Infineon Technologies CY8C5467AXI-011
- Part No.:
- CY8C5467AXI-011
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C5467AXI-011.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,605
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C5467AXI-011 from Infineon Technologies (acquired Cypress Semiconductor) is a programmable system-on-chip (PSoC® 5) integrating a 32-bit ARM Cortex-M3 CPU, dual 12-bit SAR ADCs (700 ksps), four 8-bit DACs (5.5 Msps), four opamps, four comparators, and 24 universal digital blocks (UDBs) in a 100-pin TQFP package. It operates from 2.7 V to 5.5 V, supports CapSense® capacitive sensing on any GPIO, and targets embedded control with mixed-signal acquisition and real-time processing.
For engineers reviewing the CY8C5467AXI-011 datasheet, CY8C5467AXI-011 pinout, CY8C5467AXI-011 application, or CY8C5467AXI-011 equivalent, key selection criteria include its 67 MHz Cortex-M3 performance, configurable analog routing across 60 GPIOs, USB 2.0 FS interface, DFB-based FIR/IIR filtering, and industrial temperature range (–40 °C to +85 °C).
Technical Context
The device implements a hierarchical mixed-signal architecture: analog signals route via dedicated analog interconnect to two independent 12-bit SAR ADCs and four SC/CT blocks (configurable as PGA, TIA, mixer, or sample-and-hold), while digital logic executes in 24 UDBs-each containing PAL/PLD and state machine resources-connected through the Digital System Interconnect (DSI) to all I/O pins.
Clocking is managed by multiple sources: a 3–48 MHz IMO, 4–25 MHz crystal oscillator, 32.768 kHz RTC oscillator, and internal PLL enabling up to 67 MHz core operation; power management includes 2 µA sleep and 300 nA hibernate modes with SRAM retention, supporting ultra-low-power sensor node designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 67 MHz max - enables deterministic real-time control and firmware-driven peripheral reconfiguration. |
| Flash / SRAM | 256 KB flash (100k write cycles, 20 yr retention), 64 KB SRAM - supports complex firmware with secure boot and field updates. |
| Analog Inputs | 2 × 12-bit SAR ADC, 700 ksps each - allows simultaneous high-speed acquisition of two analog channels without CPU overhead via DMA. |
| Digital Blocks | 24 UDBs + 4 × 16-bit TCPWM + DFB - provides hardware-accelerated signal processing (e.g., 64-tap FIR filter in one cycle) and custom logic synthesis. |
| I/O Capability | 60 GPIO + 8 SIO + 2 USBIO, 1.2–5.5 V I/O domains - enables direct LCD drive (46×16), CapSense® on any pin, and multi-voltage system interfacing. |
| Power Modes | 300 nA hibernate (RAM retention), 2 µA sleep - suitable for battery-powered edge nodes requiring years of operation on coin cell. |
| USB Interface | Full-Speed USB 2.0 (12 Mbps) with external 24 MHz crystal - delivers plug-and-play host communication without external PHY. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial temperature grade (–40 °C to +85 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VDDD | Analog/Digital Power Supply | Separate 2.7–5.5 V supplies enable noise-isolated analog operation and flexible system-level voltage domain partitioning. |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Configurable GPIO | All 60 GPIOs support analog input/output routing, CapSense®, LCD segment/common, and Schmitt-trigger digital input. |
| USB_DP / USB_DM | USB 2.0 Full-Speed Differential Pair | Integrated transceiver requires only external 24 MHz crystal and series resistors - no external PHY needed. |
| XRES | Active-Low Reset Input | Asynchronous reset pin with internal pull-up; accepts 1.2–5.5 V logic levels for robust system-level reset coordination. |
| SWDCK / SWDIO | Serial Wire Debug Interface | Two-pin debug interface supporting full SWD/SWV functionality - enables real-time trace, breakpoints, and printf-style debugging. |
Key Features
| Feature | Design Value |
|---|---|
| CapSense® on Any GPIO | Enables capacitive touch buttons, sliders, and proximity sensing using standard I/O pins - eliminates dedicated touch controller ICs and reduces BOM cost. |
| Programmable Analog Blocks | Four SC/CT blocks configurable as transimpedance amplifiers (TIA), programmable gain amplifiers (PGA), or mixers - supports sensor front-end customization without external opamp networks. |
| Digital Filter Block (DFB) | 24-bit fixed-point engine performing 48-bit MAC per cycle - implements real-time FIR/IIR filters (up to 64 taps) for anti-aliasing, noise suppression, or sensor fusion without CPU load. |
| Flexible Clock Tree | Multiple clock sources (IMO, crystal, PLL, ILO) with dynamic switching - allows runtime trade-offs between precision (crystal), low power (ILO), and performance (PLL). |
| Hardware Security | Flash protection, EEPROM write-lock, and secure bootloader support - prevents unauthorized firmware access or modification in deployed devices. |
Applications
| Industrial Sensor Node | Medical Patient Monitor |
|---|---|
|
Use Scenario: Battery-powered wireless sensor hub acquiring temperature, pressure, and ECG signals at 1 kS/s with local preprocessing before BLE transmission. IC Role / Device Role / Timing Role: Central mixed-signal SoC handling analog front-end conditioning (PGA + ADC), digital filtering (DFB), CapSense® user interface, and USB programming interface. Use Value: Single-chip integration eliminates discrete opamps, ADC drivers, and microcontroller - reducing PCB area by >40% and enabling 5-year coin-cell operation via 300 nA hibernate mode. |
Use Scenario: Portable ECG module with dry-electrode acquisition, real-time QRS detection, and LCD display. IC Role / Device Role / Timing Role: Signal acquisition SoC providing TIA-based electrode interface, 12-bit ADC sampling at 1 kS/s, DFB-based adaptive noise cancellation, and direct LCD segment drive. Use Value: On-chip analog configurability avoids external instrumentation amps and filters; LCD direct drive removes display controller IC, lowering component count and EMI risk. |
| Smart Home Touch Panel | Automotive Body Control Module |
|
