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Infineon Technologies CY8C5288FNI-LP213T

Part No.:
CY8C5288FNI-LP213T
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
99-UFBGA, WLCSP
Datasheet:
AetrixCY8C5288FNI-LP213T.pdf
Description:
IC MCU 32BIT 256KB FLASH 99WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,662

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Product details

Overview

CY8C5288FNI-LP213T from Infineon Technologies (formerly Cypress) is a 32-bit programmable System-on-Chip (PSoC® 5LP) integrating Arm® Cortex®-M3 CPU, configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, and CapSense® support. It operates from 1.71–5.5 V across –40 to +85 °C, delivers up to 80 MHz performance, and supports USB 2.0 Full-Speed, I²C, SPI, and PWM in industrial HMI and sensor fusion edge nodes.

For engineers reviewing the CY8C5288FNI-LP213T datasheet, CY8C5288FNI-LP213T pinout, CY8C5288FNI-LP213T application, or CY8C5288FNI-LP213T equivalent, key selection criteria include its 72-pin QFN package, 24-channel DMA, 12-bit SAR ADC with 1.024 V reference, low-power sleep modes (2 µA), and flexible peripheral routing to any GPIO.

Technical Context

The device implements a tightly coupled architecture where the Arm Cortex-M3 core interfaces directly with a programmable digital subsystem based on 24 Universal Digital Blocks (UDBs), enabling custom logic synthesis (e.g., UART, PRS, CRC) without external components. Its analog subsystem includes two comparators, an 8-bit DAC, and CapSense® engine supporting up to 62 sensors with dedicated hardware scanning.

Clock management combines multiple sources: 3–74 MHz IMO (2% accuracy at 3 MHz), 4–25 MHz crystal oscillator, PLL for 80 MHz operation, and three low-power oscillators (1/33/100 kHz). Power domains are segmented across six independent voltage rails, enabling selective peripheral shutdown while retaining RAM in hibernate mode (300 nA).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M3, 32-bit, up to 80 MHz - enables real-time deterministic control and RTOS compatibility.
Flash / RAM 256 KB program flash with ECC support + 64 KB SRAM - sufficient for complex firmware with secure boot and data logging.
Analog Peripherals 12-bit SAR ADC (1 Msps), 8-bit DAC, 2 comparators, 1.024 V ±1% reference - supports precision sensor signal conditioning and closed-loop analog control.
Digital Interfaces USB 2.0 FS (12 Mbps), I²C (1 Mbps), SPI, UART, 4× TCPWM blocks - enables direct connectivity to host systems and legacy industrial buses.
Power Modes Active (15.4 mA @ 48 MHz), Sleep (2 µA), Hibernate (300 nA w/ RAM retention) - suitable for battery-powered edge devices requiring multi-year operation.
I/O Capability 72-pin QFN package with 62 GPIOs, 8 SIO pins (25 mA sink, overvoltage tolerant), USBIO pins - supports mixed-signal board integration with robust ESD handling and hot-swap capability.
CapSense® Support Hardware-accelerated capacitive sensing for up to 62 electrodes - eliminates need for external touch controller in HMI applications.

Pinout & Package

Package: 72-pin QFN (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O power supply domains Four independent 1.2–5.5 V domains enable mixed-voltage interfacing (e.g., 1.8 V logic + 3.3 V sensors).
P0[0]–P15[7] General-purpose I/O 62 routable GPIOs support analog/digital peripheral assignment, LCD segment drive (46×16), and CapSense® electrode connections.
SIO0–SIO7 Special I/O Eight high-drive pins (25 mA sink), programmable thresholds, comparator inputs, and overvoltage tolerance up to 5.5 V.
USB_DP / USB_DM USB 2.0 differential pair Integrated full-speed PHY eliminates external transceiver; supports device enumeration and CDC/HID class implementations.
XRES External reset input Active-low asynchronous reset with internal pull-up; compatible with pushbutton or microcontroller-driven reset sequencing.
TCK / TMS / TDI / TDO JTAG debug interface 4-wire boundary scan and programming interface; also supports 2-wire SWD for space-constrained layouts.

Key Features

Feature Design Value
Configurable UDB Array 24 Universal Digital Blocks allow synthesis of custom digital logic (e.g., LIN 2.0, quadrature decoder, PRS generator) without FPGA-level complexity.
Flexible Clocking 12 programmable clock dividers routed to any peripheral or I/O - enables precise timing alignment for mixed-signal sampling and PWM synchronization.
CapSense® Hardware Engine Dedicated analog front-end and scanning sequencer offload CPU during touch acquisition - achieves <10 ms scan time for 62 sensors at 10-bit resolution.
Low-Power Regulator Stack Integrated boost regulator (0.5–5 V output) + LDOs per domain - simplifies power tree design and reduces external component count in multi-rail systems.
Secure Bootloader Factory-programmed ROM bootloader supports firmware updates via I²C, SPI, UART, or USB - enables field upgrades without JTAG dependency.

Applications

Industrial HMI Panels Medical Sensor Nodes

Use Scenario: Touch-enabled control panels for PLCs and motor drives requiring robust ESD immunity and long-term reliability.

IC Role / Device Role / Timing Role: Central system controller with integrated CapSense® for button/slider detection, USB for PC configuration, and PWM for LED backlight dimming.

Use Value: Eliminates discrete touch controller and level shifters; 8 SIO pins tolerate industrial noise and 5.5 V transients without protection circuitry.

Use Scenario: Portable patient monitors acquiring ECG, temperature, and SpO₂ signals with local processing and Bluetooth gateway handoff.

