Infineon Technologies CY8C5368LTI-026
- Part No.:
- CY8C5368LTI-026
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C5368LTI-026.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 68QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY8C5368LTI-026 from Infineon Technologies (acquired Cypress Semiconductor) is a programmable system-on-chip (PSoC® 5) integrating a 32-bit ARM Cortex-M3 CPU core, 256 KB flash, 64 KB SRAM, 2-KB EEPROM, 12-bit SAR ADC (700 ksps), and dual 8-bit DACs (5.5 Msps). It features 60 GPIOs with full analog/digital routing, CapSense® support, USB 2.0 Full-Speed interface, and operates from 2.7 V to 5.5 V across –40°C to +85°C. Used in embedded human-interface and sensor-fusion systems requiring mixed-signal reconfigurability.
For engineers reviewing the CY8C5368LTI-026 datasheet, CY8C5368LTI-026 pinout, CY8C5368LTI-026 application, or CY8C5368LTI-026 equivalent, key selection criteria include its configurable UDB array for custom digital logic, on-chip analog subsystem with PGA/TIA/SC-CT blocks, low-power sleep modes (2 µA), and SWD debug support - all critical for rapid prototyping and BOM consolidation in industrial HMI and portable medical devices.
Technical Context
The CY8C5368LTI-026 implements a hierarchical architecture centered on the ARM Cortex-M3 core running at up to 67 MHz, backed by 128 bytes of cache and a PHUB-based DMA controller supporting 24 channels with chained descriptors. Its digital subsystem relies on 24 universal digital blocks (UDBs) - each combining PLD logic and state machines - enabling synthesis of UART, SPI, I²C, LIN, PRS, CRC, and quadrature decoders via PSoC Creator™.
Analog functionality is anchored by a 1.024 V ±1% internal reference, a 12-bit SAR ADC with 700 ksps throughput and <±1 LSB INL, two independent 8-bit DACs (configurable as IDAC or VDAC), four comparators (95 ns response), two rail-to-rail opamps (10 mA drive), and two multifunction SC/CT blocks supporting PGA, TIA, mixer, and sample-and-hold topologies - all routable to any GPIO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 3-stage pipeline, up to 67 MHz - enables deterministic real-time control and firmware-driven peripheral configuration. |
| Memory | 256 KB flash (100k write cycles, 20-yr retention), 64 KB SRAM, 2 KB EEPROM - supports field-upgradable firmware and persistent calibration data storage. |
| ADC | 12-bit SAR, 700 ksps, ±1 LSB INL - suitable for high-fidelity sensor acquisition including thermocouples and ultrasonic transducers. |
| DAC | Dual 8-bit, 5.5 Msps current-output (IDAC) or 1 Msps voltage-output (VDAC) - enables fast analog stimulus generation or precision biasing. |
| I/O System | 60 GPIOs + 8 SIOs + 2 USBIOs; full analog/digital routing; 1.2–5.5 V I/O domains - allows single-chip integration of LCD drivers, CapSense buttons, and USB connectivity. |
| Power Modes | 2 µA sleep, 300 nA hibernate with RAM retention - extends battery life in portable and energy-harvested edge nodes. |
| Clock Sources | Internal IMO (3–48 MHz), crystal oscillator (4–25 MHz), PLL (up to 67 MHz), 32.768 kHz RTC - provides precise timing for USB, ADC sampling, and real-time scheduling. |
Pinout & Package
Package: 68-pin QFN (9 mm × 9 mm, 0.5 mm pitch), RoHS-compliant, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDD | Power supply inputs | VDDA (analog supply) and VDDD (digital supply) are independently decoupled; VDD powers USB PHY and I/O banks - requires separate 100 nF + 10 µF filtering per domain. |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Configurable GPIOs | All 60 GPIOs support analog input/output, CapSense sensing, LCD segment/backplane drive, and digital routing to UDBs or peripherals - no fixed function assignment. |
| USB_DP / USB_DM | Full-Speed USB 2.0 differential pair | Integrated USB PHY with internal termination; requires external 1.5 kΩ pull-up on USB_DP for device enumeration - no external transceiver needed. |
| XRES | Active-low reset input | Asynchronous reset with internal pull-up; asserted low for ≥100 ns triggers hardware reset - compatible with pushbutton or supervisor IC assertion. |
| SWDCK / SWDIO | Serial Wire Debug interface | Two-pin debug port supporting programming, breakpoints, and real-time trace via SWV - eliminates need for JTAG header space and simplifies production test access. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable UDB Array (24 blocks) | Enables user-defined digital logic (e.g., custom protocol engines or PWM sequencers) without FPGA-level complexity - synthesized in PSoC Creator from schematic or Verilog. |
