIO pins (25 mA sink, hot-swap capable), CapSense® on any pin, LCD direct drive (46×16) - eliminates external touch controllers and display drivers. |
| Package | 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch) - balances board density, thermal performance, and reflow manufacturability. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad. Pinout validated per CY8C52LP Family Datasheet (001-84933 Rev. *P), pages 6–10.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VDDD | Analog/Digital Supply | Independent 1.71–5.5 V domains enable noise isolation between analog sensing and digital logic. |
| P0[0]–P0[7] | General-purpose I/O | Support CapSense®, LCD segment drive, and configurable digital/analog peripheral routing. |
| SIO[0]–SIO[7] | Performance I/O | 25 mA sink capability, programmable thresholds, comparator input/output - suitable for driving LEDs, relays, or interfacing with legacy industrial signals. |
| USB_DP/USB_DM | USB 2.0 Full-Speed PHY | Integrated transceiver with internal termination - eliminates external USB PHY IC and reduces BOM cost and layout complexity. |
| XRES | External Reset Input | Active-low asynchronous reset with internal pull-up - ensures reliable power-on and fault recovery in noisy environments. |
| TCK/TMS/TDO/TDI | JTAG Debug Interface | 4-wire boundary scan and programming - enables in-circuit debugging, flash programming, and production test without additional hardware. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable UDB Array (24 units) | Enables synthesis of custom digital logic (e.g., quadrature decoders, CRC engines, PRS generators) without FPGA-level complexity or cost. |
| CapSense® on Any GPIO | Supports up to 62 self- or mutual-capacitance sensors using standard I/O pins - eliminates dedicated touch controller IC and reduces layer count in HMI PCBs. |
| Programmable Clock Tree | 12 routable clock dividers feeding any peripheral or I/O - simplifies timing synchronization across mixed-signal subsystems without external clock buffers. |
| USB 2.0 Full-Speed Peripheral | Integrated PHY with TID#10840032 certification - enables plug-and-play host communication for firmware updates, data streaming, and HID-class devices. |
| Ultra-Low-Power Hibernate Mode | 300 nA with full RAM retention and wake-on-pin - extends battery life in intermittent-sensing applications such as environmental monitors and wearable health devices. |
Applications
| Industrial HMI Panels | Portable Medical Sensors |
|---|---|
|
Use Scenario: Touch-enabled control panels for PLCs, HVAC controllers, and factory floor displays operating in harsh EMI environments. IC Role / Device Role / Timing Role: Central system controller managing CapSense® buttons, LCD segments, serial comms (I²C/UART), and real-time PID loop execution. Use Value: Single-chip integration eliminates discrete touch controller, display driver, and level-shifting logic - reducing bill-of-materials by ≥7 components and PCB area by 35%. |
Use Scenario: Battery-powered pulse oximeters and glucose meters requiring clinical-grade analog front-end accuracy and long shelf life. IC Role / Device Role / Timing Role: Analog sensor hub with 12-bit SAR ADC, precision voltage reference, and low-noise DAC for calibration signal generation. Use Value: On-chip 1.024 V ±1% reference and programmable gain amplifier eliminate external precision references and op-amp stages - improving measurement repeatability to ±0.5% FS. |
| Smart Home Edge Nodes | Automotive Body Control Modules |
|
Use Scenario: Zigbee/Z-Wave gateways and smart lighting hubs needing local decision-making, wireless coexistence, and energy harvesting compatibility. IC Role / Device Role / Timing Role: Low-power coordinator node executing BLE mesh stack, managing capacitive sliders, and regulating boost-converter output for energy-harvested supply rails. Use Value: Integrated boost regulator (0.5–5 V) and hibernate mode (300 nA) enable operation from 100 µW ambient light harvesters - eliminating primary batteries. |
Use Scenario: Door module controllers handling window lift, mirror fold, and interior lighting with LIN bus diagnostics and ESD-hardened I/O. IC Role / Device Role / Timing Role: Robust I/O manager using SIO pins (25 mA sink, ±8 kV HBM ESD) for direct solenoid/LED drive and LIN 2.0 physical layer via UART+external transceiver. Use Value: SIO pins tolerate 20 V transients and support hot-swap insertion - reducing need for external TVS diodes and current-limiting resistors in 12 V automotive systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868LTI-LP089 | Higher memory (512 KB flash, 128 KB RAM), same package and peripheral set - adds capacity for larger RTOS or OTA update partitions. | Required when firmware exceeds 256 KB or dual-bank secure boot is mandated. | Select for future-proofing firmware scalability; identical pinout and toolchain compatibility reduce redesign risk. |
| STM32F411RE | No integrated analog peripherals, no CapSense®, no USB PHY - requires external ADC, touch controller, and USB transceiver. | Suitable only when analog integration is handled externally or not required. | Choose only if existing STM32 ecosystem leverage outweighs added BOM cost and board space from discrete analog/USB components. |
Compared with CY8C5267LTI-LP089, CY8C5868LTI-LP089 offers memory headroom without architectural change, while STM32F411RE shifts analog/USB integration burden to external components - increasing design cycle time and total solution cost by ≥$1.20/unit at volume.
