Infineon Technologies CY8C5668LTI-LP014

Overview

CY8C5668LTI-LP014 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M3 programmable system-on-chip (PSoC® 5LP) with up to 256 KB flash, 64 KB RAM, 80 MHz operation, full CAN 2.0b interface, and integrated CapSense® for capacitive touch sensing. It integrates configurable analog peripherals (dual 12-bit SAR ADCs, four opamps, four comparators), digital logic (24 UDBs), USB 2.0 Full-Speed, and programmable routing across 72 I/O pins. Used in industrial HMI, medical sensor hubs, and low-power embedded control systems requiring mixed-signal integration.

For engineers reviewing the CY8C5668LTI-LP014 datasheet, CY8C5668LTI-LP014 pinout, CY8C5668LTI-LP014 application, or CY8C5668LTI-LP014 equivalent, key selection criteria include its 80-MHz Cortex-M3 core, dual SAR ADC support, on-chip CapSense® engine, 300-nA hibernate mode with RAM retention, and full CAN 2.0b with 16 Rx/8 Tx buffers - all in a 100-pin TQFP package.

Technical Context

The CY8C5668LTI-LP014 implements a tightly coupled mixed-signal architecture where the Arm Cortex-M3 CPU directly controls programmable analog blocks (e.g., PGA, TIA, delta-sigma and SAR ADCs) and digital logic via the Universal Digital Block (UDB) array. Its DSI (Digital System Interconnect) enables dynamic signal routing between any peripheral and any GPIO, supporting concurrent analog acquisition and digital processing without external components.

It features three independent clock domains: a high-accuracy 3–74 MHz internal oscillator (±1% at 3 MHz), a 4–25 MHz external crystal input, and an internal PLL generating up to 80 MHz. Power management includes six configurable voltage domains, boost regulator (0.5 V → 5 V), and three ultra-low-power modes: 2 µA sleep and 300 nA hibernate with full RAM retention.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), 14 mm × 14 mm body, 0.5 mm lead pitch, exposed thermal pad (EP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable SoC applications.

Compared with STM32F303VET6 and MAX32660, CY8C5668LTI-LP014 uniquely combines full CAN 2.0b, USB 2.0 FS, hardware CapSense®, and programmable analog/digital blocks in one die - enabling single-chip solutions for mixed-protocol, touch-enabled industrial and medical edge nodes without external signal conditioning or interface ICs.

Availability

CY8C5668LTI-LP014 is available at Aetrix Electronics and suitable for industrial HMI, medical sensor aggregation, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and qualified production traceability.

Supply support for CY8C5668LTI-LP014 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive microcontrollers, and secure connectivity solutions.

CY8C5668LTI-LP014 belongs to the PSoC® 5LP family - designed for highly integrated, low-power embedded systems requiring concurrent analog sensing, digital control, and multi-protocol communication in space-constrained applications.

FAQ

Does CY8C5668LTI-LP014 support USB device enumeration without external crystal?

Yes. The device includes an internal oscillator certified for USB 2.0 Full-Speed (12 Mbps) operation per TID#10840032, eliminating the need for an external 48 MHz crystal. This oscillator maintains ±0.25% accuracy across voltage and temperature, meeting USB specification jitter requirements for reliable host enumeration and data transfer.

What is the maximum resolution and sampling rate achievable with the SAR ADCs?

The CY8C5668LTI-LP014 integrates two independent 12-bit successive approximation ADCs, each capable of 1 million samples per second (1 MSPS) with programmable input ranges (0–VREF, 0–2×VREF). Simultaneous sampling is supported, and conversion results are DMA-accessible to minimize CPU overhead during high-speed acquisition.

Can CapSense® operate reliably in noisy industrial environments?

Yes. The hardware CapSense® engine includes spread-spectrum modulation, shield driver support, adjacent-key suppression, and automatic baseline tracking. Benchmarked performance shows >80 Vrms common-mode noise rejection and immunity to 10 kV ESD pulses - validated per IEC 61000-4-2 and -4-4 standards in industrial-grade layouts.

Is the 300-nA hibernate mode functional with full 64 KB RAM retention?

Yes. In hibernate mode, the device retains full contents of all 64 KB SRAM while drawing only 300 nA typical from VDDD. Wake-up sources include GPIO interrupts, RTC alarm, and CapSense® button press - with sub-10 µs wake latency. This mode is characterized across –40°C to +85°C ambient temperature.