Infineon Technologies CY8C5567AXI-019
- Part No.:
- CY8C5567AXI-019
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C5567AXI-019.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,946
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C5567AXI-019 from Infineon Technologies (acquired Cypress Semiconductor) is a 32-bit programmable system-on-chip (PSoC® 5) integrating ARM Cortex-M3 CPU, configurable analog/digital peripherals, 256 KB flash, 64 KB SRAM, and USB 2.0 interface in a 100-pin TQFP package. It delivers up to 67 MHz operation, supports CapSense® capacitive sensing, delta-sigma ADC (20-bit, 192 ksps), dual SAR ADCs (12-bit, 700 ksps), and DFB-based FIR/IIR filtering - deployed in industrial HMI, medical sensor hubs, and programmable power control systems.
For engineers reviewing the CY8C5567AXI-019 datasheet, CY8C5567AXI-019 pinout, CY8C5567AXI-019 application, or CY8C5567AXI-019 equivalent, key selection criteria include its 100-pin TQFP footprint, 2.7–5.5 V supply range, -40°C to +85°C industrial temperature rating, integrated USB PHY with 24 MHz external oscillator requirement, and routing flexibility enabling any GPIO to connect to analog/digital resources.
Technical Context
The CY8C5567AXI-019 implements a hierarchical mixed-signal architecture centered on an ARM Cortex-M3 core with tightly coupled cache, PHUB-based DMA, and dual-bus interconnect (AHB/ASB). Its analog subsystem relies on a 1.024 V ±1% internal reference and supports simultaneous delta-sigma and SAR conversion paths routed via programmable analog muxes.
Digital configurability is delivered through 24 Universal Digital Blocks (UDBs), each combining PLD logic and state machines, enabling synthesis of UART, I²C, SPI, LIN, PRS, CRC, quadrature decoders, and custom logic - all dynamically routable to 60 GPIOs, 8 SIOs, and 2 USBIOs using the Digital System Interconnect (DSI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 67 MHz max - enables real-time deterministic control with Thumb-2 instruction set and NVIC-integrated interrupt handling. |
| Flash / SRAM | 256 KB flash (100k write cycles, 20-yr retention), 64 KB SRAM - supports field-upgradable firmware and large buffer storage for sensor fusion or protocol stacks. |
| Analog ADC | Delta-sigma ADC: 20-bit resolution, 192 ksps, 84 dB SINAD @ 16-bit - suitable for precision thermocouple or strain gauge signal acquisition without external signal conditioning. |
| Digital Peripherals | 24 UDBs + 4 × 16-bit TCPWM + DFB filter engine - allows concurrent implementation of motor control PWM, communication protocols, and real-time digital filtering in one chip. |
| USB Interface | Full-Speed USB 2.0 (12 Mbps) with integrated PHY - eliminates need for external transceiver; requires 24 MHz crystal for precise timing compliance. |
| Power Modes | 300 nA hibernate (RAM retention), 2 µA sleep - enables battery-powered edge nodes with multi-year operation and fast wake-up latency. |
| I/O Flexibility | 60 GPIOs + 8 SIOs + 2 USBIOs; all GPIOs support CapSense®, LCD drive (46×16), and analog routing - reduces BOM count in touch-enabled embedded devices. |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm, 0.5 mm pitch, exposed thermal pad (EP), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VDDD | Analog/Digital Power Supply | Separate 2.7–5.5 V domains enable noise isolation between analog signal chain and digital logic; VDDA must be ≥ VDDD. |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Configurable GPIO Bank | Each pin supports Schmitt-trigger input, open-drain/pull-up/pull-down/strong output, and analog routing to ADC/DAC/comparator blocks. |
| XTAL_IN / XTAL_OUT | 4–25 MHz Crystal Oscillator Input/Output | Drives internal PLL for precise clock generation; required for USB timing accuracy and high-resolution ADC sampling stability. |
| USB_DP / USB_DM | USB 2.0 Full-Speed Differential Pair | Integrated PHY supports plug-and-play HID, CDC, or vendor-class enumeration; no external transceiver needed. |
| SWDIO / SWCLK | Single-Wire Debug Interface | Enables non-intrusive firmware debugging, flash programming, and real-time trace via SWV without dedicated JTAG pins. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Analog Subsystem | Four opamps (10 mA drive), four comparators (95 ns), four SC/CT blocks (PGA/TIA/mixer), and dual ADC architectures allow mixed-signal signal chains to be defined in firmware - eliminating discrete opamp/filter ICs. |