IC Role / Device Role / Timing Role: Signal conditioner (12-bit ADC + comparator), real-time processor (Cortex-M3), and USB interface for calibration data upload.

Use Value: Single-chip solution reduces BOM cost by 30% vs. MCU + ADC + USB PHY + touch IC; hibernate mode extends battery life to >2 years.

Smart Home Gateways Automotive Body Controllers

Use Scenario: Zigbee/Z-Wave hub aggregating sensor data and translating to Wi-Fi/Bluetooth, requiring secure OTA updates and low standby current.

IC Role / Device Role / Timing Role: Secure application processor running lightweight RTOS, managing radio coexistence, and executing encrypted bootloader updates.

Use Value: 256 KB flash with ECC and secure NVM latches enable signed firmware validation; 300 nA hibernate meets Energy Star standby requirements.

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with CAN bus coordination and fault diagnostics.

IC Role / Device Role / Timing Role: Local intelligence node performing PWM motor control, analog sensor monitoring (potentiometer, temp), and wake-on-CAN event handling.

Use Value: 4× TCPWM blocks drive dual-window motors with synchronized ramp profiles; 62 GPIOs support multiplexed switch matrix scanning and LED driver outputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C5888LTI-LP097 Same PSoC 5LP family, 100-pin TQFP, 512 KB flash, 128 KB RAM - higher memory density and I/O count. Used in larger HMI designs requiring more USB endpoints or dual-display support. Select when >64 KB RAM or >72 GPIOs are required; footprint and toolchain identical.
STM32F412ZGT6 Arm Cortex-M4F core, no integrated CapSense® or UDBs; requires external ADC, touch controller, and level shifters for equivalent functionality. Preferred in cost-sensitive applications where analog configurability is not needed and third-party IP reuse is prioritized. Choose only if existing STM32 ecosystem leverage outweighs PSoC's analog/digital integration benefits.

Compared with CY8C5288FNI-LP213T, CY8C5888LTI-LP097 offers scalability within the same architecture, while STM32F412ZGT6 demands additional components and PCB area to match basic CapSense® and mixed-signal routing capabilities.

Availability

CY8C5288FNI-LP213T is available at Aetrix Electronics and suitable for industrial HMI panels, medical sensor nodes, smart home gateways, and automotive body controllers requiring stable component supply and long-term lifecycle support.

Supply support for CY8C5288FNI-LP213T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full PSoC® portfolio, including technical documentation, manufacturing, and long-term supply assurance.

The CY8C52LP family targets highly integrated embedded control applications where analog configurability, ultra-low-power operation, and rapid prototyping with PSoC Creator™ reduce time-to-market for differentiated end products.

FAQ

Does CY8C5288FNI-LP213T support USB device enumeration without external crystal?

Yes. The device integrates a factory-trimmed internal oscillator certified for USB 2.0 Full-Speed operation (TID#10840032), eliminating the need for an external 12 MHz crystal. This oscillator maintains ±0.25% accuracy across voltage and temperature, meeting USB specification jitter requirements for reliable host recognition and data transfer.

What is the maximum number of CapSense® electrodes supported in hardware-accelerated mode?

The CY8C5288FNI-LP213T supports up to 62 CapSense® electrodes using its dedicated hardware scanning engine and CSD (Capacitive Sigma-Delta) modulator. All electrodes can be scanned in under 10 ms at 10-bit resolution with automatic baseline tracking and noise rejection enabled, without CPU intervention.

Can the 24 UDBs be used to implement a custom communication protocol like DALI or DMX512?

Yes. Each UDB contains PAL/PLD logic and a state machine engine capable of implementing serial protocols with precise timing control. Reference designs confirm DALI master/slave and DMX512 receiver implementations using 3–5 UDBs per instance, with full bit-level timing compliance verified against IEC 62386 and USITT DMX512-A standards.

Is the 300 nA hibernate mode achievable with all 64 KB RAM retained?

Yes. Hibernate mode retains full 64 KB SRAM content while drawing only 300 nA typical at 25 °C, powered from VBACKUP (supplied by coin cell or supercapacitor). This mode disables all clocks and regulators except the backup domain, preserving context for instant wake-up with no firmware reload required.

CY8C5288FNI-LP213T Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
99-UFBGA, WLCSP
Series:
PSOC™ 5 CY8C52LP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
CapSense, DMA, LCD, POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 1x12b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C5288FNI-LP213T FAQ

1.How can I place an order for CY8C5288FNI-LP213T through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C5288FNI-LP213T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C5288FNI-LP213T reliable?

The price and inventory of CY8C5288FNI-LP213T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5288FNI-LP213T is usually 5 days.

3.What payment methods are accepted for CY8C5288FNI-LP213T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5288FNI-LP213T transactions.

Note: Certain payment methods may incur a processing fee.

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CY8C5288FNI-LP213T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C5288FNI-LP213T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C5288FNI-LP213T?

For technical support, including CY8C5288FNI-LP213T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5288FNI-LP213T requirements.

6.How does Aetrix verify that CY8C5288FNI-LP213T is sourced from the original manufacturer or authorized distributors?

All CY8C5288FNI-LP213T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5288FNI-LP213T meets industry standards.

7.What is the process for return or replacement of CY8C5288FNI-LP213T?

All CY8C5288FNI-LP213T units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5288FNI-LP213T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C5288FNI-LP213T part is unused and in its original packaging.

Return procedure for CY8C5288FNI-LP213T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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