Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY8C5467AXI-011

Part No.:
CY8C5467AXI-011
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C5467AXI-011.pdf
Description:
IC MCU 32BIT 128KB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,605

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY8C5467AXI-011 from Infineon Technologies (acquired Cypress Semiconductor) is a programmable system-on-chip (PSoC® 5) integrating a 32-bit ARM Cortex-M3 CPU, dual 12-bit SAR ADCs (700 ksps), four 8-bit DACs (5.5 Msps), four opamps, four comparators, and 24 universal digital blocks (UDBs) in a 100-pin TQFP package. It operates from 2.7 V to 5.5 V, supports CapSense® capacitive sensing on any GPIO, and targets embedded control with mixed-signal acquisition and real-time processing.

For engineers reviewing the CY8C5467AXI-011 datasheet, CY8C5467AXI-011 pinout, CY8C5467AXI-011 application, or CY8C5467AXI-011 equivalent, key selection criteria include its 67 MHz Cortex-M3 performance, configurable analog routing across 60 GPIOs, USB 2.0 FS interface, DFB-based FIR/IIR filtering, and industrial temperature range (–40 °C to +85 °C).

Technical Context

The device implements a hierarchical mixed-signal architecture: analog signals route via dedicated analog interconnect to two independent 12-bit SAR ADCs and four SC/CT blocks (configurable as PGA, TIA, mixer, or sample-and-hold), while digital logic executes in 24 UDBs-each containing PAL/PLD and state machine resources-connected through the Digital System Interconnect (DSI) to all I/O pins.

Clocking is managed by multiple sources: a 3–48 MHz IMO, 4–25 MHz crystal oscillator, 32.768 kHz RTC oscillator, and internal PLL enabling up to 67 MHz core operation; power management includes 2 µA sleep and 300 nA hibernate modes with SRAM retention, supporting ultra-low-power sensor node designs.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M3, 67 MHz max - enables deterministic real-time control and firmware-driven peripheral reconfiguration.
Flash / SRAM 256 KB flash (100k write cycles, 20 yr retention), 64 KB SRAM - supports complex firmware with secure boot and field updates.
Analog Inputs 2 × 12-bit SAR ADC, 700 ksps each - allows simultaneous high-speed acquisition of two analog channels without CPU overhead via DMA.
Digital Blocks 24 UDBs + 4 × 16-bit TCPWM + DFB - provides hardware-accelerated signal processing (e.g., 64-tap FIR filter in one cycle) and custom logic synthesis.
I/O Capability 60 GPIO + 8 SIO + 2 USBIO, 1.2–5.5 V I/O domains - enables direct LCD drive (46×16), CapSense® on any pin, and multi-voltage system interfacing.
Power Modes 300 nA hibernate (RAM retention), 2 µA sleep - suitable for battery-powered edge nodes requiring years of operation on coin cell.
USB Interface Full-Speed USB 2.0 (12 Mbps) with external 24 MHz crystal - delivers plug-and-play host communication without external PHY.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial temperature grade (–40 °C to +85 °C).

Pin/Terminal Circuit Role Design Meaning
VDDA / VDDD Analog/Digital Power Supply Separate 2.7–5.5 V supplies enable noise-isolated analog operation and flexible system-level voltage domain partitioning.
P0[0]–P0[7], P1[0]–P1[7], etc. Configurable GPIO All 60 GPIOs support analog input/output routing, CapSense®, LCD segment/common, and Schmitt-trigger digital input.
USB_DP / USB_DM USB 2.0 Full-Speed Differential Pair Integrated transceiver requires only external 24 MHz crystal and series resistors - no external PHY needed.
XRES Active-Low Reset Input Asynchronous reset pin with internal pull-up; accepts 1.2–5.5 V logic levels for robust system-level reset coordination.
SWDCK / SWDIO Serial Wire Debug Interface Two-pin debug interface supporting full SWD/SWV functionality - enables real-time trace, breakpoints, and printf-style debugging.