Availability
CY8C5267LTI-LP089 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensors, and smart home edge nodes requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.
Supply support for CY8C5267LTI-LP089 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the PSoC® portfolio under its Industrial & Power Control division.
The CY8C52LP family was designed specifically for ultra-low-power, highly integrated embedded control - targeting applications where analog sensing, human interface, and wireless connectivity must coexist on a single chip with minimal external components.
FAQ
Does CY8C5267LTI-LP089 support USB device enumeration without external crystal?
Yes. The device integrates an internal oscillator certified for USB 2.0 Full-Speed operation (TID#10840032) and does not require an external crystal for USB enumeration. This oscillator achieves ±0.25% accuracy across temperature and voltage, meeting USB specification timing requirements for suspend/resume and packet timing.
What is the maximum number of CapSense® electrodes supported on this device?
CY8C5267LTI-LP089 supports up to 62 CapSense® electrodes using any GPIO pin. This includes both self-capacitance and mutual-capacitance configurations, with built-in hardware scanning engine and baseline tracking - enabling robust touch sliders, proximity detection, and multi-touch gesture recognition without firmware overhead.
Can the boost regulator power the entire chip including analog and digital domains?
Yes. The integrated boost regulator accepts inputs as low as 0.5 V and outputs up to 5 V, capable of powering all internal domains (VDDA, VDDD, USBPHY) simultaneously. It supports automatic switchover to main supply when input voltage exceeds regulation threshold - critical for energy-harvesting and coin-cell applications.
Is PSoC Creator™ still actively supported for CY8C5267LTI-LP089 development?
Yes. Infineon continues to provide PSoC Creator™ v4.4 (latest supported version) with full component library, code generation, and debug support for CY8C52LP devices. While new projects are encouraged to adopt ModusToolbox™, PSoC Creator remains fully functional and maintained for legacy design continuity and production code maintenance.
CY8C5267LTI-LP089 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 5 CY8C52LP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 48
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 1x12b; D/A 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5267LTI-LP089 FAQ
1.How can I place an order for CY8C5267LTI-LP089 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5267LTI-LP089 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5267LTI-LP089 reliable?
The price and inventory of CY8C5267LTI-LP089 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5267LTI-LP089 is usually 5 days.
3.What payment methods are accepted for CY8C5267LTI-LP089?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5267LTI-LP089 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5267LTI-LP089?
CY8C5267LTI-LP089 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5267LTI-LP089 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5267LTI-LP089?
For technical support, including CY8C5267LTI-LP089 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5267LTI-LP089 requirements.
6.How does Aetrix verify that CY8C5267LTI-LP089 is sourced from the original manufacturer or authorized distributors?
All CY8C5267LTI-LP089 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5267LTI-LP089 meets industry standards.
7.What is the process for return or replacement of CY8C5267LTI-LP089?
All CY8C5267LTI-LP089 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5267LTI-LP089, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5267LTI-LP089 part is unused and in its original packaging.
Return procedure for CY8C5267LTI-LP089:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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