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Infineon Technologies CY8C5367LTI-003

Part No.:
CY8C5367LTI-003
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
68-VFQFN Exposed Pad
Datasheet:
AetrixCY8C5367LTI-003.pdf
Description:
IC MCU 32BIT 128KB FLASH 68QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,162

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Product details

Overview

CY8C5367LTI-003 from Infineon Technologies (acquired Cypress Semiconductor) is a 32-bit programmable system-on-chip (PSoC® 5) integrating ARM Cortex-M3 MCU, configurable analog/digital peripherals, 256 KB Flash, 64 KB SRAM, and USB 2.0 interface in a 68-pin QFN package. It delivers 12-bit SAR ADC at 700 ksps, dual 8-bit DACs up to 5.5 Msps, four comparators with 95-ns response, and supports CapSense® on GPIOs for touch interface design in industrial HMI systems.

For engineers reviewing the CY8C5367LTI-003 datasheet, CY8C5367LTI-003 pinout, CY8C5367LTI-003 application, or CY8C5367LTI-003 equivalent, key selection criteria include its 67 MHz CPU clock, 2.7–5.5 V operating range, 2-µA sleep mode, 24-channel DMA, and full-speed USB 2.0 capability with external 24 MHz crystal - critical for embedded control with mixed-signal acquisition and firmware-upgradable I/O routing.

Technical Context

The device implements a hierarchical architecture centered on an ARM Cortex-M3 core with tightly coupled NVIC, cache, and PHUB-based DMA controller enabling zero-CPU-load peripheral data transfers. Its digital subsystem uses 24 universal digital blocks (UDBs) with PLD+state machine logic, routed via Digital System Interconnect (DSI) to any GPIO, supporting reconfigurable peripherals including UART, SPI, I²C, LIN, PRS, and CRC.

Analog functionality is built around a 1.024 V ±1% internal reference, enabling high-accuracy signal conditioning: SAR ADC with <±1 LSB INL/DNL, two opamps (10 mA drive), four fast comparators, and two SC/CT blocks configurable as PGA, TIA, or mixer - all accessible through a shared analog bus connected to up to 62 GPIO pins.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M3, 67 MHz max - enables real-time deterministic control with low-latency interrupt handling (tail-chaining, <12-cycle wake).
Memory256 KB Flash (100k write cycles, 20-yr retention), 64 KB SRAM, 2 KB EEPROM - supports secure firmware updates and nonvolatile parameter storage.
ADC12-bit SAR, 700 ksps, <±1 LSB INL - suitable for precision sensor readout (e.g., thermocouple, pressure transducer) without external signal conditioning.
DACDual 8-bit IDAC/VDAC, 5.5 Msps current output or 1 Msps voltage output - enables closed-loop analog actuator control (e.g., LED dimming, bias tuning).
Power Modes2 µA sleep, 300 nA hibernate with RAM retention - extends battery life in portable instrumentation and wireless sensor nodes.
USB InterfaceFull-Speed USB 2.0 (12 Mbps), requires 24 MHz external crystal - provides direct PC connectivity for configuration, data logging, and firmware download.
I/O Flexibility60 GPIO + 8 SIO + 2 USBIO, any GPIO routable to any analog/digital peripheral - eliminates board-level signal rework during firmware-driven feature iteration.

Pinout & Package

Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EPAD), RoHS-compliant, industrial temperature grade (–40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDDPower supply inputsVDDA (2.7–5.5 V) powers analog subsystem; VDDD powers digital core; separate domains enable noise isolation and flexible rail sequencing.
P0[0]–P15[7]Configurable GPIO/SIOAll support CapSense®, analog mux input/output, digital routing, and Schmitt-trigger inputs; SIO pins tolerate 5.5 V and sink 25 mA.
XTAL_IN/XTAL_OUTCrystal oscillator terminalsSupport 4–25 MHz crystal for precise timing; required for USB 2.0 compliance and accurate RTC operation.
USB_DP/USB_DMUSB 2.0 differential pairIntegrated PHY with internal termination; requires no external resistors - reduces BOM count and layout complexity.
SWD_CLK/SWD_IOSerial Wire Debug interfaceTwo-pin debug port supporting programming, breakpoints, trace (SWV), and printf-style debugging - enables field firmware updates and diagnostics.

Key Features

FeatureDesign Value
Reconfigurable UDB array (24 blocks)Enables hardware-level customization of digital logic (e.g., custom PWM sequencers, protocol engines) without FPGA cost or complexity.
CapSense® on all GPIOEliminates dedicated touch controller IC; supports slider, proximity, and multi-touch buttons with <50 µA active current per sensor.
Programmable analog blocks (SC/CT)Allows runtime reconfiguration of opamp circuits (e.g., switch from PGA to TIA) - ideal for multi-sensor platforms with shared analog front-end.
Multi-domain I/O voltage (1.2–5.5 V)Four independent I/O voltage domains simplify interfacing with legacy 3.3 V, 5 V, or low-voltage logic without level shifters.
Bootloader over USB/I²C/SPI/UARTEnables field firmware upgrades via standard interfaces - critical for medical devices requiring post-deployment certification updates.

Applications

Industrial HMI PanelPortable Medical Sensor Hub

Use Scenario: Touch-enabled control panel for PLC interface with LCD display and analog sensor monitoring.

IC Role / Device Role / Timing Role: Central PSoC managing CapSense buttons, driving 46×16 LCD segments directly, acquiring 12-bit temperature/pressure readings, and communicating via USB to host PC.

Use Value: Single-chip integration replaces MCU + touch controller + LCD driver + ADC - reducing PCB area by 40% and BOM cost by $2.10/unit.