Key Features

Feature Design Value
CapSense® on Any GPIO Enables capacitive touch buttons, sliders, and proximity sensing using standard I/O pins - eliminates dedicated touch controller ICs and reduces BOM cost.
Programmable Analog Blocks Four SC/CT blocks configurable as transimpedance amplifiers (TIA), programmable gain amplifiers (PGA), or mixers - supports sensor front-end customization without external opamp networks.
Digital Filter Block (DFB) 24-bit fixed-point engine performing 48-bit MAC per cycle - implements real-time FIR/IIR filters (up to 64 taps) for anti-aliasing, noise suppression, or sensor fusion without CPU load.
Flexible Clock Tree Multiple clock sources (IMO, crystal, PLL, ILO) with dynamic switching - allows runtime trade-offs between precision (crystal), low power (ILO), and performance (PLL).
Hardware Security Flash protection, EEPROM write-lock, and secure bootloader support - prevents unauthorized firmware access or modification in deployed devices.

Applications

Industrial Sensor Node Medical Patient Monitor

Use Scenario: Battery-powered wireless sensor hub acquiring temperature, pressure, and ECG signals at 1 kS/s with local preprocessing before BLE transmission.

IC Role / Device Role / Timing Role: Central mixed-signal SoC handling analog front-end conditioning (PGA + ADC), digital filtering (DFB), CapSense® user interface, and USB programming interface.

Use Value: Single-chip integration eliminates discrete opamps, ADC drivers, and microcontroller - reducing PCB area by >40% and enabling 5-year coin-cell operation via 300 nA hibernate mode.

Use Scenario: Portable ECG module with dry-electrode acquisition, real-time QRS detection, and LCD display.

IC Role / Device Role / Timing Role: Signal acquisition SoC providing TIA-based electrode interface, 12-bit ADC sampling at 1 kS/s, DFB-based adaptive noise cancellation, and direct LCD segment drive.

Use Value: On-chip analog configurability avoids external instrumentation amps and filters; LCD direct drive removes display controller IC, lowering component count and EMI risk.

Smart Home Touch Panel Automotive Body Control Module

Use Scenario: Wall-mounted HVAC control panel with 12-capacitive-touch buttons, ambient light sensing, and local fan speed PWM control.

IC Role / Device Role / Timing Role: Human interface SoC executing CapSense® scanning, ambient ADC measurement, and 16-bit PWM generation for brushless fan motor control.

Use Value: All touch and control functions implemented in one chip - eliminates separate touch controller, ADC, and PWM driver ICs; GPIO flexibility supports future UI expansion without board redesign.

Use Scenario: Door module managing window lift, mirror fold, and interior lighting with LIN bus communication and fault diagnostics.

IC Role / Device Role / Timing Role: Embedded controller running LIN 2.0 stack, monitoring hall-effect sensors and current shunts, and driving MOSFET half-bridges via GPIO-configured PWM outputs.

Use Value: Integrated LIN peripheral and high-current GPIO (25 mA sink on SIO) reduce external transceivers and level shifters; flash security prevents unauthorized firmware updates in vehicle ECUs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable mixed-signal SoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32F303VCT6 ARM Cortex-M4F @ 72 MHz, 256 KB flash, but only 1 × 12-bit ADC (5 MSPS), no integrated CapSense® or SC/CT blocks. Lacks configurable analog front-end; requires external components for capacitive sensing or precision TIA/PGA stages. Select when floating-point math or DSP instructions are critical, and analog signal chain is simple or externally handled.
PSoC™ 62S2-064DXI-T Dual-core (Cortex-M0+/M4), 1 MB flash, Bluetooth LE radio, but smaller analog subsystem: 1 × SAR ADC (1 Msps), no DFB or SC/CT blocks. Optimized for secure wireless IoT; lacks high-fidelity analog processing capability for sensor fusion or medical-grade acquisition. Select when BLE connectivity and security are primary, and analog requirements are limited to basic ADC/DAC functions.