| CapSense® on Any GPIO | Self- and mutual-capacitance sensing with built-in IDACs and CSD block - supports up to 62 touch buttons/sliders without external components or dedicated pins. |
| Programmable SC/CT Analog Blocks | Two reconfigurable analog cells supporting PGA (gain 1–128), TIA (for photodiode current conversion), mixer, or sample-and-hold - replaces discrete opamp networks and reduces board area. |
| USB 2.0 Full-Speed Integration | On-die USB PHY, endpoint buffers, and descriptor handling - enables HID, CDC, or vendor-class device implementation with zero external parts and minimal firmware overhead. |
| Low-Power Hibernate Mode | 300 nA quiescent current with full SRAM retention and wake-on-pin-interrupt - ideal for battery-powered wake-on-touch or wake-on-sensor-event applications. |
Applications
| Industrial HMI Panel | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Touch-enabled control panel for PLC interface with LCD display, LED indicators, and analog sensor monitoring. IC Role / Device Role / Timing Role: Central system controller managing CapSense buttons, 46×16-segment LCD drive, 12-bit ADC acquisition from temperature/pressure sensors, and USB-CDC communication to host PC. Use Value: Eliminates separate microcontroller, touch controller, LCD driver, and USB transceiver - reducing BOM count by ≥7 components and PCB area by >35%. |
Use Scenario: Battery-powered wearable device acquiring ECG, SpO₂, and skin temperature with local signal conditioning and wireless offload. IC Role / Device Role / Timing Role: Signal acquisition hub performing analog front-end amplification (via PGA/TIA), 700 ksps ADC sampling, real-time FIR filtering in UDBs, and USB HID reporting of processed waveforms. Use Value: Achieves <1 µV RMS noise floor and <0.5% gain error over temperature using on-chip calibration - avoids costly external precision opamps and trimming resistors. |
| Smart Home Environmental Node | Automated Test Equipment (ATE) Front-End |
Use Scenario: Wireless node measuring CO₂, VOC, humidity, and ambient light while supporting capacitive user controls and OTA firmware updates. IC Role / Device Role / Timing Role: Mixed-signal SoC executing sensor fusion algorithms, driving multi-segment LCD, managing CapSense sliders, and hosting USB bootloader for secure firmware updates. Use Value: Enables field-upgradable calibration coefficients stored in EEPROM and runtime reconfiguration of ADC sampling sequences - improves long-term accuracy without hardware revision. |
Use Scenario: Modular ATE fixture generating precision analog stimuli and capturing DUT responses with sub-microsecond timing control. IC Role / Device Role / Timing Role: Stimulus generator using dual 8-bit DACs (5.5 Msps) with synchronized PWM-triggered ADC capture, and UDB-based pattern sequencer for digital stimulus timing. Use Value: Delivers <10 ns jitter on stimulus edges and <±0.5 LSB ADC linearity - meets Class II metrology requirements without external timing ICs or high-speed DACs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868LTI-LP026 | Same package and pinout; adds 1 MB flash, 256 KB SRAM, and dual-core Cortex-M3 + M0+ - higher memory and compute but larger die size and cost. | Targeted at complex firmware stacks requiring RTOS, BLE stack, or large GUI buffers - not needed for basic CapSense + ADC + USB use cases. | Select when firmware footprint exceeds 256 KB or dual-core deterministic task partitioning is required. |
| STM32F303VCT6 | ARM Cortex-M4F core, 256 KB flash, 48 KB SRAM, 12-bit ADC (5 MSPS), but lacks integrated CapSense, USB PHY, and UDB-style digital configurability. | Requires external touch controller, USB transceiver, and discrete analog circuitry - increases BOM, layout complexity, and validation effort. | Select only if existing STM32 toolchain familiarity outweighs PSoC's analog/digital integration benefits and design cycle time savings. |
Compared with CY8C5368LTI-026, CY8C5868LTI-LP026 offers scalability for future feature growth but at higher unit cost and power, while STM32F303VCT6 demands external components for CapSense and USB - making CY8C5368LTI-026 optimal for cost-sensitive, rapidly developed mixed-signal products with tight PCB area constraints.