| Programmable Digital Fabric | 24 UDBs with PAL+state machine logic enable hardware-accelerated peripherals (e.g., custom SPI variants, multi-channel PWM sequencers) synthesized at design time - reducing CPU load and jitter. |
| CapSense® Integration | All GPIOs support self- and mutual-capacitance sensing with built-in IDACs and CSD block - enables robust touch buttons, sliders, and proximity detection without external components. |
| DFB-Based Signal Processing | Dedicated 24-bit fixed-point DFB executes 48-bit MAC per cycle and supports up to 64-tap FIR/IIR filters - offloads real-time sensor data conditioning from Cortex-M3 core. |
| Multi-Domain I/O Voltage | Four independent I/O voltage domains (1.2–5.5 V) permit direct interfacing with legacy 3.3 V, 2.5 V, or 1.8 V peripherals - avoids level-shifter ICs in mixed-voltage systems. |
Applications
| Industrial HMI Panel | Medical Sensor Hub |
|---|---|
Use Scenario: Touch-enabled control panel for PLC interface with LED indicators, rotary encoders, and status displays. IC Role / Device Role / Timing Role: Central controller executing CapSense® touch scanning, PWM-driven LED dimming, quadrature decoding, and USB-CDC host communication. Use Value: Single-chip integration replaces MCU + touch controller + USB transceiver + PWM driver - cuts PCB area by 35% and simplifies EMI compliance. |
Use Scenario: Portable vital-sign monitor acquiring ECG, temperature, and SpO₂ signals with local preprocessing before Bluetooth transmission. IC Role / Device Role / Timing Role: Analog front-end aggregator with delta-sigma ADC (ECG), SAR ADC (thermistor), DFB-based noise filtering, and USB HID for PC-side calibration. Use Value: On-chip 84 dB SINAD ADC and DFB filtering eliminate external anti-aliasing filters and DSP - improves signal fidelity while meeting IEC 60601-1 leakage current limits. |
| Programmable Power Controller | Smart Lighting Node |
Use Scenario: DIN-rail mounted AC/DC power supply with adaptive load regulation, fault logging, and remote firmware update capability. IC Role / Device Role / Timing Role: Real-time supervisor managing isolated feedback loops via PWM outputs, monitoring rail voltages with SAR ADCs, and storing event logs in EEPROM. Use Value: 2 KB EEPROM with 1M write cycles enables reliable black-box logging across 10+ years of field operation without external FRAM/NVRAM. |
Use Scenario: DALI-2 compliant LED driver node supporting color tuning, thermal derating, and occupancy-based dimming profiles. IC Role / Device Role / Timing Role: DALI slave controller implementing I²C-to-DALI bridge, PWM dimming with 16-bit resolution, and ambient light sensing via CapSense®-integrated photodiode interface. Use Value: GPIO-based CapSense® photodiode biasing and charge-integration eliminates opamp transimpedance stage - reduces component count and dark-current drift sensitivity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868AXI-LP097 | Same CY8C55 family, 100-pin TQFP, but with 512 KB flash, 128 KB SRAM, and enhanced USB stack - no delta-sigma ADC; SAR-only analog path. | Better suited for USB-host-heavy applications (e.g., USB-to-serial bridges) where high-speed digital throughput outweighs precision analog needs. | Select when firmware complexity demands >256 KB flash and memory bandwidth exceeds 64 KB SRAM capacity - not for sensor signal chain dominance. |
| STM32F412ZGT6 | ARM Cortex-M4F @ 100 MHz, 1 MB flash, 256 KB SRAM, no integrated CapSense® or programmable analog blocks - requires external ADC/DAC for precision sensing. | Preferred for floating-point math-intensive tasks (e.g., motor FOC, audio codecs) but lacks hardware-level analog configurability and touch integration. | Choose when algorithmic performance (DSP, FFT) is primary and analog signal path is simple or handled externally - adds 3–5 passive components per channel. |
Compared with CY8C5567AXI-019, CY8C5868AXI-LP097 trades analog precision for memory headroom and USB feature depth, while STM32F412ZGT6 shifts design burden to external analog components and software-based peripheral emulation - making CY8C5567AXI-019 optimal for mixed-signal consolidation with minimal BOM growth.