Use Scenario: Battery-powered wearable device measuring ECG, SpO₂, and skin temperature with local processing and USB data export.

IC Role / Device Role / Timing Role: Low-power signal acquisition hub using SAR ADC and opamps for analog front-end, hibernate mode between measurements, and USB bulk transfer for clinical data upload.

Use Value: 300 nA hibernate with RAM retention preserves calibration state across weeks of standby - eliminating recalibration on power-up.

Automated Test Equipment (ATE) ModuleSmart Building Environmental Controller

Use Scenario: Modular ATE channel card generating precise analog stimulus and capturing response waveforms.

IC Role / Device Role / Timing Role: Dual 8-bit DACs generate calibrated test signals (e.g., 0–5 V ramp); SAR ADC captures DUT output at 700 ksps; UDBs implement pattern generator logic.

Use Value: On-chip DAC/ADC matching (<0.1% gain error) ensures measurement repeatability without external trimming components.

Use Scenario: DIN-rail mounted HVAC controller with CO₂, humidity, and occupancy sensing plus relay actuation.

IC Role / Device Role / Timing Role: Analog subsystem conditions sensor outputs; GPIOs drive relays and read switches; I²C manages external environmental sensors; USB enables commissioning via laptop.

Use Value: 24-channel DMA offloads sensor polling to hardware - freeing Cortex-M3 for PID loop execution at 10 kHz without jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F303VCT6ARM Cortex-M4F core, 72 MHz, 256 KB Flash, but lacks integrated CapSense, programmable analog blocks, and USB PHY - requires external touch controller and opamp circuitry.Better floating-point math performance; limited analog configurability restricts single-chip sensor hub use.Select when algorithmic intensity outweighs analog integration needs - e.g., motor FOC with minimal analog I/O.
MAX32660ARM Cortex-M4, 96 MHz, ultra-low-power (1.6 µA/MHz), integrated AES crypto, but only 12-bit SAR ADC (500 ksps), no USB PHY, no CapSense, no programmable analog blocks.Superior security and power efficiency for BLE-connected edge nodes; insufficient analog flexibility for multi-sensor front-end consolidation.Select for battery-operated secure IoT endpoints where cryptographic integrity and years of operation dominate over analog integration.

Compared with STM32F303VCT6 and MAX32660, CY8C5367LTI-003 uniquely combines reconfigurable analog/digital hardware, integrated USB PHY, and CapSense® - enabling true single-chip mixed-signal system consolidation where firmware-driven I/O remapping and analog front-end reuse are design requirements.

Availability

CY8C5367LTI-003 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensor hubs, and automated test equipment modules requiring stable component supply, long-term lifecycle support, and consistent parametric performance across temperature and voltage ranges.

Supply support for CY8C5367LTI-003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020, inheriting its PSoC® portfolio - a leader in configurable mixed-signal SoCs with >20 years of automotive-qualified reliability and broad industrial adoption.

The CY8C53 family targets applications demanding hardware/software co-design flexibility - especially where analog signal chain consolidation, touch interface integration, and USB connectivity must be achieved in a single chip without compromising power or precision.

FAQ

Does CY8C5367LTI-003 support USB device enumeration without external crystal?

No. Full-Speed USB 2.0 compliance requires a 24 MHz ±0.25% external crystal connected to XTAL_IN/XTAL_OUT. The internal IMO cannot meet USB timing tolerance requirements. This is explicitly specified in Section 11.9 (Clocking) of datasheet 001-66237 Rev. *D.

Can all 60 GPIOs simultaneously serve as analog inputs for the SAR ADC?

No. While all GPIOs connect to the analog bus, the SAR ADC has only one sample-and-hold channel and supports sequential sampling across up to 62 pins - not simultaneous acquisition. Maximum throughput remains 700 ksps total, shared across configured channels per scan sequence.

What is the maximum drive strength of the opamps in CY8C5367LTI-003?

Each of the two uncommitted opamps delivers ±10 mA continuous output current into resistive loads, with rail-to-rail output swing and unity-gain stability - verified in Section 11.5 (Analog Peripherals) of the datasheet under "Opamp Output Drive Capability" test conditions.

Is the 2-KB EEPROM truly byte-erasable and independently writable from Flash?

Yes. The 2 KB EEPROM is organized as 2048 bytes, each individually erasable and programmable without affecting adjacent bytes. It supports 1 million write/erase cycles and 20-year data retention at 85°C - confirmed in Section 5.4 (EEPROM) and Table 11-13 of the datasheet.

CY8C5367LTI-003 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
68-VFQFN Exposed Pad
Series:
PSOC™ 5 CY8C53
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
67MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
CapSense, DMA, LCD, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 1x12b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C5367LTI-003 FAQ

1.How can I place an order for CY8C5367LTI-003 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C5367LTI-003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C5367LTI-003 reliable?

The price and inventory of CY8C5367LTI-003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5367LTI-003 is usually 5 days.

3.What payment methods are accepted for CY8C5367LTI-003?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5367LTI-003 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C5367LTI-003?

CY8C5367LTI-003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C5367LTI-003 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C5367LTI-003?

For technical support, including CY8C5367LTI-003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5367LTI-003 requirements.

6.How does Aetrix verify that CY8C5367LTI-003 is sourced from the original manufacturer or authorized distributors?

All CY8C5367LTI-003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5367LTI-003 meets industry standards.

7.What is the process for return or replacement of CY8C5367LTI-003?

All CY8C5367LTI-003 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5367LTI-003, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C5367LTI-003 part is unused and in its original packaging.

Return procedure for CY8C5367LTI-003:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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