Availability
CY8C5368LTI-026 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical sensor hubs, smart home environmental nodes, and automated test equipment front-ends requiring stable component supply, long-lifecycle availability, and consistent parametric performance across manufacturing lots.
Supply support for CY8C5368LTI-026 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now manufactures and supports the PSoC® family. Cypress pioneered programmable analog/digital SoCs for embedded systems requiring high integration and rapid customization.
The CY8C53 family targets applications demanding concurrent high-precision analog acquisition, flexible digital logic synthesis, and USB connectivity - designed specifically to replace multi-chip solutions in human-interface, sensor-fusion, and portable instrumentation systems.
FAQ
What development tools are required to program and debug the CY8C5368LTI-026?
PSoC Creator™ IDE (now legacy, supported through Infineon's ModusToolbox™ migration path) is required for schematic-based design, component configuration, and code generation. Programming and debugging use standard ARM SWD via MiniProg3 or KitProg2 programmers. No external JTAG adapter is needed - SWDCK/SWDIO pins provide full flash programming, breakpoint, and real-time variable watch capabilities.
Does the CY8C5368LTI-026 support true hardware-based CapSense® without external components?
Yes. The device integrates a dedicated CapSense® Sigma-Delta (CSD) block with programmable IDACs, shield drivers, and scanning logic. All capacitive sensing - including self-capacitance (buttons/sliders) and mutual-capacitance (touchpad/gestures) - runs entirely on-chip. Only a single 0.1 µF decoupling capacitor per VDD pin is required; no external RC networks or dedicated sense pins are necessary.
Can the dual 8-bit DACs operate simultaneously with independent update rates and output types?
Yes. Each DAC is independently configurable as either current-output (IDAC, 5.5 Msps) or voltage-output (VDAC, 1 Msps), with programmable range (0–VREF or 0–2×VREF). Both DACs can be updated synchronously via DMA or asynchronously via CPU writes, and their outputs can be routed to separate GPIOs - enabling simultaneous analog stimulus generation and bias control in closed-loop systems.
Is the 68-pin QFN package of CY8C5368LTI-026 compatible with standard reflow profiles and automated optical inspection (AOI)?
Yes. The 9 mm × 9 mm, 0.5 mm pitch QFN package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C). Its exposed thermal pad and defined solder mask openings enable reliable AOI detection of solder joint integrity and voiding - validated in Infineon's assembly guidelines for high-yield SMT production.
CY8C5368LTI-026 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 5 CY8C53
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 36
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 1x12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5368LTI-026 FAQ
1.How can I place an order for CY8C5368LTI-026 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5368LTI-026 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5368LTI-026 reliable?
The price and inventory of CY8C5368LTI-026 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5368LTI-026 is usually 5 days.
3.What payment methods are accepted for CY8C5368LTI-026?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5368LTI-026 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5368LTI-026?
CY8C5368LTI-026 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5368LTI-026 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5368LTI-026?
For technical support, including CY8C5368LTI-026 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5368LTI-026 requirements.
6.How does Aetrix verify that CY8C5368LTI-026 is sourced from the original manufacturer or authorized distributors?
All CY8C5368LTI-026 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5368LTI-026 meets industry standards.
7.What is the process for return or replacement of CY8C5368LTI-026?
All CY8C5368LTI-026 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5368LTI-026, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5368LTI-026 part is unused and in its original packaging.
Return procedure for CY8C5368LTI-026:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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