My Inquiry
My Account
Infineon Technologies CY8C5667LTI-LP009
- Part No.:
- CY8C5667LTI-LP009
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
CY8C5667LTI-LP009.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 68QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,875
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY8C5667LTI-LP009 from Infineon Technologies (formerly Cypress Semiconductor) is a 32-bit Arm® Cortex®-M3 programmable system-on-chip (PSoC® 5LP) with up to 80 MHz operation, 256 KB flash, 64 KB RAM, full CAN 2.0b interface, and integrated CapSense® for capacitive touch sensing. It integrates configurable analog and digital peripherals-including four 16-bit TCPWM blocks, dual SAR ADCs, four opamps, and USB 2.0 Full-Speed-targeting embedded control in industrial HMI, medical sensor nodes, and low-power IoT edge devices.
For engineers reviewing the CY8C5667LTI-LP009 datasheet, CY8C5667LTI-LP009 pinout, CY8C5667LTI-LP009 application, or CY8C5667LTI-LP009 equivalent, key selection criteria include its 68-pin QFN package, 1.71–5.5 V supply range, 300-nA hibernate mode with RAM retention, and support for PSoC Creator™ schematic-based design with over 100 pre-verified components.
Technical Context
The CY8C5667LTI-LP009 implements a tightly coupled mixed-signal architecture where the Arm Cortex-M3 CPU coordinates programmable analog (delta-sigma & SAR ADCs, DACs, opamps, comparators) and digital (UDB array, TCPWM, CAN, USB) subsystems via a flexible routing matrix. Its DSI (Digital System Interconnect) enables dynamic peripheral-to-pin mapping without hardware redesign.
It features a multi-domain power system with six independent voltage domains, a boost regulator (0.5 V input → 5 V output), and three low-power oscillators (1/33/100 kHz), enabling precise power-state orchestration across real-time, sleep, and hibernate modes while maintaining analog accuracy and I/O retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit Arm Cortex-M3 @ up to 80 MHz - delivers deterministic real-time control with 32 interrupt inputs and DMA acceleration. |
| Memory | 256 KB flash + 64 KB RAM - supports secure firmware updates, ECC-protected code execution, and large sensor buffer storage. |
| Analog Peripherals | Two 12-bit SAR ADCs + 8–12-bit delta-sigma ADC + four opamps - enables simultaneous high-speed and high-resolution signal acquisition in mixed-signal systems. |
| Digital Interfaces | Full CAN 2.0b (16 Rx/8 Tx buffers) + USB 2.0 FS (12 Mbps) + I²C (1 Mbps) - provides robust fieldbus and host connectivity without external transceivers. |
| Power Modes | 300 nA hibernate with RAM retention - allows wake-on-capacitive-touch or CAN message while preserving context across extended battery life. |
| I/O Flexibility | 62 GPIOs with full analog/digital peripheral routing - eliminates fixed-function pin constraints and reduces PCB layer count in compact designs. |
| Package | 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch) - balances thermal performance, board space efficiency, and manufacturability for industrial-grade SMT assembly. |
Pinout & Package
Package: 68-pin QFN (10 mm × 10 mm, 0.5 mm pitch), thermally enhanced with exposed pad. RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0–VDDIO3 | I/O power domains | Four independent 1.2–5.5 V supply rails enable mixed-voltage interfacing (e.g., 3.3 V logic + 1.8 V sensor interface). |
| P0[0]–P0[7], P1[0]–P1[7], etc. | Configurable GPIO | Each pin supports analog input, digital I/O, CapSense®, USBIO, or dedicated peripheral functions (e.g., CAN_TX/RX, USB_DP/DM) via routing. |
| XRES | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external push-button or supervisor IC assertion. |
| TCK/TMS/TDI/TDO | JTAG debug interface | 4-wire boundary scan and programming path; also supports 2-wire SWD for space-constrained layouts. |
| USB_DP/USB_DM | USB 2.0 Full-Speed differential pair | On-die transceiver with internal termination - requires only series resistors and ESD protection per USB-IF compliance. |
| CAN_TX/CAN_RX | Controller Area Network physical layer interface | Dedicated pins with internal CAN transceiver biasing - connects directly to external CAN bus via single discrete resistor network. |
Key Features
| Feature | Design Value |
|---|---|
| CapSense® with up to 62 sensors | Enables robust, noise-immune capacitive touch interfaces (buttons, sliders, proximity) without external ICs or shielding. |
| Programmable analog blocks (SC/CT) | Configurable as PGA, TIA, mixer, or sample-and-hold - replaces discrete opamp circuits for sensor front-end conditioning. |
| Digital Filter Block (DFB) | 24-bit, 64-tap fixed-point FIR/IIR filtering - offloads real-time signal processing (e.g., ECG noise reduction) from CPU. |
| UDB array (20–24 blocks) | Reconfigurable logic fabric supporting UART, SPI, LIN, PRS, CRC, quadrature decoding - eliminates need for companion logic ICs. |
| Bootloader over USB/I²C/SPI/UART | Field-upgradable firmware without JTAG programmer - critical for deployed medical or industrial equipment maintenance. |
Applications
| Industrial HMI Panel | Portable Medical Sensor Node |
|---|---|
Use Scenario: Touch-enabled control panel for PLC interface with LED status feedback and CAN bus integration. IC Role / Device Role / Timing Role: Central controller managing CapSense® buttons, driving 4×16-segment LCD, and relaying commands via CAN 2.0b to motor drives. Use Value: Single-chip integration eliminates separate touch controller, display driver, and CAN transceiver - reducing BOM cost by >35% and PCB area by 40%. | Use Scenario: Battery-powered wearable ECG monitor with analog front-end, real-time filtering, and Bluetooth LE data streaming. IC Role / Device Role / Timing Role: Signal acquisition (dual SAR ADC), digital filtering (DFB), low-power state management (300-nA hibernate), and USB/UART firmware update interface. Use Value: On-chip DFB performs real-time baseline wander correction, enabling clinical-grade waveform fidelity without external DSP. |
