Infineon Technologies CY8C5666AXI-LP001
- Part No.:
- CY8C5666AXI-LP001
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
CY8C5666AXI-LP001.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,971
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C5666AXI-LP001 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 programmable system-on-chip (PSoC® 5LP) with up to 256 KB flash, 64 KB RAM, full CAN 2.0b interface, USB 2.0 Full-Speed peripheral, and configurable analog/digital peripherals. It operates from 1.71–5.5 V across –40 to +85 °C, supports ultra-low-power modes (300 nA hibernate), and integrates CapSense® for touch sensing in embedded control systems.
For engineers reviewing the CY8C5666AXI-LP001 datasheet, CY8C5666AXI-LP001 pinout, CY8C5666AXI-LP001 application, or CY8C5666AXI-LP001 equivalent, key selection criteria include its dual ADC architecture (delta-sigma + SAR), 24-channel DMA, DFB digital filter processor, flexible I/O routing to any peripheral, and integrated bootloader support over USB/I2C/SPI/UART.
Technical Context
The CY8C5666AXI-LP001 implements a tightly coupled mixed-signal SoC architecture where the Arm Cortex-M3 CPU (up to 80 MHz) coordinates programmable analog blocks (PGA, TIA, DAC, comparator), digital UDBs (20–24 configurable logic units), and dedicated peripherals including four TCPWM blocks, full CAN 2.0b controller with 16 Rx/8 Tx buffers, and USB 2.0 FS PHY with internal oscillator.
Its clocking subsystem includes three independent oscillators (IMO, ECO, WCO), PLL-based frequency synthesis up to 80 MHz, 12 routable clock dividers, and low-power LPO options (1/33/100 kHz). Power management supports six independent voltage domains, boost regulator (0.5–5 V), and four distinct low-power modes-Active, Sleep, Hibernate, and Deep Sleep-with retention and wake-up capability on multiple sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3, 32-bit, up to 80 MHz - enables real-time deterministic control with Thumb-2 instruction set and NVIC interrupt handling. |
| Memory | 256 KB flash (with cache/security), 64 KB RAM, 2 KB EEPROM - supports secure firmware updates, data logging, and bootloader storage without external memory. |
| Analog Peripherals | Configurable delta-sigma ADC (8–12-bit), two 12-bit SAR ADCs, four 8-bit DACs, four opamps, four comparators - enables simultaneous high-precision sensor acquisition and analog signal conditioning. |
| Digital Connectivity | Full CAN 2.0b (16 Rx/8 Tx buffers), USB 2.0 FS (12 Mbps, TID#10840032 certified), I²C (1 Mbps), UART/SPI/I²S via UDB - provides industrial bus compliance and host interface flexibility. |
| Power Performance | 300 nA hibernate mode with RAM retention, 2 µA sleep mode, 15.4 mA at 48 MHz active - allows battery-powered operation for years in sensor nodes or portable medical devices. |
| I/O System | Up to 72 pins (62 GPIO), 8 SIO pins (25 mA sink, overvoltage tolerant), USBIO pins, LCD direct drive (46×16), CapSense® on any GPIO - eliminates external level shifters and simplifies HMI integration. |
| Development Support | PSoC Creator™ IDE with drag-and-drop components, GCC/Keil toolchain, JTAG/SWD/SWV/TracePort debug - accelerates firmware-hardware co-design and reduces time-to-prototype. |
Pinout & Package
The CY8C5666AXI-LP001 is housed in a 68-pin QFN package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad, compliant with JEDEC MO-220 and RoHS standards. Pin functions are fully configurable via PSoC Creator's routing engine, enabling dynamic assignment of analog/digital peripherals to any GPIO or SIO.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA/VDDD | Analog/Digital supply rails | Independent 1.71–5.5 V domains allow mixed-voltage I/O interfacing and noise isolation between analog and digital sections. |
| P0[0]–P15[7] | General-purpose I/O | 62 GPIOs support CapSense®, LCD segment drive, and configurable pull-up/down; routed to any peripheral via DSI. |
| SIO[0]–SIO[7] | Performance I/O | 8 high-drive pins (25 mA sink), hot-swap capable, programmable thresholds - suitable for driving LEDs, relays, or interfacing with legacy industrial sensors. |
| USB_DP/USB_DM | USB 2.0 Full-Speed differential pair | Integrated PHY with internal oscillator eliminates need for external crystal; supports device-mode enumeration and CDC/HID class implementations. |
| CAN_TX/CAN_RX | CAN 2.0b transceiver interface | Dedicated pins for CAN bus signaling; require external transceiver but support full protocol stack with hardware message filtering and FIFO buffering. |
| XTAL_IN/XTAL_OUT | External crystal oscillator input/output | Supports 4–25 MHz crystals for precise timing; used for USB suspend/resume synchronization and high-accuracy clock generation. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable UDB array (20–24 blocks) | Enables custom digital logic (e.g., PRS generators, CRC engines, quadrature decoders) without FPGA-level complexity or cost. |
| Digital Filter Block (DFB) | 24-bit, 64-tap fixed-point FIR/IIR filtering engine - offloads signal processing from CPU for real-time sensor fusion or motor control loop execution. |
| CapSense® with SmartSense™ auto-tuning | Supports up to 62 self- or mutual-capacitance sensors with automatic calibration - eliminates manual tuning for varying environmental conditions and PCB stackup. |
| Programmable analog blocks (SC/CT) | Four blocks implement PGA, TIA, mixer, or sample-and-hold - enables front-end signal conditioning for current/voltage/impedance measurements without external opamp networks. |
| Bootloader over multiple interfaces | Field firmware updates via USB, I²C, SPI, or UART - supports secure OTA updates and eliminates need for physical programming fixtures in deployed systems. |
Applications
| Industrial Motor Control | Medical Patient Monitoring |
|---|---|
|
Use Scenario: Closed-loop BLDC motor control with current sensing, position feedback, and thermal monitoring in compact drives. IC Role / Device Role / Timing Role: Central controller executing FOC algorithms, sampling dual ADC channels synchronously, generating PWM waveforms with dead-time insertion, and communicating via CAN bus. Use Value: Integrated DFB performs real-time current harmonic analysis; UDBs implement encoder quadrature decoding; SIO pins drive gate drivers directly. |
Use Scenario: Portable ECG/SpO₂ monitor with dry-electrode sensing, analog front-end filtering, and Bluetooth LE connectivity via USB-hosted bridge. IC Role / Device Role / Timing Role: Analog signal conditioner (PGA + delta-sigma ADC), digital signal processor (DFB for baseline wander removal), and USB device controller for host communication. Use Value: Single-chip solution replaces discrete opamp/ADC/microcontroller; CapSense® enables on-device electrode contact detection; 300 nA hibernate extends battery life. |
| Automotive Body Electronics | Smart Home Touch Interface |
|
Use Scenario: Door module managing window lift, mirror adjustment, and interior lighting with LIN/CAN gateway functionality. IC Role / Device Role / Timing Role: CAN/LIN protocol handler, PWM-controlled LED driver, capacitive touch switch controller, and nonvolatile configuration storage. Use Value: Dual CAN buffers enable concurrent body bus and diagnostic traffic; programmable analog blocks condition hall-effect sensor inputs; EEPROM stores calibration data. |
Use Scenario: Wall-mounted HVAC control panel with multi-touch slider, ambient light sensing, and local display refresh. IC Role / Device Role / Timing Role: CapSense® touch controller, SAR ADC for light/temperature sensing, LCD segment driver, and USB-CDC interface for configuration updates. Use Value: All touch and display functions implemented in one chip; SmartSense™ adapts to glass overlay thickness; LCD drive eliminates external segment driver IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868AXI-LP035 | Higher memory (512 KB flash, 64 KB RAM), same core/peripherals, 100-pin TQFP package | Targets larger firmware footprints and more complex HMI or protocol stacks requiring additional UDBs and I/O count | Select when >256 KB flash or >62 GPIOs are required; pin-compatible only in 100-pin footprint. |
| STM32F412ZGT6 | ARM Cortex-M4F core, no integrated analog configurability, requires external ADC/DAC/opamps, no CapSense® | Preferred for pure digital signal processing or when leveraging STM32 ecosystem tools and HAL libraries over PSoC Creator | Choose when analog subsystem flexibility is not needed and existing STM32 design infrastructure exists. |
Compared with CY8C5666AXI-LP001, the CY8C5868AXI-LP035 offers expanded memory and I/O for scaling firmware complexity, while the STM32F412ZGT6 trades analog integration for higher floating-point throughput and broader third-party middleware support-making each optimal for distinct architectural priorities.
Availability
CY8C5666AXI-LP001 is available at Aetrix Electronics and suitable for industrial motor control, portable medical instrumentation, automotive body electronics, and smart home HMI applications requiring stable component supply, long-term lifecycle support, and qualified automotive-grade temperature range (–40 to +85 °C).
Supply support for CY8C5666AXI-LP001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing operations.
This device belongs to the PSoC® 5LP family-designed for highly integrated, low-power embedded control applications where analog/digital configurability, rapid prototyping, and single-chip system consolidation reduce BOM cost and design cycle time.
FAQ
Does CY8C5666AXI-LP001 support USB device mode without an external crystal?
Yes. The part integrates a factory-trimmed internal main oscillator (IMO) with ±2% accuracy at 48 MHz, which meets USB 2.0 Full-Speed specification requirements for device-mode operation. This eliminates the need for an external 48-MHz crystal or oscillator, reducing BOM count and board space. USB suspend/resume timing is maintained using the 32.768-kHz watch crystal oscillator (WCO) for low-power clock recovery.
What is the maximum number of CapSense® electrodes supported on this device?
CY8C5666AXI-LP001 supports up to 62 self-capacitance or mutual-capacitance sensors using its dedicated CapSense® subsystem. Electrode count is limited by available GPIOs and routing resources-not by firmware licensing-and all sensors can be scanned simultaneously or in time-multiplexed sequences using SmartSense™ auto-tuning for robust operation across temperature and humidity variations.
Can the DFB (Digital Filter Block) operate independently of the CPU core?
Yes. The DFB is a fully autonomous 24-bit fixed-point processing unit with its own 64-word coefficient RAM and 64-word data RAM. It executes filter kernels (FIR/IIR) triggered by DMA or timer events without CPU intervention, enabling real-time signal processing such as ECG noise cancellation or motor current harmonic analysis while the Cortex-M3 handles higher-level control tasks.
Is the boost regulator capable of powering the entire chip from a single-cell Li-ion battery?
Yes. The integrated boost regulator accepts input voltages as low as 0.5 V and delivers regulated outputs up to 5.0 V, supporting full-chip operation-including analog peripherals, USB PHY, and I/O-down to ~2.8 V battery voltage. When combined with hibernate mode (300 nA), it enables multi-year operation from a single CR2032 coin cell or primary lithium battery in remote sensor applications.
CY8C5666AXI-LP001 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- PSOC™ 5 CY8C56LP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 62
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 2x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5666AXI-LP001 FAQ
1.How can I place an order for CY8C5666AXI-LP001 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5666AXI-LP001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5666AXI-LP001 reliable?
The price and inventory of CY8C5666AXI-LP001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5666AXI-LP001 is usually 5 days.
3.What payment methods are accepted for CY8C5666AXI-LP001?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5666AXI-LP001 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5666AXI-LP001?
CY8C5666AXI-LP001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5666AXI-LP001 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5666AXI-LP001?
For technical support, including CY8C5666AXI-LP001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5666AXI-LP001 requirements.
6.How does Aetrix verify that CY8C5666AXI-LP001 is sourced from the original manufacturer or authorized distributors?
All CY8C5666AXI-LP001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5666AXI-LP001 meets industry standards.
7.What is the process for return or replacement of CY8C5666AXI-LP001?
All CY8C5666AXI-LP001 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5666AXI-LP001, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5666AXI-LP001 part is unused and in its original packaging.
Return procedure for CY8C5666AXI-LP001:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C5666AXI-LP001 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