Use Scenario: Wall-mounted HVAC control panel with 12-capacitive-touch buttons, ambient light sensing, and local fan speed PWM control. IC Role / Device Role / Timing Role: Human interface SoC executing CapSense® scanning, ambient ADC measurement, and 16-bit PWM generation for brushless fan motor control. Use Value: All touch and control functions implemented in one chip - eliminates separate touch controller, ADC, and PWM driver ICs; GPIO flexibility supports future UI expansion without board redesign. |
Use Scenario: Door module managing window lift, mirror fold, and interior lighting with LIN bus communication and fault diagnostics. IC Role / Device Role / Timing Role: Embedded controller running LIN 2.0 stack, monitoring hall-effect sensors and current shunts, and driving MOSFET half-bridges via GPIO-configured PWM outputs. Use Value: Integrated LIN peripheral and high-current GPIO (25 mA sink on SIO) reduce external transceivers and level shifters; flash security prevents unauthorized firmware updates in vehicle ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable mixed-signal SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F303VCT6 | ARM Cortex-M4F @ 72 MHz, 256 KB flash, but only 1 × 12-bit ADC (5 MSPS), no integrated CapSense® or SC/CT blocks. | Lacks configurable analog front-end; requires external components for capacitive sensing or precision TIA/PGA stages. | Select when floating-point math or DSP instructions are critical, and analog signal chain is simple or externally handled. |
| PSoC™ 62S2-064DXI-T | Dual-core (Cortex-M0+/M4), 1 MB flash, Bluetooth LE radio, but smaller analog subsystem: 1 × SAR ADC (1 Msps), no DFB or SC/CT blocks. | Optimized for secure wireless IoT; lacks high-fidelity analog processing capability for sensor fusion or medical-grade acquisition. | Select when BLE connectivity and security are primary, and analog requirements are limited to basic ADC/DAC functions. |
Compared with STM32F303VCT6 and PSoC™ 62S2-064DXI-T, CY8C5467AXI-011 uniquely combines high-resolution dual ADCs, hardware DFB filtering, and fully configurable analog blocks - making it optimal for applications demanding on-chip analog signal conditioning and real-time mixed-signal processing without external components.
Availability
CY8C5467AXI-011 is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical monitors, smart home touch panels, and automotive body control modules requiring stable component supply and long-term lifecycle support.
Supply support for CY8C5467AXI-011 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the PSoC® portfolio. Cypress pioneered configurable mixed-signal SoCs, emphasizing analog-digital integration and rapid prototyping.
CY8C5467AXI-011 belongs to the PSoC® 5 family, designed for embedded systems requiring concurrent high-precision analog acquisition, real-time digital signal processing, and flexible firmware-defined peripherals - especially where BOM reduction and design iteration speed are critical.
FAQ
Does CY8C5467AXI-011 support USB device enumeration without external crystal?
No. Full-Speed USB 2.0 operation requires an external 24 MHz crystal connected to XIN/XOUT pins. The internal IMO does not meet USB timing accuracy requirements (±0.25% tolerance). Crystal-less USB is not supported in this device.
Can all 60 GPIOs be used simultaneously for CapSense®?
No. While CapSense® can be routed to any GPIO, the maximum number of simultaneous CapSense® sensors is limited by the analog routing resources and scan time constraints. The datasheet specifies up to 62 total analog inputs, but practical CapSense® channel count depends on shield configuration, resolution, and scan rate - typically ≤32 for robust operation.
What is the maximum update rate for the 8-bit IDACs in voltage-output mode?
In voltage-output (VDAC) mode, the four 8-bit DACs operate at up to 1 Msps. This is confirmed in Section 11.5 (Analog Peripherals) of the datasheet, where VDAC settling time is specified as 1 µs typical - limiting usable update rate to 1 million samples per second under load conditions.
Is the DFB capable of implementing a 2nd-order IIR filter in real time?
Yes. The DFB supports 24-bit fixed-point arithmetic and performs one 48-bit MAC operation per clock cycle. A 2nd-order IIR filter requires three MAC operations per sample; at 67 MHz core clock with DFB clocked at 67 MHz, it achieves real-time execution well below 100 kS/s - verified in Cypress Application Note AN76359.
CY8C5467AXI-011 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 5 CY8C54
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 2x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5467AXI-011 FAQ
1.How can I place an order for CY8C5467AXI-011 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5467AXI-011 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5467AXI-011 reliable?
The price and inventory of CY8C5467AXI-011 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5467AXI-011 is usually 5 days.
3.What payment methods are accepted for CY8C5467AXI-011?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5467AXI-011 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5467AXI-011?
CY8C5467AXI-011 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5467AXI-011 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5467AXI-011?
For technical support, including CY8C5467AXI-011 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5467AXI-011 requirements.
6.How does Aetrix verify that CY8C5467AXI-011 is sourced from the original manufacturer or authorized distributors?
All CY8C5467AXI-011 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5467AXI-011 meets industry standards.
7.What is the process for return or replacement of CY8C5467AXI-011?
All CY8C5467AXI-011 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5467AXI-011, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5467AXI-011 part is unused and in its original packaging.
Return procedure for CY8C5467AXI-011:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C5467AXI-011 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