| Smart Building Occupancy Sensor | Automated Test Equipment (ATE) Fixture |
Use Scenario: PIR + ambient light + temperature sensor fusion node with wireless backhaul and local decision logic. IC Role / Device Role / Timing Role: Multi-sensor aggregator using delta-sigma ADC for light, SAR ADC for temp, and GPIO-triggered PIR wake-up with CapSense® calibration. Use Value: Configurable analog routing allows shared reference and bias networks across sensors - improving measurement correlation and reducing component count. | Use Scenario: Production-line fixture verifying analog/digital functionality of automotive ECUs under thermal stress. IC Role / Device Role / Timing Role: Precision stimulus generator (DAC + opamp) and response analyzer (comparator + SAR ADC) synchronized via internal clock tree. Use Value: On-chip programmable gain amplifier and 1.024 V ±0.1% reference enable sub-1% absolute accuracy in production test without external calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar programmable SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY8C5868LTI-LP039 | Higher memory (512 KB flash, 64 KB RAM), same 68-pin QFN package, identical peripheral set. | Targeted at firmware-rich applications requiring larger bootloader partitions or dual-bank OTA updates. | Select when firmware complexity exceeds 256 KB or secure boot with rollback protection is required. |
| STM32F412ZGT6 | ARM Cortex-M4F core, no integrated CapSense® or programmable analog blocks; requires external touch controller and signal conditioning. | Suitable for pure digital control with floating-point math, but lacks native mixed-signal flexibility. | Choose only if existing STM32 toolchain familiarity outweighs loss of analog configurability and CapSense® integration. |
Compared with CY8C5667LTI-LP009, the CY8C5868LTI-LP039 offers scalable memory headroom within identical footprint and feature set, while the STM32F412ZGT6 trades PSoC's analog/digital reconfigurability for higher CPU throughput and ecosystem maturity - making it less suitable for sensor-fusion or touch-centric designs.
Availability
CY8C5667LTI-LP009 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, smart building occupancy sensors, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for CY8C5667LTI-LP009 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions.
The CY8C56LP family belongs to Infineon's PSoC® programmable SoC product line, designed specifically for embedded systems requiring seamless integration of analog sensing, digital control, and human-machine interaction in resource-constrained environments.
FAQ
Does CY8C5667LTI-LP009 support USB device enumeration without external crystal?
Yes. The device integrates an internal oscillator qualified for USB 2.0 Full-Speed (12 Mbps) operation, certified under TID#10840032. No external crystal is required for basic USB device functionality, though a 32.768-kHz watch crystal may be added for precise RTC timing.
What is the maximum operating temperature for CY8C5667LTI-LP009 in industrial applications?
The CY8C5667LTI-LP009 is rated for –40 °C to +85 °C ambient temperature operation. Its thermal design supports continuous operation at full 80 MHz CPU speed within this range, with validated performance across all analog peripherals including SAR ADCs and opamps.
Can CapSense® operate reliably in noisy industrial environments?
Yes. CapSense® on CY8C5667LTI-LP009 includes shield-driven and mutual-capacitance modes, automatic noise rejection algorithms, and hardware-accelerated baseline tracking. It maintains >99% touch detection accuracy at 10 Vpp conducted noise (per IEC 61000-4-3) when layout guidelines are followed.
Is there hardware support for secure firmware updates?
Yes. The device includes flash security features (row-level protection, read-out prevention), hardware AES-256 encryption engine, and a bootloader that supports authenticated firmware images via SHA-256 signature verification - enabling secure over-the-air or USB-based updates.
CY8C5667LTI-LP009 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- PSOC™ 5 CY8C56LP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 67MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- CapSense, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 5.5V
- Data Converters:
- A/D 2x12b; D/A 4x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
CY8C5667LTI-LP009 FAQ
1.How can I place an order for CY8C5667LTI-LP009 through Aetrix?
Please submit a Request for Quotation (RFQ) for CY8C5667LTI-LP009 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY8C5667LTI-LP009 reliable?
The price and inventory of CY8C5667LTI-LP009 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C5667LTI-LP009 is usually 5 days.
3.What payment methods are accepted for CY8C5667LTI-LP009?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C5667LTI-LP009 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY8C5667LTI-LP009?
CY8C5667LTI-LP009 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY8C5667LTI-LP009 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY8C5667LTI-LP009?
For technical support, including CY8C5667LTI-LP009 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C5667LTI-LP009 requirements.
6.How does Aetrix verify that CY8C5667LTI-LP009 is sourced from the original manufacturer or authorized distributors?
All CY8C5667LTI-LP009 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C5667LTI-LP009 meets industry standards.
7.What is the process for return or replacement of CY8C5667LTI-LP009?
All CY8C5667LTI-LP009 units undergo pre-shipment inspection (PSI). If there is an issue with CY8C5667LTI-LP009, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY8C5667LTI-LP009 part is unused and in its original packaging.
Return procedure for CY8C5667LTI-LP009:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY8C5667LTI-LP009 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