Availability
CY8C5567AXI-019 is available at Aetrix Electronics and suitable for industrial HMI panels, medical sensor hubs, programmable power controllers, and smart lighting nodes requiring stable component supply across extended product lifecycles.
Supply support for CY8C5567AXI-019 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now develops, manufactures, and supports the PSoC® portfolio - a leader in configurable mixed-signal SoCs for industrial, automotive, and IoT applications.
The CY8C55 family targets applications demanding analog-digital convergence - such as touch interfaces, sensor signal conditioning, and protocol-agnostic connectivity - with firmware-defined hardware flexibility instead of fixed-function ASICs.
FAQ
Does CY8C5567AXI-019 support USB device enumeration without external crystal?
No. Full-Speed USB 2.0 compliance requires a 24 MHz ±0.25% external crystal connected to XTAL_IN/XTAL_OUT. The internal IMO oscillator does not meet USB timing tolerance requirements. A 24 MHz crystal with appropriate load capacitors (per datasheet Section 11.9) is mandatory for USB functionality.
Can all 60 GPIOs simultaneously serve as analog inputs for the delta-sigma ADC?
No. While all GPIOs are routable to the analog subsystem, the delta-sigma ADC has a single input multiplexer supporting up to 24 channels. Concurrent sampling is limited to one channel at a time; sequential scanning across multiple GPIOs is supported via firmware-controlled channel switching and DMA-triggered conversions.
What is the maximum achievable resolution for PWM-generated DAC output using UDBs?
Using UDB-based PWM DACs, CY8C5567AXI-019 achieves up to 10-bit effective resolution at ≤48 kHz update rate. This is achieved by configuring UDBs to generate high-frequency PWM (e.g., 4.8 MHz) with 10-bit counter depth and low-pass filtering - verified in Cypress Application Note AN76314.
Is the 2-KB EEPROM accessible during hibernate mode with RAM retention?
Yes. The 2 KB EEPROM remains fully readable and writable in hibernate mode (300 nA) while preserving SRAM contents. Write operations require ~10 ms and temporarily exit hibernate; reads complete within microsecond latency without mode transition - confirmed in Section 5.4 of datasheet 001-66235 Rev. *D.
CY8C5567AXI-019 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 5 CY8C55
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 1x20b, 1x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5567AXI-019 FAQ
1.How can I place an order for CY8C5567AXI-019 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5567AXI-019 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5567AXI-019 reliable?
The price and inventory of CY8C5567AXI-019 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5567AXI-019 is usually 5 days.
3.What payment methods are accepted for CY8C5567AXI-019?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5567AXI-019 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5567AXI-019?
CY8C5567AXI-019 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5567AXI-019 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5567AXI-019?
For technical support, including CY8C5567AXI-019 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5567AXI-019 requirements.
6.How does Aetrix verify that CY8C5567AXI-019 is sourced from the original manufacturer or authorized distributors?
All CY8C5567AXI-019 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5567AXI-019 meets industry standards.
7.What is the process for return or replacement of CY8C5567AXI-019?
All CY8C5567AXI-019 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5567AXI-019, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5567AXI-019 part is unused and in its original packaging.
Return procedure for CY8C5567AXI-019:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C5567AXI-019 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