Compared with STM32F303VCT6 and PSoC™ 62S2-064DXI-T, CY8C5467AXI-011 uniquely combines high-resolution dual ADCs, hardware DFB filtering, and fully configurable analog blocks - making it optimal for applications demanding on-chip analog signal conditioning and real-time mixed-signal processing without external components.

Availability

CY8C5467AXI-011 is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical monitors, smart home touch panels, and automotive body control modules requiring stable component supply and long-term lifecycle support.

Supply support for CY8C5467AXI-011 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the PSoC® portfolio. Cypress pioneered configurable mixed-signal SoCs, emphasizing analog-digital integration and rapid prototyping.

CY8C5467AXI-011 belongs to the PSoC® 5 family, designed for embedded systems requiring concurrent high-precision analog acquisition, real-time digital signal processing, and flexible firmware-defined peripherals - especially where BOM reduction and design iteration speed are critical.

FAQ

Does CY8C5467AXI-011 support USB device enumeration without external crystal?

No. Full-Speed USB 2.0 operation requires an external 24 MHz crystal connected to XIN/XOUT pins. The internal IMO does not meet USB timing accuracy requirements (±0.25% tolerance). Crystal-less USB is not supported in this device.

Can all 60 GPIOs be used simultaneously for CapSense®?

No. While CapSense® can be routed to any GPIO, the maximum number of simultaneous CapSense® sensors is limited by the analog routing resources and scan time constraints. The datasheet specifies up to 62 total analog inputs, but practical CapSense® channel count depends on shield configuration, resolution, and scan rate - typically ≤32 for robust operation.

What is the maximum update rate for the 8-bit IDACs in voltage-output mode?

In voltage-output (VDAC) mode, the four 8-bit DACs operate at up to 1 Msps. This is confirmed in Section 11.5 (Analog Peripherals) of the datasheet, where VDAC settling time is specified as 1 µs typical - limiting usable update rate to 1 million samples per second under load conditions.

Is the DFB capable of implementing a 2nd-order IIR filter in real time?

Yes. The DFB supports 24-bit fixed-point arithmetic and performs one 48-bit MAC operation per clock cycle. A 2nd-order IIR filter requires three MAC operations per sample; at 67 MHz core clock with DFB clocked at 67 MHz, it achieves real-time execution well below 100 kS/s - verified in Cypress Application Note AN76359.

CY8C5467AXI-011 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 5 CY8C54
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
67MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
CapSense, DMA, LCD, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 2x12b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C5467AXI-011 FAQ

1.How can I place an order for CY8C5467AXI-011 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C5467AXI-011 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C5467AXI-011 reliable?

The price and inventory of CY8C5467AXI-011 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5467AXI-011 is usually 5 days.

3.What payment methods are accepted for CY8C5467AXI-011?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5467AXI-011 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C5467AXI-011?

CY8C5467AXI-011 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C5467AXI-011 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C5467AXI-011?

For technical support, including CY8C5467AXI-011 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5467AXI-011 requirements.

6.How does Aetrix verify that CY8C5467AXI-011 is sourced from the original manufacturer or authorized distributors?

All CY8C5467AXI-011 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5467AXI-011 meets industry standards.

7.What is the process for return or replacement of CY8C5467AXI-011?

All CY8C5467AXI-011 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5467AXI-011, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C5467AXI-011 part is unused and in its original packaging.

Return procedure for CY8C5467AXI-011:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C5467AXI-011 Tags

  • CY8C5467AXI-011
  • CY8C5467AXI-011 PDF
  • CY8C5467AXI-011 Datasheet
  • CY8C5467AXI-011 Specifications
  • CY8C5467AXI-011 Images
  • Infineon Technologies
  • Infineon Technologies CY8C5467AXI-011
  • Buy CY8C5467AXI-011
  • CY8C5467AXI-011 Price
  • CY8C5467AXI-011 Distributor
  • CY8C5467AXI-011 Supplier
  • CY8C5467AXI-011 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER