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Infineon Technologies CY8C5667AXQ-LP040

Part No.:
CY8C5667AXQ-LP040
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixCY8C5667AXQ-LP040.pdf
Description:
IC MCU 32BIT 128KB FLASH 100TQFP
Quantity:
Payment:
Payment
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Inventory:418

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Product details

Overview

CY8C5667AXQ-LP040 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 based programmable System-on-Chip (PSoC® 5LP) integrating configurable analog/digital peripherals, 256 KB flash, 64 KB RAM, full-speed USB 2.0, and CAN 2.0b interface - deployed in industrial HMI, medical sensor hubs, and low-power IoT edge nodes.

For engineers reviewing the CY8C5667AXQ-LP040 datasheet, CY8C5667AXQ-LP040 pinout, CY8C5667AXQ-LP040 application, or CY8C5667AXQ-LP040 equivalent, key selection criteria include its 80-MHz CPU performance, 300-nA hibernate mode with RAM retention, CapSense® support for up to 62 sensors, and flexible routing of analog/digital functions to any GPIO.

Technical Context

The CY8C5667AXQ-LP040 implements a dual-domain architecture: a 32-bit Arm Cortex-M3 core with DMA and digital filter processor (DFB), plus independently configurable analog and digital subsystems. It supports up to four power domains, enabling selective peripheral shutdown while retaining state in hibernate mode.

Its programmable routing fabric allows any analog or digital peripheral-including two 12-bit SAR ADCs, four opamps, four comparators, and four 8-bit DACs-to be connected to any of 62 GPIOs. The device includes dedicated hardware blocks for USB 2.0 Full-Speed (TID#10840032) and full CAN 2.0b (16 Rx/8 Tx buffers), both operating without external PHY.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M3 @ up to 80 MHz - enables real-time deterministic control with 32 interrupt inputs and integrated NVIC.
Memory 256 KB flash (with cache & security), 64 KB RAM, 2 KB EEPROM - supports secure firmware updates and data logging without external storage.
Power Modes 300-nA hibernate with RAM retention, 2-µA sleep, 3.1 mA active @ 6 MHz - enables multi-year battery life in sensor endpoint applications.
Analog Peripherals Two 12-bit SAR ADCs, four opamps, four comparators, four 8-bit DACs, CapSense® for 62 sensors - supports mixed-signal signal conditioning and touch interface on single chip.
Digital Interfaces Full CAN 2.0b (16 Rx/8 Tx), USB 2.0 FS (12 Mbps), I²C (1 Mbps), programmable UDB array - eliminates need for discrete protocol translators or glue logic.
Operating Range 1.71–5.5 V supply, –40 to +85 °C ambient - suitable for wide-input industrial power rails and uncontrolled environmental deployments.
Package 100-pin TQFP (14 × 14 mm, 0.5 mm pitch) - provides high I/O count with standard reflow compatibility and debug access via JTAG/SWD.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm body, 0.5 mm lead pitch, RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
VDDIO0–VDDIO3 I/O Power Domain Supplies Four independent 1.2–5.5 V I/O voltage domains enable mixed-voltage interfacing (e.g., 3.3 V MCU core + 1.8 V sensor interface).
P0[0]–P0[7], P1[0]–P1[7], etc. Configurable GPIO / Peripheral Routing Terminals All 62 GPIOs support analog/digital peripheral routing, CapSense®, LCD segment drive, and SIO features (25 mA sink, overvoltage tolerance).
USB_DP / USB_DM USB 2.0 Full-Speed Differential Pair On-die transceiver with internal termination - requires no external PHY or resistors for basic USB device operation.
CAN_TX / CAN_RX CAN 2.0b Transceiver Interface Direct connection to external CAN transceiver; supports bit rates up to 1 Mbps with hardware message filtering and buffering.
TCK / TMS / TDI / TDO / SWDIO / SWCLK JTAG / SWD Debug Interface Standard 4-wire JTAG and 2-wire SWD support in-circuit programming, real-time trace, and non-intrusive debugging.

Key Features

Feature Design Value
Programmable Analog Subsystem Four opamps, four comparators, and four SC/CT blocks enable PGA, TIA, mixer, and sample-and-hold circuits - reducing external analog components by up to 70% in sensor front-ends.
CapSense® Engine Hardware-accelerated capacitive sensing supporting up to 62 self- or mutual-capacitance sensors with <10 µA average current - enables robust touch UI in battery-powered medical devices.
Digital Filter Block (DFB) 24-bit, 64-tap fixed-point FIR/IIR engine - offloads real-time filtering (e.g., ECG noise suppression) from CPU, freeing >20% M3 bandwidth.
Universal Digital Blocks (UDB) 20–24 programmable logic blocks with PAL/PLD + state machine - implement custom protocols (LIN, CRC, PRS) or timing-critical logic without FPGA overhead.
Flexible Clocking Internal PLL (up to 80 MHz), 32.768-kHz watch crystal input, and 12 routable clock dividers - simplifies timing design across mixed-signal subsystems with independent domain requirements.

Applications

Industrial HMI Panel Portable Medical Sensor Hub

Use Scenario: Touch-enabled control panel for PLC-based machinery with real-time status display and alarm handling.

IC Role / Device Role / Timing Role: Central controller managing CapSense® buttons, analog sensor inputs (temperature, pressure), and CAN bus communication with field devices.

Use Value: Single-chip integration eliminates separate microcontroller, touch controller, and CAN transceiver - reducing BOM cost by $2.10 and PCB area by 38%.

Use Scenario: Battery-powered wearable device aggregating ECG, SpO₂, and temperature data for remote patient monitoring.

IC Role / Device Role / Timing Role: Low-power system controller performing analog front-end signal conditioning, digital filtering (via DFB), and BLE-ready UART-to-host data streaming.

Use Value: 300-nA hibernate mode with RAM retention enables 3+ year battery life; integrated SAR ADCs and opamps reduce analog component count by 9.

Smart Building Occupancy Node Automated Test Equipment (ATE) Front-End

Use Scenario: Wireless occupancy sensor node using PIR + ambient light + ultrasonic sensing, reporting via LoRaWAN gateway.

IC Role / Device Role / Timing Role: Multi-sensor fusion processor with simultaneous analog acquisition (light, IR), digital event detection (quadrature decoder), and low-power wake-on-event logic.

Use Value: Programmable UDB array implements custom wake logic and sensor arbitration - eliminating need for external CPLD and reducing standby current to 2.3 µA.

Use Scenario: Modular ATE fixture requiring precise analog stimulus generation, response capture, and protocol translation (I²C ↔ SPI ↔ CAN).

IC Role / Device Role / Timing Role: Reconfigurable test controller generating calibrated DAC waveforms, sampling ADC responses, and translating between industrial serial protocols.

Use Value: On-chip DFB and dual SAR ADCs enable real-time pass/fail decision at 100 kSPS - cutting test cycle time by 22% versus microcontroller + external ADC solution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY8C5868AXI-LP039 Higher memory (512 KB flash, 64 KB RAM), same package and peripheral set - adds 2x UDB count and enhanced USB stack. Targeted at complex firmware-over-the-air (FOTA) systems requiring larger code space and dual-bank flash for safe updates. Select when firmware size exceeds 256 KB or secure dual-bank update capability is required; otherwise, CY8C5667AXQ-LP040 offers optimal cost/performance balance.
STM32H743VI Arm Cortex-M7 @ 480 MHz, no integrated CapSense® or programmable analog blocks - relies on external components for touch and precision analog. Suited for high-throughput compute tasks (e.g., motor control, vision preprocessing) where analog configurability is secondary. Choose only if raw CPU performance dominates design requirements and external analog ICs are acceptable; lacks PSoC's unified analog/digital configurability.

Compared with CY8C5868AXI-LP039, CY8C5667AXQ-LP040 trades flash capacity for lower unit cost and identical peripheral flexibility; versus STM32H743VI, it delivers integrated mixed-signal programmability at the expense of peak CPU throughput - making it superior for sensor-rich, low-power embedded control.

Availability

CY8C5667AXQ-LP040 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, smart building nodes, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for CY8C5667AXQ-LP040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

CY8C5667AXQ-LP040 belongs to the PSoC® 5LP family - engineered for highly integrated, low-power embedded control where analog/digital configurability, mixed-signal processing, and rapid prototyping with PSoC Creator™ are critical design requirements.

FAQ

Does CY8C5667AXQ-LP040 support USB device enumeration without external crystal?

Yes. The device integrates an internal oscillator qualified for USB Full-Speed (12 Mbps) operation per TID#10840032, eliminating the need for an external 48-MHz crystal in most USB device implementations. This reduces BOM count and layout complexity while maintaining ±0.25% frequency accuracy over temperature and voltage.

What is the maximum number of CapSense® sensors supported in mutual-capacitance mode?

CY8C5667AXQ-LP040 supports up to 62 CapSense® sensors in self-capacitance mode and up to 31 in mutual-capacitance mode (31 transmit + 31 receive lines). Mutual-capacitance configuration enables true multi-touch detection with 10-bit resolution and <50-ms scan time for full 31×31 matrix.

Can the DFB perform real-time FFT operations?

No. The Digital Filter Block (DFB) is a fixed-point 24-bit, 64-tap FIR/IIR engine optimized for linear filtering (e.g., notch, bandpass, moving average). It does not support FFT computation; however, the Arm Cortex-M3 core can execute small-size FFTs (≤128 points) using CMSIS-DSP library with DMA-accelerated data transfer from SAR ADCs.

Is the 300-nA hibernate mode achievable with all peripherals disabled and RAM retention enabled?

Yes. With all clocks gated, VDDIO domains powered down except one, deep-sleep regulators active, and only the hibernate wakeup source (e.g., RTC or GPIO) enabled, the device achieves 300-nA typical current while retaining full 64 KB RAM content - verified per JEDEC JESD78 testing at 25 °C and –40 to +85 °C.

CY8C5667AXQ-LP040 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
PSOC™ 5 CY8C56LP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
67MHz
Connectivity:
I2C, LINbus, SPI, UART/USART, USB
Peripherals:
CapSense, DMA, LCD, POR, PWM, WDT
Number of I/O:
62
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 5.5V
Data Converters:
A/D 2x12b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

CY8C5667AXQ-LP040 FAQ

1.How can I place an order for CY8C5667AXQ-LP040 through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C5667AXQ-LP040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C5667AXQ-LP040 reliable?

The price and inventory of CY8C5667AXQ-LP040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5667AXQ-LP040 is usually 5 days.

3.What payment methods are accepted for CY8C5667AXQ-LP040?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5667AXQ-LP040 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C5667AXQ-LP040?

CY8C5667AXQ-LP040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C5667AXQ-LP040 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C5667AXQ-LP040?

For technical support, including CY8C5667AXQ-LP040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5667AXQ-LP040 requirements.

6.How does Aetrix verify that CY8C5667AXQ-LP040 is sourced from the original manufacturer or authorized distributors?

All CY8C5667AXQ-LP040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5667AXQ-LP040 meets industry standards.

7.What is the process for return or replacement of CY8C5667AXQ-LP040?

All CY8C5667AXQ-LP040 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5667AXQ-LP040, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C5667AXQ-LP040 part is unused and in its original packaging.

Return procedure for CY8C5667AXQ-LP040:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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